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7615863 |
Multi-dimensional wafer-level integrated antenna sensor micro packaging
An integrated packaging assembly for an MMIC that uses the semiconductor wafers on which circuit elements are fabricated as the package. The packaging assembly includes a plurality of semiconductor...
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7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
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7605462 |
Universal substrate for a semiconductor device having selectively activated fuses
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses...
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7605450 |
High frequency arrangement
A high frequency arrangement is provided that includes an integrated high frequency circuit, a first bond pad, which is electrically connected by a first electrical supply line, in particular a...
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7595549 |
Surface mount semiconductor device
A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion...
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7589419 |
Side connectors for RFID chip
An RFID chip can have an RFID circuit having first and second initial bond pads and conductive paths on the RFID chip connecting the first and second bond pads to the different sides of the chip....
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7586193 |
Mm-wave antenna using conventional IC packaging
An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad...
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7586192 |
Routing configuration for high frequency signals in an integrated circuit package
An apparatus for routing a high-speed signal is disclosed, having a signal router and a plurality of projections extending therefrom. The projections are separated from each other by a distance...
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7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a...
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7576440 |
Semiconductor chip having bond pads and multi-chip package
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
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7576401 |
Direct glass attached on die optical module
An optical module includes an image sensor having an active area and a window mounted directly to the image sensor above the active area. The optical module further includes a mount mounted to the...
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7573359 |
Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate
An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one...
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7569933 |
Housing for accommodating microwave devices having an insulating cup member
A housing for accommodating a microwave device having an insulating cup member.
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7550839 |
Integrated circuit package and system interface
An apparatus for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low...
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7547977 |
Semiconductor chip having bond pads
In one embodiment, a semiconductor chip has one or more peripheral bond pads. The semiconductor chip comprises a semiconductor substrate having a cell region and a peripheral circuit region...
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7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first and second areas formed with a high-frequency circuit element, and a third area...
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7538417 |
Semiconductor device with signal line having decreased characteristic impedance
A semiconductor device includes a semiconductor chip, electrodes pads, first and second insulating layers, first and second conductive patterns and external terminals. The electrode pads are formed...
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7535100 |
Wafer bonding of thinned electronic materials and circuits to high performance substrates
A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the...
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7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure
The present invention relates to a substrate structure comprising at least two substrate layers extending in substantially parallel planes, which substrate layers are (Z-)interconnected in a...
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7534320 |
Lamination press pad
A press pad for bonding substrates into a radio-frequency and/or intermediate-frequency module. The module has a plurality of channels, each of which has an adhesive film for bonding the substrate....
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7518229 |
Versatile Si-based packaging with integrated passive components for mmWave applications
An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having...
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7518223 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
A semiconductor device that includes at least one nonconfluent spacer layer on at least one surface thereof. The at least one nonconfluent spacer layer at least partially spaces the surface of the...
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7514774 |
Stacked multi-chip package with EMI shielding
A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each...
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7504721 |
Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips
Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7495336 |
Array capacitors for broadband decoupling applications
An integrated broadband array capacitor includes at least two regions with varying capacitance and response times. The broadband array capacitor is disposable on a socket or is integral with a...
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7479696 |
Integrated BST microwave tunable devices fabricated on SOI substrate
A tunable microwave device includes a SOI structure. A buffer layer is formed on the SOI structure. A microwave film layer is formed on the buffer layer. The microwave film layer comprises BST...
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7470977 |
Modular board device, high frequency module, and method of manufacturing same
The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate ( 11 ) in which conductive pattern or patterns are...
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7470968 |
T-coil apparatus and method for compensating capacitance
A passive matching network is connected to an input/output line for an automatic test equipment drive channel to compensate for capacitances associated with a receiver circuit connected to the...
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7459776 |
Stacked die assembly having semiconductor die projecting beyond support
A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a...
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7458054 |
Method for designing integrated circuit package and method for manufacturing same
A new IC package 12 is designed as follows. That is, a circuit block 2 is omitted from an existing IC package 11 including a package 11 a having a circuit block 1 and the circuit block 2...
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7457491 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters ( 100 ) disposed within printed circuit boards ( 104 ). The heat sink ( 110, 200 ) is a...
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7456491 |
Large area electron emission system for application in mask-based lithography, maskless lithography II and microscopy
The present invention relates to a various systems for generating and directing electron flow, and related methods, manufacturing techniques and related componentry, such as can be used in...
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7454300 |
Extracting high frequency impedance in a circuit design using broadband representations
Exemplary impedance extraction methods, systems, and apparatus are described herein. In one exemplary embodiment, at least a portion of a circuit description indicative of a circuit layout is...
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7439622 |
Semiconductor device
The present invention provides a semiconductor device comprising a semiconductor substrate, and transistors formed on the semiconductor substrate, wherein control electrode terminals constituting...
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7439621 |
Radio frequency signal processing device
The RF device of the present invention includes: a semiconductor substrate; and first and second semiconductor components provided on the substrate. Each of the components includes source...
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7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer
A display device includes a display panel, and the circuit substrate is separately formed and positioned different from the array substrate of the display panel and connected to the display panel....
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7405477 |
Ball grid array package-to-board interconnect co-design apparatus
A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between...
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7400032 |
Module assembly for stacked BGA packages
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
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7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
A semiconductor integrated circuit package having a leadframe ( 108 ) that includes a leadframe pad ( 103 a ) disposed under a die ( 100 ) and a bonding metal area ( 101 a ) that is disposed over...
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7390699 |
Integrated circuit die connection methods and apparatus
This invention generally relates to methods and apparatus for connecting to an integrated circuit die, in particular where the die includes both analogue/microwave radio frequency (rf) circuitry...
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7388284 |
Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit
An integrated circuit package having a lid is disclosed. The integrated circuit package comprises a substrate having an embedded conductor exposed on a surface; a lid comprising a plurality of...
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7386413 |
Switched length matched transmission path instrument
A testing apparatus includes one or more trace banks. Each trace bank includes (1) an input switch operable to couple an input port to one of multiple output ports, (2) an output switch operable to...
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7385283 |
Three dimensional integrated circuit and method of making the same
A three dimensional integrated circuit structure includes at least first and second devices, each device comprising a substrate and a device layer formed over the substrate, the first and second...
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7372149 |
High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus
A high frequency semiconductor apparatus is provided which prevents characteristics of a high frequency semiconductor element from being deteriorated so that the high frequency semiconductor...
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7372139 |
Semiconductor chip package
A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for...
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7365423 |
Redistributed solder pads using etched lead frame
A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which...
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7362491 |
Heated glass panels and methods for making electrical contact with electro-conductive films
A heated glass panel assembly according to one embodiment of the invention may include a substrate having an electro-conductive film provided thereon. A conductor is positioned in contact with the...
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7355272 |
Semiconductor device with stacked semiconductor chips of the same type
A semiconductor device includes a wiring board, a first semiconductor chip (e.g. DRAM) that is flip-chip connected on the wiring board, a second semiconductor chip (e.g. DRAM) that is of the same...
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