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6975029 |
Antenna-incorporated semiconductor device
Disclosed is an inexpensive semiconductor device which has a built-in antenna capable of efficiently radiating low-power microwaves and has excellent productivity. An IC chip is mounted on a lead...
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6974724 |
Shielded laminated structure with embedded chips
A laminated structure that can be used as an add-on card removably disposed on an electronic device, such as a mobile phone. The laminated structure has a number of layers laminated together for...
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6972965 |
Method for integrated high Q inductors in FCGBA packages
A high quality factor on-package, off-die inductor assembly is disclosed. The assembly includes a flip-chip, ball-grid array package substrate, an on-package, off-die trace line is coupled to one...
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6963131 |
Integrated circuit system with a latent heat storage module
The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat...
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6953987 |
Composite integrated circuit device having restricted heat conduction
A composite integrated circuit is formed by being molded with a mold resin, including a seat member of a lead frame, a substrate attached on the seat member of the lead frame, a heater element, and...
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6953981 |
Semiconductor device with deep substrates contacts
The present invention relates to a semiconductor device arranged at a surface of a semiconductor substrate having an initial doping having an electrical connection comprising at least one plug made...
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6943446 |
Via construction for structural support
An integrated circuit having electrically conductive vias with a diameter of between about one micron and about fifty microns. Prior art vias have a diameter of between no less than 0.3 microns to...
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6943436 |
EMI heatspreader/lid for integrated circuit packages
An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.
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6940164 |
Power module
A power module incorporates a switching semiconductor element and a smoothing capacitor and includes a metallic base plate dissipating heat produced by the switching semiconductor element and the...
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6936921 |
High-frequency package
A high-frequency package comprises a dielectric substrate, on an upper face of which a mounting portion of a high-frequency circuit component is formed, a first line conductor formed on the upper...
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6933596 |
Ultra wideband BGA
An electronic device packaging assembly ( 10 ) that includes a ball grid array ( 60 ) and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The...
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6933813 |
Interconnection structure with etch stop
An interconnection structure includes: a dielectric layer; a first metallization pattern on the dielectric layer, the first metallization pattern including at least one etch stop having a perimeter...
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6933605 |
Semiconductor package
A semiconductor package comprises a first chip, a substrate, a middle layer, a second chip, and an encapsulant. The first chip has an active surface and a high-frequency element defining a...
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6933599 |
Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
A semiconductor device has a die ( 10 ) overlying and electrically connected to a support structure ( 11 ), such as a substrate or a lead frame, via a plurality of interconnects. Aggressor...
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6930334 |
High frequency semiconductor device
A high frequency semiconductor device including a high frequency semiconductor chip, comprising an active region provided on a front face side of the high frequency semiconductor chip; a covering...
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6921573 |
High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics
The present invention is a high-frequency current essentially of M—X—Y, where M is Fe, Co, and/or Ni, X is an element other than M or Y, and Y is F, N, and/or O. The maximum value μ″ max of...
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6917262 |
Integrated microwave filter module with a cover bonded by strips of conductive paste
An integrated microwave module comprising a conductive ground plane, a non-conductive substrate on the ground plane, at least two microwave circuits mounted on the substrate, a microstrip line...
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6911734 |
Semiconductor device and electronic device
A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via...
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6911732 |
Integrated circuit
An integrated circuit which is integrated in a housing having connecting pins fitted to the housing for connecting the housing to signal lines of an external circuit, each connecting pin connected...
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6909170 |
Semiconductor assembly with package using cup-shaped lead-frame
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the...
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6906259 |
High frequency module
An object of the present invention is to provide a high frequency module which can efficiently radiate heat generated from a semiconductor chip. A high frequency module according to the present...
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6900537 |
High power silicon carbide and silicon semiconductor device package
A silicon carbide semiconductor field effect transistor and a silicon metal oxide semiconductor field effect transistor are packaged as a hybrid field effect transistor having a high voltage...
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6897552 |
Semiconductor device wherein chips are stacked to have a fine pitch structure
There is here disclosed a semiconductor device comprising a chip-mounting-member having a lead formed on its major surface, the lead having a thin film plated portion which covers a surface of a...
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6897559 |
Silicon-based thin film forming apparatus, silicon-based thin film forming method and semiconductor element
There is provided an apparatus for forming a plurality of silicon-based thin films on a substrate using a plurality of deposited film forming vessels that can form silicon-based thin films of...
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6891267 |
Semiconductor switching circuit device
A semiconductor switching circuit device includes a field effect transistor having a source electrode, a gate electrode and a drain electrode, a first electrode pad connected to the source...
