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6124631 |
Micro sensor and method for making same
The invention concerns a device comprising a first substrate and a second substrate intended to form a micro-system such as a sensor, at least one of the substrates being able to include electronic...
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6124636 |
MMIC package
Disclosed herein is an MMIC package which comprises a base substrate, a composite capacitor substrate made of a ceramics plate mounted on the base substrate, an MMIC bare chip which functions as a...
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6118357 |
Wireless MMIC chip packaging for microwave and millimeterwave frequencies
A wireless MMIC chip packaging scheme where the MMIC chip (38) is maintained right side up. The MMIC chip (38) is positioned within a cavity (40) of a fixture (42), where a backside metal layer...
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6107684 |
Semiconductor device having a signal pin with multiple connections
A semiconductor device comprises a signal pin mounted on a base plate by adhesive. Parasitic capacitance exists between the pin and the base plate in the region of adhesive and may deleteriously...
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6101099 |
Method and device for connecting electrical components to printed circuit boards
The present invention relates to a device and a method for electrical and mechanical connection of an electric high-power component (111) which transmits high-frequency electrical signals to...
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6100583 |
Semiconductor device containing semiconductor element in package
A semiconductor element such as a CCD chip is contained in a recess portion of an opaque package made of plastic, and the upper surface thereof is covered with a transparent cap made of plastic....
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6094114 |
Slotline-to-slotline mounted flip chip
A high frequency circuit structure including a base substrate having a planar face, a first base slotline mounted on the base substrate face and consisting of first and second, spaced-apart...
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6093957 |
Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
A lead frame structure and semiconductor package using the same and fabrication method thereof is provided that decreases noise by providing prescribed impedances for leads of a lead frame. The...
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6093962 |
High frequency shielding case of semiconductor laser
A high frequency shielding case of a semiconductor laser apparatus, according to the present invention, comprises a soldering fixing plate, together with a semiconductor laser holding member, fixed...
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6087721 |
Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
A bipolar transistor (3) is provided with a first main surface (4) in contact with a conductive mounting surface (2), and with an opposed second main surface (12) having connection pads (5, 6, 40)...
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6081030 |
Semiconductor device having separated exchange means
A semiconductor device having separated exchange mechanism comprises a chip forming an integrated circuit; a connection substrate; device connection points or balls; and at least one exchange...
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6081006 |
Reduced size field effect transistor
A reduced size field effect transistor is disclosed which has a substrate with a body of semiconductor material having an active region on one surface thereof, and a common conductor located in...
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6075423 |
Controlling signal trace characteristic impedance via a conductive epoxy layer
A conductive ground layer provides a low cost method of reducing, controlling, or tailoring printed circuit board (PCB), for example, a motherboard, trace impedance and/or size, cross-talk, and EMI...
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6075427 |
MCM with high Q overlapping resonator
An MCM including a resonator made using conventional MCM fabrication techniques. The MCM's resonator is constructed with overlapping first and second spiral-shaped regions of metallic material...
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6075995 |
Amplifier module with two power amplifiers for dual band cellular phones
Disclosed is an amplifier module suitable for automated mounting and connecting to a motherboard of a cellular phone. The amplifier module comprises a substrate which has at least two layers of...
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6072238 |
Semiconductor component
A semiconductor device (10) suitable for use in RF applications and a method of forming the semiconductor device (10). An RF transistor die (31) is bonded to a heatsink (21). The heatsink (21)...
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6069404 |
Arrangement for the reduction of noise in microwave transistors and method for the manufacture thereof
A structure for a microwave device in which the minimum noise figure is reduced in that underneath the base terminal surface of a transistor, a highly-doped trenched layer is formed, which layer is...
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6064286 |
Millimeter wave module with an interconnect from an interior cavity
A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated...
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6057599 |
Hybrid high-power microwave-frequency integrated circuit
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6058022 |
Upgradeable PCB with adaptable RFI suppression structures
Disclosed is a printed circuit board that includes selectable structures for attenuating EMI/RFI of replaceable components. In one preferred embodiment, the printed circuit board has a power plane...
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6057600 |
Structure for mounting a high-frequency package
A structure for mounting a high-frequency device on an insulating board having a circuit on a top surface and transmitting signals to the high-frequency device. The high-frequency device is sealed...
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6057594 |
High power dissipating tape ball grid array package
A molded tape ball grid array package has a base structure including a heat conductive substrate and flex tape extending from opposing regions on a surface of the substrate with molded plastic...
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6054766 |
Package for enclosing microoptical and/or microelectronic devices so as to minimize the leakage of microwave electromagnetic radiation
The invention relates to a package for microoptical and/or microelectronic devices. The package is to be designed in such a way that package resonances initiated by standing waves produced in the...
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6049127 |
Hermetically sealed tungsten-copper composite package container for packaging of microwave devices
A method for fabricating a hermetically sealed tungsten-copper package container for a microwave device is provided with the steps of forming an injection feedstock by mixing a polymer binder with...
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6049126 |
Semiconductor package and amplifier employing the same
A semiconductor module, includes a circuit including a plurality of semiconductor devices connected together as a package, wherein the plurality of semiconductor devices have a same device...
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6046501 |
RF-driven semiconductor device
An RF-driven semiconductor chip is die-bonded to the top face of a metal plate. The semiconductor chip and the metal plate are molded together with outer leads in a plastic package in the form of a...
