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6822162 |
Microcircuit housing with sloped gasket
A contiguous gasket provides an electromagnetic and environmental seal between the base and lid of a microcircuit housing. The base has a flat surface that allows easy access of tools for...
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6818979 |
High-frequency semiconductor device
A high-frequency semiconductor device is provided with a ceramic substrate, an element group including semiconductor elements and passive components mounted onto a bottom portion of the ceramic...
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6818985 |
Embedded antenna and semiconductor die on a substrate in a laminate package
According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated...
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6819191 |
Piezoelectric oscillator unit
A piezoelectric oscillator unit maintains the adhesive force of a quartz vibrator package with respect to a circuit substrate even when the solder connecting the quartz vibrator package to the...
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6812553 |
Electrically isolated and thermally conductive double-sided pre-packaged component
An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between...
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6809418 |
Integrated circuit package structure
A reliable new IC package structure comprises an IC package having a plurality fo grounding conductor plates provided around its surrounding, a first conductor plate for covering over the IC...
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6807063 |
High-frequency integrated circuit module
A high-frequency integrated circuit (IC) module comprising a multilayer mounting board on which an integrated circuit with a plurality of high-frequency signal terminals is mounted, and IC...
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6806569 |
Multi-frequency power delivery system
A mechanism is provided for delivering power to an on-die component (such as a buffer circuit). This may include a package unit having a low frequency delivery path and a high frequency delivery...
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6800935 |
Switching circuit with improved signal blocking effect in off mode
A switching circuit includes an insulating substrate including two signal transmission lines; a switching diode mounted, in series between the two signal transmission lines, on the insulating...
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6798061 |
Multiple semiconductor chip (multi-chip) module for use in power applications
A multiple semiconductor chip (multi-chip) module for use in power applications includes at least a power semiconductor chip and a control semiconductor chip mounted on an electrically conductive...
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6784765 |
Multilayer ceramic device
A mulitlayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer 1 has a first...
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6781488 |
Connected construction of a high-frequency package and a wiring board
A connected construction of a high-frequency package and a wiring board have an excellent high-frequency transmission characteristic without degradation of the transmission characteristic of even...
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6777792 |
Semiconductor device and package with high heat radiation effect
A conductive mounting board provided in a package has a recessed portion and a projecting portion, and an insulating mounting board is disposed on the recessed portion. The insulating mounting...
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6774748 |
RF package with multi-layer substrate having coplanar feed through and connection interface
An RF package includes a multilayered dielectric substrate, a feed-through, and metal members. First and second dielectric substrates are formed on the multilayered dielectric substrate. The...
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6770955 |
Shielded antenna in a semiconductor package
One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated...
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6770970 |
High-frequency module, method of manufacturing thereof and method of molding resin
A method of molding resin on a thin-film resin substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite the first surface is disclosed. The...
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6768194 |
Electrode for electroplating planar structures
An apparatus for electroplating a metal overlay on a substrate having a seed layer deposited on all surfaces. The apparatus includes a cell for containing and circulating an electrolyte and an...
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6762494 |
Electronic package substrate with an upper dielectric layer covering high speed signal traces
An electronic package component includes a flip-chip device mounted to a BGA substrate. The BGA substrate includes conductive traces formed on its upper surface and configured in a coplanar...
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6759744 |
Electronic circuit unit suitable for miniaturization
The electronic circuit unit of the present invention includes first and second insulating substrates on respective surfaces of which wiring patterns are formed, and thick-film passive elements...
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6759742 |
Interchangeable bond-wire interconnects
A method for making a bond-wire interconnect to pass signals between different substrates is described. According to this process, a first compensated bond wire interconnect is made to connect two...
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6756649 |
High speed electron tunneling device and applications
A modulator includes a voltage source, a first arrangement including first and second non-insulating layers configured such that a modulation voltage from the voltage source can be applied there...
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6753615 |
Optical element module
In a conventional optical element module, a filter substrate mounting an air-core coil thereto is mounted in the vicinity of a light emitting element, and the light emitting element and the...
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6753604 |
High frequency circuit module and communication device
The present invention relates to a high frequency circuit module in which a two or more layer dielectric substrate is used. The dielectric substrate provided between a conductor line of a matching...
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6753595 |
Substrates for semiconductor devices with shielding for NC contacts
A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of...
