Matches 1 - 50 out of 183 1 2 3 4 >
Match Document Document Title
7626264 Substrate for device bonding and method for manufacturing same  
A substrate for device bonding is provided, which enables bonding of a device with high bond strength to an Au electrode formed on a substrate such as aluminum nitride by soldering the device at a...
7615864 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus  
A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor...
7605683 Monolithic electronic component  
In a monolithic electronic component in which a resistive element is incorporated by forming a resistor film on a terminal electrode, a plating film can be formed on the terminal electrode having...
7535107 Tiled construction of layered materials  
A method is described for combining the diverse strengths of two materials in a tiled film construction. The first material provides a foundation of intersecting grid lines on a substrate and the...
7531897 Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby  
A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a...
7522405 High current electrical switch and method  
A method and system are disclosed for a high current electrical switch. The switch may be suitable for switching, rectifying or blocking direct current in the range of one to a thousand amperes per...
7518242 Semiconductor testing device  
A semiconductor device has a bonding pad configured to be bonded to a bonding member, a test pad configured to contact with a test probe at a test, and an internal circuit electrically connected to...
7485976 Tamper resistant packaging and approach  
A tamper-resistant packaging approach protects non-volatile memory. According to an example embodiment of the present invention, an array of magnetic memory elements ( 130 - 132 ) in an integrated...
7485958 Device with beam structure, and semiconductor device  
A device with a beam structure includes a substrate, an anchor and a cavity which are provided on and over the substrate, respectively, and a beam structure which is provided on the anchor and over...
7482692 Tungsten plug structure of semiconductor device and method for forming the same  
A tungsten plug structure of a semiconductor device wherein a method for forming the same is performed at least twice to form a tungsten plug having a low aspect ratio, thereby obtaining an overlap...
7468545 Post passivation structure for a semiconductor device and packaging process for same  
A post passivation rerouting support structure comprises a relatively thin support layer above the passivation layer to support the RDL, and a relatively thick support layer for fine pitch...
7459789 Bonding method of flexible film and display bonded thereby  
A bonding method of a flexible film is provided, which includes: positioning an anisotropic conductive film on a plurality of first signal lines formed on the flexible film to be bonded to a thin...
7443019 Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same  
The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from...
7427532 Method of manufacturing a device having a contacting structure  
According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface...
7414313 Polymeric conductor donor and transfer method  
The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component...
7405419 Unidirectionally conductive materials for interconnection  
A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie...
7375032 Semiconductor substrate thinning method for manufacturing thinned die  
In a method according to the present invention, a substrate thinning process is performed on a bumped substrate prior to the ultimate solder reflow process to heal bump defects caused by the...
7371598 Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof  
The invention includes a first step for forming a first conductive layer composed of a high melting point metal to be in contact with an insulating layer; and a second step for forming a second...
7368326 Methods and apparatus to reduce growth formations on plated conductive leads  
A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer...
7361976 Data carrier with a module with a reinforcement strip  
In a lead-frame configuration ( 60 ), a module ( 70 ) and a data carrier ( 72 ), two connecting plates ( 12, 13 ) of the module ( 70 ), which are each intended for connection to a connecting...
7358618 Semiconductor device and manufacturing method thereof  
A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on...
7358607 Substrates and systems to minimize signal path discontinuities  
Arrangements are used for minimizing signal path discontinuities.
7344968 Semiconductor chip having pads with plural junctions for different assembly methods  
Development efficiency and mass production efficiency of a semiconductor chip (LSI) is improved, whereby the LSI on which an integrated circuit is formed has plural pad parts connecting the...
7285845 Lead frame for semiconductor package  
A lead frame for a semiconductor package having not only high molding resin adhesiveness and a low delamination problem under a severe moisture absorbing atmosphere but also high interface...
7276801 Designs and methods for conductive bumps  
Methods, techniques, and structures relating to die packaging. In one exemplary implementation, a die package interconnect structure includes a semiconductor substrate and a first conducting layer...
7271482 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods  
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a...
7271498 Bump electrodes having multiple under ball metallurgy (UBM) layers  
The present invention provides a wafer structure having a plurality of bonding pad, an adhesion layer, a barrier layer, a wetting layer, a plurality of bump, a first passivation layer and a second...
