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7622796 Semiconductor package having a bridged plate interconnection  
A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, and a semiconductor die coupled to the leadframe, the semiconductor die having a...
7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink  
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a...
7576420 Semiconductor integrated circuit device having reduced terminals and I/O area  
In a semiconductor integrated circuit device including a semiconductor integrated circuit board having a mask ROM area and an internal bus and a programmable ROM which is mounted on the...
7560805 Semiconductor package and method of manufacturing the same  
A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses...
7550855 Vertically spaced plural microsprings  
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
7528485 Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device  
A semiconductor device which uses a semiconductor element having main current input/output electrodes, one and the other of which are extended up to a one surface and a remaining surface of a...
7504723 Electrical connection pattern in an electronic panel  
A connector layout for arranging a plurality of parallel electrical connectors between two electronic devices. In one device, each connector has a strip connected to a bump pad. The bump pad is...
7498661 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus  
A manufacturing method for a semiconductor device includes a hole portion formation step for forming hole portions whose entire width is substantially identical to the width of the opening portion...
7491894 Hybrid integrated circuit device  
A hybrid integrated circuit device of the present invention includes: a circuit board having a front surface subjected to an insulation process; a conductive pattern formed on the front surface of...
7489036 Thin-film device  
A thin-film device incorporates: a substrate; an insulating layer, a lower conductor layer, a dielectric film, an insulating layer, an upper conductor layer and a protection film that are stacked...
7485958 Device with beam structure, and semiconductor device  
A device with a beam structure includes a substrate, an anchor and a cavity which are provided on and over the substrate, respectively, and a beam structure which is provided on the anchor and over...
7473996 Signal transfer film, display apparatus having the same and method of manufacturing the same  
A signal transfer film includes a base film, a lead line formed on the base film and a passivation layer protecting the lead line. The passivation layer includes a nonlinear edge portion formed at...
7439619 Electronic package structure and the packaging process thereof  
The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip...
7439612 Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector  
In certain embodiments, a leadframe structure for forming one or more integrated circuit packages includes a number of adjacent substantially parallel lead bars adapted to receive a die associated...
7432594 Semiconductor chip, electrically connections therefor  
A semiconductor device has a semiconductor chip including first and second surfaces opposed to each other in a thickness direction of the semiconductor chip, wherein the first and second surfaces...
7425470 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7414301 Printed circuit board with soldering lands  
The present invention provides a printed circuit board having an area of non-resist portion, where each non-resist portion expands gradually toward the back end of a land array in the dipping...
7408244 Semiconductor package and stack arrangement thereof  
A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a...
7405419 Unidirectionally conductive materials for interconnection  
A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie...
7378616 Heating apparatus and method for semiconductor devices  
A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the...
7375032 Semiconductor substrate thinning method for manufacturing thinned die  
In a method according to the present invention, a substrate thinning process is performed on a bumped substrate prior to the ultimate solder reflow process to heal bump defects caused by the...
7372139 Semiconductor chip package  
A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for...
7368818 Methods of making microelectronic assemblies including compliant interfaces  
An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said...
7368326 Methods and apparatus to reduce growth formations on plated conductive leads  
A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer...
7361976 Data carrier with a module with a reinforcement strip  
In a lead-frame configuration ( 60 ), a module ( 70 ) and a data carrier ( 72 ), two connecting plates ( 12, 13 ) of the module ( 70 ), which are each intended for connection to a connecting...
7358607 Substrates and systems to minimize signal path discontinuities  
Arrangements are used for minimizing signal path discontinuities.
7348659 Semiconductor device and method of manufacturing thereof  
A semiconductor chip is mounted on a tab, leads alternately arranged around the tab are electrically connected to electrodes of the semiconductor chip via bonding wires, and encapsulating resin...
7339261 Semiconductor device  
A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing...
7332803 Circuit device  
A circuit device is provided comprising leads and electrical circuitry. The circuit device has a first semiconductor element, a second semiconductor element, first leads electrically connected to...
7329597 Semiconductor chip and tab package having the same  
A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes...
7323778 Semiconductor device with improved design freedom of external terminal  
A semiconductor device comprises: a semiconductor chip; an extension portion formed in contact with the side surfaces so as to surround the semiconductor chip; an insulating film formed on a...
7323774 Integrated circuit package system with pedestal structure  
An integrated circuit package system includes providing a substrate having a bond finger thereon and forming a pedestal on a portion of the bond finger. A first die is mounted on the substrate and...
7279784 Semiconductor package  
A semiconductor package mainly includes a semiconductor chip and a plurality of L-shaped leads arranged at the periphery of the semiconductor chip. Each of the L-shaped leads has an inner lead...
7279356 Depopulation of a ball grid array to allow via placement  
The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid...
7271481 Microelectronic component and assembly having leads with offset portions  
A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a...
7271472 Circuit board and method for producing a circuit board  
A circuit board comprises a dielectric layer, a net of first power supply lines for providing a first reference voltage plane and a net of second power supply lines for providing a second reference...
7268439 Semiconductor device having resin-sealed area on circuit board thereof  
A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also...
7266888 Method for fabricating a warpage-preventive circuit board  
A and method for fabricating a warpage-preventive circuit board is provided, wherein a plurality of conductive traces are formed on a surface of an electrically-insulative core layer, and a...
7253507 Semiconductor device  
A semiconductor device comprises a semiconductor element and a conductive member. The semiconductor element has a semiconductor substrate having first and second major surfaces; a semiconductor...
7247944 Connector assembly  
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die...
7247936 Tape circuit substrate having wavy beam leads and semiconductor chip package using the same  
A semiconductor chip package includes an IC chip and a tape circuit substrate. The tape circuit substrate has a base film and a plurality of beam leads formed on the base film. One end portion of...
7239009 Lead frame and semiconductor device having the same as well as method of resin-molding the same  
A lead frame structure includes: at least a die pad for mounting a semiconductor chip thereon; a plurality of suspension members mechanically connected with the die pad; and a plurality of...
7238962 Semiconductor chip with test pads and tape carrier package using the same  
A semiconductor chip with test pads and a tape carrier package using the same are provided. The tape carrier package comprises a semiconductor chip. The semiconductor chip has an active surface and...
7227198 Half-bridge package  
A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The...
7205673 Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing  
A bond pad structure which includes an aluminum bond pad which include one or more dopants that effectively control the growth of IMC to a nominal level in spite of high tensile stresses in the...
7176568 Semiconductor device and its manufacturing method, electronic module, and electronic unit  
A semiconductor device is provided having: a board; a metallization pattern formed on the first face of the board; a first layer formed so as to not cover the first portion of the metallization...
7176487 Semiconductor integrated circuit  
To provide a test technology capable of reducing a package size by reducing a number of terminals (pins) in a semiconductor integrated circuit of SIP or the like constituted by mounting a plurality...
7170169 LGA socket with EMI protection  
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise...
7157790 Single die stitch bonding  
An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are...
7154116 Rewiring substrate strip with a number of semiconductor component positions  
A rewiring substrate strip with a number of semiconductor component positions and semiconductor components, which are arranged in rows and columns on the rewiring substrate strip also includes are...
Matches 1 - 50 out of 356 1 2 3 4 5 6 7 8 >