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6740914 |
FET circuit block with reduced self-heating
A field effect transistor (FET) is disclosed that includes a heat spreader adapted to reduce the thermal resistance and channel operating temperature of a field effect transistor used in a circuit...
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6737732 |
Data carrier with an integrated circuit between two carrier layers
A data carrier ( 1 ) for contactless communication comprises a first carrier layer ( 2 ) and a second carrier layer ( 3 ) which are held together by an adhesive layer ( 15 ), wherein an integrated...
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6727777 |
Apparatus and method for angled coaxial to planar structure broadband transition
A semiconductor device package adapted for use with high frequency signals and/or coaxial connections. The package has an angled coaxial input shielded by a plurality of vias. In one embodiment the...
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6727585 |
Power device with a plastic molded package and direct bonded substrate
A power device compatible with an SOT 227 package standard. The device includes a substrate including a first conductive layer, a second dielectric layer, and a third conductive layer. The first...
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6717261 |
Integrated semiconductor circuit
An integrated semiconductor circuit including a substrate and at least one microwave circuit area supported by a substrate is provided, at least one cooling area supported by the substrate being...
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6713867 |
Package for microwave components
A package for a printed circuit and a method for packaging a circuit including exposed components placed on a printed circuit, the circuit including microwave components. At least part of the...
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6709890 |
Method of manufacturing semiconductor integrated circuit device
In a method of manufacturing a high frequency module to be assembled by providing, on a wiring board, a chip part and a semiconductor pellet to be bare chip mounted and then mounting the chip part...
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6707161 |
Optical module package of flip chip bonding
A flip-chip-bonded optical module package using flip chip bonding is provided. The flip-chip-bonded optical module package includes an optical device chip which has an input/output pad formed on a...
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6707159 |
Semiconductor chip and production process therefor
A semiconductor chip including a bump projecting from a surface protective film thereof and a surface interconnection having a smaller height than the bump. The surface interconnection may project...
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6700792 |
High-frequency composite component and portable wireless device incorporating the component
A high-frequency composite component can achieve reduction in size and weight, while providing high performance. A portable wireless device incorporates the high-frequency composite component,...
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6696755 |
Semiconductor device
A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting...
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6681483 |
Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
A printed circuit architecture includes a relatively thick, stiffening base of thermally and electrically conductive material, and a laminate of conductive layers including a printed circuit...
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6680533 |
Semiconductor device with suppressed RF interference
A high frequency semiconductor integrated circuit device having a semiconductor chip, a package for housing the semiconductor chip and a ground conductor, comprises a first package terminal for...
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6667549 |
Micro circuits with a sculpted ground plane
A sculpted groundplane is provided so that monolithic dielectric structures are effectively shielded from their immediate surroundings through the implementation of transversely elongated...
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6667192 |
Device and method for making devices comprising at least a chip fixed on a support
A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a...
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6664624 |
Semiconductor device and manufacturing method thereof
A source electrode, a gate electrode, and a drain electrode formed on a front face active region of a semiconductor substrate in a shape of teeth of a comb are covered with an insulating film such...
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6654249 |
Circuit arrangement
A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive...
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6649991 |
Image sensor semiconductor package
A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, higher reliability, and lower profile is provided. A semiconductor chip with a vision chip active...
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6649978 |
Semiconductor module having multiple semiconductor chips
A multiple semiconductor chip (multi-chip) module includes at least an output semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The output...
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6646343 |
Matched impedance bonding technique in high-speed integrated circuits
A method and an integrated circuit package support a high-speed integrated circuit operating at 10 GHz or higher switching speeds. The packaged integrated circuit has external terminals, a...
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6642808 |
High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic
A high frequency package is arranged such that it comprises a dielectric substrate provided with an input terminal and an output terminal, a high frequency element mounted on the surface of the...
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6639322 |
Flip-chip transition interface structure
A flip-chip transition interface structure is suitable for use in high speed applications that require low return losses. The transition interface includes a conductive signal element and two...
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6627992 |
Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set...
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6628178 |
Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof
The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate. The surface acoustic wave elements may be flip chips face-down-bonded to...
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6624508 |
High frequency, low cost package for semiconductor devices
A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug...
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6621161 |
Semiconductor device having a package structure
A semiconductor device comprises a first plate-like base substrate having a substantially rectangular extrapolated outer shape in a plane parallel to the primary surface thereof, and the first...
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