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6031279 |
Power semiconductor component
A power semiconductor component includes a first chip having a vertical first transistor. A second chip with a second vertical transistor is mounted on the first chip in such a way that load paths...
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6028497 |
RF pin grid array
A hermetic RF pin grid array package methodology is described that obviates the need for glass to metal feedthroughs, simplifying construction, improving reliability and reducing the cost of RF...
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6028348 |
Low thermal impedance integrated circuit
A frontside ground plane (306) integrated circuit with backside contacts (312) plus optional passive components such as microstrip (308) and capacitors. The frontside ground plane provides direct...
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6025651 |
Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads
A semiconductor package has a controlling IC attached to a die pad using an epoxy molding compound (EMC) pad. The EMC pad is formed so as to be slightly larger than the controlling IC. EMC pads are...
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6023080 |
Input/output connection structure of a semiconductor device
A semiconductor device comprises a dielectric substrate formed on a metal carrier, a semiconductor chip formed on the dielectric substrate and having a first electrode, a microstrip line formed on...
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6020636 |
Kilowatt power transistor
A high-power high-voltage transistor has four or more semiconductor dies mounted in thermal contact on a metal flange. Each die has a flat lower surface with a drain (collector) region formed over...
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6002375 |
Multi-substrate radio-frequency circuit
A radio-frequency circuit (20) includes a hybrid integrated circuit (24) having a passive circuit element (38) and a d-c biasing circuit element (54) embedded within a first substrate (32) of a low...
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5990757 |
Gallium arsenide monolithic microwave integrated circuits employing thermally bumped devices
Flip chip monolithic microwave integrated circuits (MMIC) devices formed on gallium arsenide substrates and use thermally bumped diodes and field effect transistor devices to achieve improved heat...
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5986331 |
Microwave monolithic integrated circuit with coplaner waveguide having silicon-on-insulator composite substrate
A microwave monolithic integrated circuit includes a coplanar waveguide (CPW) formed by a composite silicon structure constituted by a relatively high resistivity substrate, a first oxide layer on...
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5982632 |
Short power signal path integrated circuit package
A short power signal path integrated circuit package placed on a printed circuit (PC) board and having a first dielectric layer. On top of this first dielectric layer a metallized die pad and a...
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5982032 |
Electronic device having FETs on a low dielectric constant GaAs base member and passive elements on a high dielectric constant base member
An electronic device includes one or more GaAs integrated circuits having a plurality of mutually independent field-effect transistors formed on a GaAs base-member; and one or more...
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5977631 |
Semiconductor device including a semiconductor package with electromagnetic coupling slots
A semiconductor device includes a high-frequency semiconductor chip having first and second surfaces, and including a first high-frequency transmission line on the first surface and a first...
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5955783 |
High frequency signal processing chip having signal pins distributed to minimize signal interference
A DBS receiver front end which includes a tuner chip and a demodulator/decoder chip. The tuner chip converts a receive signal to a baseband signal using a tuning frequency signal generated from a...
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5955789 |
Ball grid array module
A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. A Faraday Cage is realized to protect the active element from external HF wave interferences. The...
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5946794 |
Method of manufacturing a composite microwave circuit module
A composite microwave circuit module includes a multilayer dielectric substrate, upper- and lower-surface grounds, an antenna pattern, a plurality of shield via holes, and a large number of first...
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5949140 |
Microwave semiconductor device with via holes and associated structure
A semiconductor device for a microwave circuit includes a semiconductor substrate with an active element formed in the top surface, surface wirings on the top surface of the semiconductor substrate...
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5945734 |
Wire-bond free input/output interface for GaAs ICs with means of determining known good die
An MMIC includes I/O pads on the back side coupled to active circuit structures on the front side by standard through-the-substrate vias. The front side is covered by a passivation layer and the...
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5942960 |
Printed circuit board with a high frequency coupling island
A printed circuit board with a metal layer (15) arranged on its lower side and HF components (11, 12) arranged on its upper side, which components are connected by their input and/or output sides...
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5939739 |
Separation of thermal and electrical paths in flip chip ballasted power heterojunction bipolar transistors
The present invention relates to a heterojunction bipolar transistor structure having a device mesa 401 with a collector region 402, a base region 403 and an emitter region 404. An emitter metal...
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5939954 |
Equivalent circuit of package ground terminal paddle
The present invention relates to an equivalent circuit of a package ground terminal paddle which is used to mount a microwave integrated circuit, and more particularly, to an approximate equivalent...
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5932927 |
High-frequency device package
A high-frequency device package includes a base, a high-frequency device mounted on the base and having a power supply electrode, a signal electrode, and a ground electrode disposed on a surface...
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5932926 |
Microwave semiconductor integrated circuit
A microwave semiconductor integrated circuit having high isolation includes a wiring-side substrate including a transmission line in slots at a surface; an element-side substrate having an active...
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5930686 |
Integrated transceiver circuit packaged component
An integrated transceiver circuit packaged component including a transceiver circuit having a bandstop filter (29) provided therein for filtering both the received and transmitted signals to remove...
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5929510 |
Integrated electronic circuit
An electronic integrated circuit which includes at least one of RF, microwave, digital and analog components connected in a desired circuit. The integrated circuit includes a substrate of a...
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