7250673 Signal isolation in a package substrate  
Signal traces are patterned on a top surface of a substrate. A ground trace is patterned on the top surface of the substrate for at least one pair of the signal traces. A die paddle is patterned on...
7247947 Semiconductor device comprising a plurality of semiconductor constructs  
A semiconductor device includes a first semiconductor construct provided on a base plate and having a semiconductor substrate and external connection electrodes. An insulating layer is provided on...
7247943 Integrated circuit with at least one bump  
In an integrated circuit ( 1 ) having a substrate ( 3 ) and having a signal-processing circuit ( 4 ) which is produced at a surface ( 8 ) of the substrate ( 3 ), there is provided on the substrate...
7176568 Semiconductor device and its manufacturing method, electronic module, and electronic unit  
A semiconductor device is provided having: a board; a metallization pattern formed on the first face of the board; a first layer formed so as to not cover the first portion of the metallization...
7176487 Semiconductor integrated circuit  
To provide a test technology capable of reducing a package size by reducing a number of terminals (pins) in a semiconductor integrated circuit of SIP or the like constituted by mounting a plurality...
7170169 LGA socket with EMI protection  
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise...
7102229 Capacitor containing high purity tantalum  
Described is a method for producing high purity tantalum, the high purity tantalum so produced and sputtering targets of high purity tantalum. The method involves purifying starting materials...
7091613 Elongated bonding pad for wire bonding and sort probing  
An elongated bonding pad comprises two areas, a bonding area and an elongated probing area. The bonding area is located on the edge of an integrated circuit device for wire bonding. The elongated...
7078796 Corrosion-resistant copper bond pad and integrated device  
The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An...
7067353 Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer  
A method for manufacturing a semiconductor package, the method including the steps of attaching a bottom surface of a semiconductor wafer to a first supporting member, forming a through hole in the...
7067918 Wiring board  
A wiring board comprising: a wiring laminate portion including dielectric layers containing polymeric material and conductor layers laminated alternately so as to form a first main surface out of...
7064015 Semiconductor device and manufacturing method of the same  
An interposer has a connection electrode formed on the insulating substrate surface, and a solder bump connects with the connection electrode. The insulating substrate surface is made rough where...
7060525 Semiconductive chip having a bond pad located on an active device  
A semiconductive chip having at least one active device, and at least one bond pad located on said active device. The bond pad has at least one deformable member, and the deformable member is...
7030446 Semiconductor switching devices  
A compact switching device for applications in integrated circuits is disclosed. The switching device comprises a P-type conductive channel and an N-type conductive channel, both formed on a...
7023088 Semiconductor package, semiconductor device and electronic device  
An insulating layer ( 3 ) having an opening portion ( 3 a ) at a position conformable to an electrode pad ( 2 ) is formed. Next, a resin projection portion ( 4 ) is formed on the insulating layer (...
7023067 Bond pad design  
A bonding pad for an integrated circuit, where the bonding pad overlies a fragile dielectric layer. A lower metal layer stack overlies the fragile dielectric layer, and a hard dielectric layer...
7019396 Electronic chip component and method for manufacturing electronic chip component  
An electronic chip component includes a component body and a plurality of terminal electrodes disposed on outer surfaces of the component body. At least one of the terminal electrodes includes a...
7015065 Manufacturing method of ball grid array package  
A manufacturing method of a ball grid array package mainly comprises providing a carrier unit with an upper surface and a lower surface, mounting a plurality of solder balls on the lower surface of...
6998713 Wiring board and method for producing same  
The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring comprising a Cr or Ti...
6992386 Semiconductor device and a method of manufacturing the same  
A semiconductor device to prevent breakage of a semiconductor chip is disclosed. The device incorporates a sealing member, a semiconductor chip and having a source and gate electrodes on a first...
6956288 Semiconductor device with folded film substrate and display device using the same  
A semiconductor device to be mounted on an external electronic device includes a film substrate on which wiring electrodes are formed, the wiring electrodes being partially covered with a covering...
6946725 Electronic device having microscopically small contact areas and methods for producing the electronic device  
An electronic device and a method for producing the electronic device which has at least one microscopically small contact area for an electronic circuit having interconnects that are on a surface...
6943455 Packaging system for power supplies  
A packaging system for a high current, low voltage power supply. The power supply uses two bare die field effect transistors whose input and output electrodes are solder attached to low resistance,...
Matches 1 - 50 out of 183 1 2 3 4 >