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9041188 Axial semiconductor package  
An axially-mountable device includes a semiconductor chip comprising lower and upper electrical contacts. A lower die pad is electrically and mechanically connected to the lower electrical contact...
9030008 Adhesion promoting composition for metal leadframes  
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an...
9006857 Platform comprising an infrared sensor  
An IR sensor includes a suspended micro-platform having a support layer and a device layer disposed thereon. IR absorbers are disposed in or on the device layer. IR radiation received by the IR...
9006886 Light emitting device package and lighting system including the same  
A light emitting device package is disclosed. The light emitting device package includes a body, first and second lead frames disposed on the body, and a light emitting device connected to the...
9000583 Multiple die in a face down package  
A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and...
8994158 Semiconductor packages having lead frames  
Semiconductor packages having lead frames include a lead frame, which supports a semiconductor chip and is electrically connected to the semiconductor chip by bonding wires, and a molding layer...
8975762 Semiconductor device  
A semiconductor device includes a substantially rectangular semiconductor chip having an obverse surface, a first long side, a second long side opposite the first long side, a first short side and...
8970032 Chip module and method for fabricating a chip module  
The chip module includes a semiconductor chip having a first contact element on a first main face and a second contact element on a second main face. The semiconductor chip is arranged on a corner...
8952528 Semiconductor package and fabrication method thereof  
A semiconductor package is provided. The semiconductor package includes a semiconductor chip having opposite first and second surfaces; an RDL structure formed on the first surface of the...
8946763 Semiconductor light-emitting device  
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame....
8907475 Pb-free solder-connected structure  
Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in...
8901754 Semiconductor device and manufacturing method thereof  
A semiconductor device comprises a semiconductor chip having a plurality of electrode pads; an insulation layer having one or more apertures which expose at least a part of the plurality of...
8900929 Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation  
A semiconductor device has a semiconductor die with an encapsulant deposited over the semiconductor die. A first insulating layer having high tensile strength and elongation is formed over the...
8884343 System in package and method for manufacturing the same  
A system in package and a method for manufacturing the same is provided. The system in package comprises a laminate body having a substrate arranged inside a laminate body. A semiconductor die is...
8872340 Substrate for semiconductor package which can prevent the snapping of a circuit trace despite physical deformation of a semiconductor package and semiconductor package having the same  
A substrate for a semiconductor package includes: a first dielectric having a first surface and a second surface which faces away from the first surface and possesses waveform shaped portions, and...
8866284 Semiconductor device comprising an extended semiconductor chip having an extension  
A semiconductor device includes a first extended semiconductor chip including a first semiconductor chip and an extension extending outwardly from a side surface of the first semiconductor chip....
8836136 Package-on-package assembly with wire bond vias  
A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from...
8836106 Semiconductor device  
In a QFN that includes a die pad, a semiconductor chip mounted on the die pad, a plurality of leads arranged around the semiconductor chip, a plurality of wires that electrically connect the...
8829669 Semiconductor device  
A semiconductor device configured to enable efficient cooling of an element and downsizing of the device. The semiconductor device including an element unit connected to a surface of a cooler. A...
8823114 Sensor device having electrode draw-out portions through side of substrate  
Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing...
8810030 MEMS device with stress isolation and method of fabrication  
A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26)...
8809182 Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining  
A controlled collapse chip connection (C4) method and integrated circuit structure for lead (Pb)-free solder balls with stress relief to the underlying insulating layers of the integrated circuit...
8804340 Power semiconductor package with double-sided cooling  
According to an exemplary embodiment, a power semiconductor package includes a power module having a plurality of power devices. Each of the plurality of power devices can be a power switch. The...
8796560 Power semiconductor package with bottom surface protrusions  
A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom...
8791862 Semiconductor package having integrated antenna pad  
An apparatus for a semiconductor-package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a package structured to house the semiconductor device...
8770761 Illumination unit, projection display unit, and direct view display unit  
An illumination unit includes one or more light sources each including a solid-state light-emitting device configured to emit light from a light emission region including a single or a plurality...
8716853 Extended redistribution layers bumped wafer  
A semiconductor device is manufactured by, first, providing a wafer, designated with a saw street guide, and having a bond pad formed on an active surface of the wafer. The wafer is taped with a...
8710664 Wafer-level chip scale package  
A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more...
8703598 Manufacturing method of lead frame substrate  
A manufacturing method of a lead frame substrate includes: applying a photosensitive resist or a dry film to first and second surfaces of a metal plate; pattern-exposing the photosensitive resist...
8704344 Ultra-small chip package and method for manufacturing the same  
Some embodiments of the present disclosure provide the design and manufacture of an ultra-small chip assembly. The ultra-small chip assembly comprises a die, a plate-like back electrode disposed...
8705245 Sensor device and method for manufacture  
A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a...
8692369 Semiconductor chip and solar system  
There is provided a semiconductor chip having four sides and being substantially formed in a rectangle, the semiconductor chip including: a first terminal which is located along one side of the...
8686574 Semiconductor device  
A semiconductor device includes a wiring board that has a conductive pattern formed on at least one principal surface, and an IC chip that is mounted on the wiring board. The IC chip includes a...
8680568 Semiconductor light-emitting device  
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame....
8648450 Semiconductor device including leadframe with a combination of leads and lands  
In accordance with the present invention, there is provided a semiconductor package or device including a uniquely configured leadframe sized and configured to maximize the available number of...
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus  
Reliable electrical contact is made with electronic components and effective electrical isolation is produced between the top and bottom of the electronic components. An electronic component is...
8643188 Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector  
A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side...
8633507 LED with versatile mounting ways  
An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip....
8629467 Semiconductor device  
A semiconductor device in which the wiring resistance and parasitic inductance of a semiconductor package configuring a power semiconductor module is reduced. In the semiconductor device, a...
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size  
A semiconductor integrated circuit device includes a semiconductor chip having a memory cell array region surrounded with a peripheral circuit region and includes a plurality of bonding pads...
8624403 Semiconductor device and a method of manufacturing the same  
A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is...
8618644 Electronic device and manufacturing thereof  
An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on...
8592967 Semiconductor apparatus and power supply circuit  
A semiconductor apparatus comprising an integrated semiconductor circuit device having pluralities of electrode pads, pluralities of first external terminals connected to the electrode pads of the...
8592993 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads  
A monolithic integrated electronic device includes a substrate having a surface region and one or more integrated micro electro-mechanical systems and electronic devices provided on a first region...
8587001 Light-emitting diode light module free of jumper wires  
An LED light module free of jumper wires has a substrate and multiple LED chips. The substrate has a positive side circuit, a negative side circuit, multiple first chip connection portions and...
8587118 Light emitting device package and manufacturing method thereof  
Provided is a light emitting device package. The light emitting device package comprises a housing, first and second lead frames, and a light emitting device. The housing comprises a front opening...
8580609 Semiconductor device with embedded interconnect pad  
A semiconductor device comprising: a lower semiconductor package that comprises a first set of one or more semiconductor dies, an upper semiconductor package that is stacked on the lower...
8581371 Connection element for a semiconductor component and method for producing the same  
A connection element is arranged on a connection area of a semiconductor component. The connection element includes at least one bonding wire portion fixed on the connection area. The connection...
8569884 Multiple die in a face down package  
A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and...
8564110 Power device with bottom source electrode  
A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning...