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7622750 |
Optical device package and optical semiconductor device using the same
An optical device package comprises: a metal frame including a substrate and a rectangular die pad portion integrally connected to the substrate, wherein the substrate is a metal plate, and the die...
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7615411 |
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof
A semiconductor package includes a base plate, at least one semiconductor constructing body which is formed on one surface of the base plate and has a plurality of external connection electrodes...
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7608932 |
Deterministic generation of an integrated circuit identification number
The generation of an identification number of a chip supporting at least one integrated circuit, including the step of causing a cutting of at least one conductive section by cutting of the chip...
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7605474 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7602070 |
Room temperature metal direct bonding
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to...
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7602063 |
Semiconductor device and manufacturing method therefor
In a semiconductor having a multilayer wiring structure device on a semiconductor substrate, the multilayer wiring structure includes an interlayer insulating film having at least an organic...
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7602061 |
Semiconductor device and method for manufacturing semiconductor device
Disclosed herein is a semiconductor device including: an insulating film configured to be provided on a substrate and be porosified through decomposition and removal of a pore-forming material; a...
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7598617 |
Stack package utilizing through vias and re-distribution lines
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
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7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a...
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7595562 |
Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device
A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically...
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7592702 |
Via heat sink material
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be...
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7589422 |
Micro-element package having a dual-thickness substrate and manufacturing method thereof
A micro-element package which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate...
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7589421 |
Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same
A semiconductor chip, a tape package of the chip and a tape wiring substrate of the chip may be configured so as to effectively radiate heat generated from the chip externally through certain...
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7586186 |
Ball grid array
A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the...
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7582976 |
Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device
The present invention provides a semiconductor device tape carrier formed of an insulative tape 1 of a thin film, which becomes a semiconductor device by conducting a plurality of wire patterns ...
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7582966 |
Semiconductor chip and method for fabricating the same
A semiconductor chip includes a silicon substrate, a first dielectric layer over said silicon substrate, a metallization structure over said first dielectric layer, wherein said metallization...
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7582919 |
Functional coating of the SCFM preform
The invention relates to a power semiconductor module having at least one semiconductor chip ( 11 ) made of a semiconductor material and having a first and a second main electrode ( 12, 13 ), a...
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7577323 |
Photoelectric circuit board
A photoelectric circuit board includes a substrate, an optical waveguide and a core exposure surface. The substrate has an inspection opening. The optical waveguide includes a core and a clad...
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7576424 |
Semiconductor device
A semiconductor device including: a semiconductor substrate on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the semiconductor substrate, arranged along a...
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7569938 |
Interconnections for integrated circuits
An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described....
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7569411 |
Metal MEMS devices and methods of making same
Metal MEMS structures are fabricated from metal substrates, preferably titanium, utilizing micromachining processes with a new deep etching procedure to provide released microelectromechanical...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7564136 |
Integration scheme for Cu/low-k interconnects
A semiconductor structure having an opening formed in a porous dielectric layer is provided. The exposed pores of the dielectric layer along the sidewalls of the opening are sealed. The sealing may...
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7564130 |
Power micro surface-mount device package
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is...
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7560814 |
Semiconductor device that improves electrical connection reliability
A semiconductor device including: a semiconductor section in which an element is formed; an insulating layer formed on the semiconductor section; an electrode pad formed on the insulating layer; a...
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7560743 |
Electro-optical device, method of manufacturing the same, and image forming apparatus
An electro-optical device in which a plurality of light-emitting elements including a first electrode layer, a second electrode layer, and a light-emitting functional layer emitting light in...
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7557444 |
Power-via structure for integration in advanced logic/smart-power technologies
A via structure is disclosed for use in a multi-layered semiconductor device, for forming electrical contacts between prescribed layers of the vertically aligned structures. The via structures...
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7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same
Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing...
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7554136 |
Micro-switch device and method for manufacturing the same
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
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7550843 |
Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
A semiconductor device includes a base member made of a material containing at least a thermosetting resin, and at least one semiconductor constructing body mounted on the base member, and having a...
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7550842 |
Integrated circuit assembly
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical...
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7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
A semiconductor device comprises a plurality of semiconductor constructions being mutually laminated each having a semiconductor substrate and a plurality of external connection electrodes arranged...
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7550830 |
Stacked semiconductor package having fan-out structure through wire bonding
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A...
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7547967 |
Semiconductor device and method of manufacturing the same
A semiconductor device includes a semiconductor construction assembly having a semiconductor substrate which has first and second surfaces, and has an integrated circuit element formed on the first...
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7545653 |
Semiconductor integrated circuit device
A disclosed semiconductor integrated circuit device includes a digital circuit and an analog circuit formed on one semiconductor substrate; a guard band configured to prevent noise generated in the...
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7545044 |
Semiconductor device and radiation detector employing it
A wiring substrate 20 , comprising a glass substrate, formed by integrally bundling a plurality of glass fibers and provided with through holes 20 c , and conductive members 21 , disposed at...
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7545037 |
Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
Provided are embodiments of semiconductor chips having a redistributed metal interconnection directly connected to power/ground lines of an internal circuit are provided. Embodiments of the...
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7545031 |
Multipackage module having stacked packages with asymmetrically arranged die and molding
Semiconductor chip packages have die asymmetrically arranged on the respective substrates. Two such packages having complementary arrangements can be stacked, one inverted with respect to the...
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7538428 |
Semiconductor device
A semiconductor device having macro circuit including concentrated fine interconnections and extension wiring for connecting the macro circuit and the outer circuit. The widths of the fine...
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7533361 |
System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
A system and process for manufacturing custom printed circuit boards on pre-provided substrates, wherein the substrate is pre-provided with standard integrated circuits. The standard integrated...
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7531896 |
Semiconductor device having a minimal via resistance created by applying a nitrogen plasma to a titanium via liner
A system and method is disclosed for minimizing increases in via resistance by applying a nitrogen plasma after a titanium liner deposition. A via in a semiconductor device is formed by placing a...
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7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer
An integrated circuit having post passivation interconnections with a second connection pattern is disclosed. A passivation layer (preferably made of a non-oxide material) is formed over the...
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7525186 |
Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same
A stack package comprises a substrate having a circuit pattern; at least two semiconductor chips stacked on the substrate, having a plurality of through-via interconnection plugs and a plurality of...
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7521796 |
Method of making the semiconductor device, circuit board, and electronic instrument
A semiconductor device with a package size close to its chip size is, apart from a stress absorbing layer, such as to effectively absorb thermal stresses. A semiconductor device ( 150 ) has a...
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7518240 |
Deposition pattern for eliminating backside metal peeling during die separation in semiconductor device fabrication
A semiconductor wafer that includes a plurality of groups of active devices or circuits on a first side of the wafer and a patterned electrical contact on the backside of the wafer. Each group...
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7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion
A semiconductor device includes a substrate, a semiconductor chip, a conductive member and an external electrode. A penetrating hole is formed in the substrate, the penetrating hole having an...
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7518223 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
A semiconductor device that includes at least one nonconfluent spacer layer on at least one surface thereof. The at least one nonconfluent spacer layer at least partially spaces the surface of the...
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7514751 |
SiGe DIAC ESD protection structure
A diode for alternating current (DIAC) electrostatic discharge (ESD) protection circuit is formed in a silicon germanium (SiGe) hetrojunction bipolar transistor (HBT) process that utilizes a very...
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7514340 |
Composite integrated device and methods for forming thereof
A method for making a composite integrated device includes providing a first integrated device having a substrate, an overlying interconnect region, and a contact, wherein the contact electrically...
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