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Match Document Document Title
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides  
Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second...
7427806 Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component  
Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip ( 1 ), which is disposed in a recess ( 2 )...
7425758 Metal core foldover package structures  
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The...
7417309 Circuit device and portable device with symmetrical arrangement  
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first...
7414305 Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices  
A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and...
7408259 Sheet to form a protective film for chips  
A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer...
7405477 Ball grid array package-to-board interconnect co-design apparatus  
A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between...
7397118 Ceramic chip-type electronic component and method of making the same  
A chip-type electronic component includes a ceramic chip body, an external electrode formed on the chip body, a conductive elastic resin film made of a mixture of metal powder and elastic resin and...
7396741 Method for connecting substrate and composite element  
A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that...
7394148 Module having stacked chip scale semiconductor packages  
Stacked CSP (chip scale package) modules include a molded first (“top”) chip scale package having a molding side and a substrate side, and a second (“bottom”) package affixed to the...
7391122 Techniques for flip chip package migration  
Techniques for integrated circuit packaging in a flip chip configuration that ensures a migration path between related integrated circuits and utilizes core I/O (or area I/O) are provided. An...
7391110 Apparatus for providing capacitive decoupling between on-die power and ground conductors  
One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the...
7385298 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7378748 Solid-state imaging device and method for manufacturing the same  
A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing,...
7375421 High density multilayer circuit module  
Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules...
7372150 Semiconductor wafer having identification indication  
A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a...
7372141 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides  
Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One...
7371673 Method and apparatus for attaching an IC package to a PCB assembly  
A technique for attaching solder balls of a BGA to a PCB. In one example embodiment, this is accomplished by applying solder paste onto at least one of a plurality of contact pads on a PCB. At...
7368803 System and method for protecting microelectromechanical systems array using back-plate with non-flat portion  
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on...
7368795 Image sensor module with passive component  
An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper...
7364945 Method of mounting an integrated circuit package in an encapsulant cavity  
An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and...
7358602 Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer  
A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor...
7355278 Mold die for a semiconductor device  
A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a...
7354800 Method of fabricating a stacked integrated circuit package system  
An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit,...
7345359 Integrated circuit package with chip-side signal connections  
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
7342311 Electronic unit integrated into a flexible polymer body  
A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone...
7341887 Integrated circuit die configuration for packaging  
Integrate circuit die terminal arrangements and configurations for mounting an integrate circuit die on a package substrate to reduce package transmission paths. In one embodiment, terminals for...
7335994 Semiconductor component having multiple stacked dice  
A semiconductor package component includes a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary...
7335987 Semiconductor package and method for manufacturing the same  
A semiconductor package includes a semiconductor chip, a first substrate layer and a second substrate layer. The semiconductor chip has an active surface and a plurality of pads disposed on the...
7335970 Semiconductor device having a chip-size package  
Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a...
7329861 Integrally packaged imaging module  
An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The...
7327042 Interconnection structure of electric conductive wirings  
Accumulating spaces for conductive particles are formed in gaps of wiring patterns for conductive wirings which are disposed on a surface of a supporting body. When interconnecting a pair of...
7327020 Multi-chip package including at least one semiconductor device enclosed therein  
A multi-chip package, a semiconductor device used therein, and manufacturing method thereof are provided. The multi-chip package may include a substrate having a plurality of substrate bonding pads...
7327019 Semiconductor device of a charge storage type  
According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a...
7319553 Optical modulator module package structure  
Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip...
7298046 Semiconductor package having non-ceramic based window frame  
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
7288843 Integrated circuit chip support substrate for placing in a mold, and associated method  
A substrate, in particular, a multilayer substrate, includes a mounting and electrical-connection support, and a face for mounting at least one integrated circuit chip (IC chip). The substrate and...
7285862 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film  
The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an...
7285847 Chip stack package, connecting board, and method of connecting chips  
A chip stack package, a connecting board, and a method of connecting multiple, stacked semiconductor chips multi-chip package comprises a plurality of stacked packages including an upper package...
7280573 Semiconductor laser unit and optical pickup device  
The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center...
7274101 Semiconductor package and method for manufacturing the same  
A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the...
7268417 Card-type circuit device  
A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode...
7247941 Printed circuit board assembly with strain-alleviating structures  
A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the...
7247940 Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body  
An optoelectronic device, comprising a package body ( 57 ) and at least one semiconductor chip ( 50 ) arranged on the package body ( 57 ). The surface of the package body ( 57 ) has a metallized...
7242085 Semiconductor device including a semiconductor chip mounted on a metal base  
A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip ( 1 ) mounted...
7242079 Method of manufacturing a data carrier  
A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier...
7239010 Semiconductor device  
By securing a fatigue life of a connection portion with a semiconductor package and a mount board, a semiconductor device having a high reliability is provided. The semiconductor device consists...
7238962 Semiconductor chip with test pads and tape carrier package using the same  
A semiconductor chip with test pads and a tape carrier package using the same are provided. The tape carrier package comprises a semiconductor chip. The semiconductor chip has an active surface and...
7235867 Semiconductor device with electrically biased die edge seal  
A die seal arrangement and method for making the same negatively biases the die edge seal of a die by connecting the die edge seal to a source of negative electrical potential, with respect to...
7227243 Semiconductor device  
An object of the present invention is to provide a semiconductor device capable of adapting to an increase in the external terminals which can be arranged on the mount surface (a greater number of...
Matches 1 - 50 out of 596 1 2 3 4 5 6 7 8 9 10 11 12 >