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7622801 |
Thin planar semiconductor device
A thin, planar semiconductor device having electrodes on both surfaces is disclosed. This semiconductor device is provided with an IC chip and a wiring layer having one side that is electrically...
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7622733 |
Semiconductor structure with a plastic housing and separable carrier plate
A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined...
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7622329 |
Method for fabricating core substrate using paste bumps
A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps...
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7618844 |
Method of packaging and interconnection of integrated circuits
A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the...
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7615874 |
Electronic component module
An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular....
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7615866 |
Contact surrounded by passivation and polymide and method therefor
A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer...
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7615865 |
Standoff height improvement for bumping technology using solder resist
A system to support a die includes a substrate. A solder resist is disposed over the substrate. A first solder bump is disposed in the solder resist to provide electrical connectivity through the...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7608921 |
Multi-layer semiconductor package
A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on top of the die. The bottom side of the...
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7608789 |
Component arrangement provided with a carrier substrate
A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which...
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7606042 |
High capacity thin module system and method
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
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7605459 |
Coreless substrate and manufacturing thereof
An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper...
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7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module
A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7602062 |
Package substrate with dual material build-up layers
Multi-layered, organic build-up semiconductor package substrates have build-up layers with layers of both fibrous organic dielectric material and non-fibrous organic dielectric material....
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7602060 |
Heat spreader in a flip chip package
A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface...
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7602056 |
On-die termination method for multi-chip packages
An on-die termination method to support a multi-chip package routing topology is described. The on die termination method may increase the surface area on the substrate such that larger size die or...
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7598617 |
Stack package utilizing through vias and re-distribution lines
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
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7598613 |
Flip chip bonding structure
A semiconductor device is provided with: a solid device having a connection surface formed with a connection electrode projected therefrom; a semiconductor chip which has a functional surface...
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7598612 |
Semiconductor device and manufacturing method thereof
A semiconductor device including a semiconductor substrate containing a plurality of electrode pads and a passivation film with an opening that exposes a central area of each of the electrode pads,...
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7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same
A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a...
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7592704 |
Etched interposer for integrated circuit devices
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected...
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7592700 |
Semiconductor chip and method of manufacturing semiconductor chip
A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an...
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7592244 |
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device includes the step of forming a first insulating section with a protruding section on a semiconductor substrate, the step of forming a first...
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7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
Methods for creating redistribution layers for only selected dice, such as known good dice, to form relatively thin semiconductor component assemblies and packages, and the assemblies and packages...
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7589400 |
Inverter and vehicle drive unit using the same
The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first...
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7586199 |
Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types
Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging...
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7582972 |
Semiconductor device and fabrication method thereof
A semiconductor device includes a semiconductor substrate with circuit elements and electrode pads formed on one surface. This surface is covered by a dielectric layer with openings above the...
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7582967 |
Semiconductor device, electronic module, and method of manufacturing electronic module
A semiconductor device including: a semiconductor chip having an electrode; a plurality of resin protrusions formed on a surface of the semiconductor chip on which the electrode is formed, heights...
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7582965 |
Electronic device and method for bonding an electronic device
An electronic device ( 1 ) has a base plate ( 2 ) and an electronics housing ( 3 ) connected thereto, with a bonding contact terminal ( 5 ). The latter is supported relative to the base plate ( 2 )...
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7582956 |
Flip chip in leaded molded package and method of manufacture thereof
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when...
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7579692 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad...
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7579683 |
Memory interface optimized for stacked configurations
A semiconductor die includes a plurality of interconnection pads for connecting with a memory die. The two dies are packaged together in a stacked manner. The plurality of pads are disposed so that...
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7579681 |
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
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7579679 |
Chipcard with contact areas and method for producing contact areas
A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another...
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7576424 |
Semiconductor device
A semiconductor device including: a semiconductor substrate on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the semiconductor substrate, arranged along a...
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7576004 |
Semiconductor chip and method of manufacturing semiconductor chip
A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an...
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7575994 |
Semiconductor device and manufacturing method of the same
The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film...
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7569939 |
Self alignment features for an electronic assembly
Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the...
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7569935 |
Pillar-to-pillar flip-chip assembly
A pillar-to-pillar flip-chip assembly primarily comprises a substrate, a chip disposed on the substrate, a plurality of first copper pillars on the bonding pads of the chip, a plurality of second...
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7569934 |
Copper interconnect
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a...
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7566970 |
Stacked bump structure and manufacturing method thereof
A method for manufacturing a stacked bump structure including the following steps is provided. First, a substrate having multiple bonding pads disposed on a surface thereof is provided. Next, a...
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7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate
To miniaturize a semiconductor device, a package substrate is provided having terminals formed on the main surface, lands formed on the back surface, through holes formed by laser beam machining...
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7566960 |
Interposing structure
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
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7564131 |
Semiconductor package and method of making a semiconductor package
Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on...
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7564130 |
Power micro surface-mount device package
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is...
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7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
A semiconductor device, including a semiconductor chip having electrodes, a substrate having an interconnect pattern, and an adhesive, the adhesive having a first portion and a second portion, the...
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7560808 |
Chip scale power LDMOS device
A semiconductor device includes at least one macro-cell device, the macro-cell device comprising a plurality of LDMOS devices. A first conductive layer is formed over the substrate, the first...
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7560805 |
Semiconductor package and method of manufacturing the same
A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses...
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7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members,...
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