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6888241 |
Electronic multipurpose seal with passive transponder
The invention provides a system for sealing, comprising:
a first capsule ( 20 ); a second capsule ( 30 ); electronic means ( 23, 33 ), for placing in at least one of the capsules, and...
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6876076 |
Multilayer semiconductor device for transmitting microwave signals and associated methods
A multilayer semiconductor device includes at least one structure for transmitting electrical signals, and in particular, microwave signals. The device includes at least one electrically conductive...
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6876062 |
Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities
An apparatus and method for protecting die corners in a semiconductor integrated circuit. At least one irregular seal ring having two sides can be configured, wherein the irregular seal ring is...
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6873044 |
Microwave monolithic integrated circuit package
A microwave monolithic integrated circuit (MMIC) package includes a MMIC and a base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC. A solder preform is...
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6870261 |
Discrete circuit component having an up-right circuit die with lateral electrical connections
A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit...
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6861731 |
Module and electronic device
A radio module ( 10 ) suitable for RF applications, especially for Bluetooth, comprises a substrate ( 1 ) with a semiconductor device ( 11 ), a shield ( 21 ), and an antenna ( 31 ). The shield ( 21...
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6861743 |
Integrated circuit carrier socket
According to one embodiment, an apparatus is disclosed. The apparatus comprises an integrated circuit (IC) having a plurality of connection pins, a carrier socket configured to carry the IC. The...
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6853062 |
Single substrate hydrogen and microwave absorber for integrated microwave assembly and method of manufacturing same
A single substrate hydrogen and microwave absorber ( 20 ) attenuates spurious microwave signals in a metal Integrated Microwave Assembly ( 10, 10′ ) and reduces hydrogen poisoning of hydrogen...
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6853073 |
Microwave electronic devices comprising a metal enclosure
The present invention relates to a microwave electronic device ( 1 ) comprising a metal enclosure ( 2 ) having a bottom ( 21 ) and a lid ( 23 ) and containing an electronic circuit board ( 3 )...
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6853072 |
Semiconductor switching circuit device and manufacturing method thereof
Posts are disposed at the surroundings of an FET and a shield metal supported by the posts is placed above the FET to create a void between the FET and the shield metal. Since the separation...
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6853287 |
Coil for use on a substrate
There is provided a coil and a method for fabricating the same. One embodiment of the coil includes a plurality of traces in one area of a substrate. Each trace has a first end located at a first...
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6853063 |
Semiconductor device and communication terminal using thereof
Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on...
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6847275 |
High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit
A ground electrode and a terminal electrode are formed on a first main surface of dielectric substrate forming a circuit board. Wiring electrodes are formed on a second main surface of the...
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6847115 |
Packaged semiconductor device for radio frequency shielding
A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are...
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6844221 |
Method of manufacturing a wire bond-less electronic component for use with an external circuit
A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate ( 110, 410...
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6842144 |
High gain integrated antenna and devices therefrom
An integrated circuit for wireless communications includes substrate, at least one integrated antenna formed in or on the substrate, and a heat sink. At least one dielectric propagating layer is...
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6838748 |
Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof
A semiconductor chip of the present invention is so arranged that a front face on which an element circuit is formed has electrode pads and a side face and a back face are coated with a shielding...
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6838377 |
High frequency circuit chip and method of producing the same
In the production of a high frequency circuit chip in which a wiring pattern is disposed on a substrate having a through-hole, a connecting electrode of the through-hole is formed by filling...
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6835968 |
High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment
A high frequency switch, has a transmitting terminal; a receiving terminal; an antenna terminal; a first diode having an anode electrically connected to the transmitting terminal and a cathode...
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6835004 |
Opto-electronic component packaging
An opto-electronic package is provided for mounting on a module base. The package comprises a generally rectangular package. An optical connector extends from a first side of the package body along...
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6833619 |
Thin profile semiconductor package which reduces warpage and damage during laser markings
A semiconductor package has a substrate comprising a resin layer of an approximate planar plate, a cavity passing through the resin layer vertically at a center area thereof, a plurality of...
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6822325 |
Isolating temperature sensitive components from heat sources in integrated circuits
Temperature sensitive devices may be shielded from temperature generating devices on the same integrated circuit by appropriately providing a trench that thermally isolates the heat generating...
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6822326 |
Wafer bonding hermetic encapsulation
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for...
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6822880 |
Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components
A thin film hydrogen getter and EMI shielding are provided for protecting GaAs circuitry sealed in an hermetic package. The thin film getter comprises a multilayer metal film that is deposited by...
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6822162 |
Microcircuit housing with sloped gasket
A contiguous gasket provides an electromagnetic and environmental seal between the base and lid of a microcircuit housing. The base has a flat surface that allows easy access of tools for...
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