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7618896 |
Semiconductor die package including multiple dies and a common node structure
A semiconductor die package capable of being mounted to a motherboard is disclosed. The semiconductor die package includes a substrate, and a first semiconductor die mounted on the substrate, where...
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7608863 |
Submount assembly and method of preparing optical module
The present invention relates to a submount on which at least one optical component is mounted. The submount has a mounted portion that is mounted onto a substrate or base, and a protruding portion...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7582965 |
Electronic device and method for bonding an electronic device
An electronic device ( 1 ) has a base plate ( 2 ) and an electronics housing ( 3 ) connected thereto, with a bonding contact terminal ( 5 ). The latter is supported relative to the base plate ( 2 )...
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7582919 |
Functional coating of the SCFM preform
The invention relates to a power semiconductor module having at least one semiconductor chip ( 11 ) made of a semiconductor material and having a first and a second main electrode ( 12, 13 ), a...
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7576429 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite...
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7573716 |
Bolster plate assembly for printed circuit board
A bolster plate assembly for a printed circuit board includes a first structure member, a second structure member rotatably mounted to the first structure member, and a plurality of locking...
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7566967 |
Semiconductor package structure for vertical mount and method
In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A...
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7564687 |
Heat dissipation device having a fixing base
A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite...
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7539018 |
Heat sink retaining clip for an electrical connector assembly
An electrical connector assembly is provided that includes a guide frame having an internal compartment configured to receive an electrical component. The guide frame extends a length between a...
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7534979 |
Pressure-contact type rectifier with contact friction reducer
An objective is to provide a pressure-contact type rectifier in which solder that increases the environmental load is not used, and neither burning nor breakage of a rectifying device occurs, even...
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7518233 |
Sealing structure for multi-chip module
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in...
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7511375 |
Semiconductor device carrier unit and semiconductor socket provided therewith
In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7499270 |
Lock for portable music player or other personal electronic device
A portable music player or other personal electronic device locking assembly includes a locking base frame. The locking base frame locks the portable music player or other personal electronic...
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7499269 |
Security clamp lock for notebook computer or other personal electronic device
A notebook/laptop computer or other personal electronic device locking assembly includes a locking base frame. The locking base frame locks the notebook computer or other personal electronic device...
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7498673 |
Heatplates for heatsink attachment for semiconductor chips
An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid...
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7495917 |
Heat dissipation device
A heat dissipation device includes a retention module ( 60 ), a heat sink ( 10 ), a fan bracket ( 50 ), a fan ( 70 ) mounted on the fan bracket, and a pair of wire clips ( 30 ) cooperating with the...
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7476964 |
High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing
A semiconductor device is shown and described which includes a metal can that receives a semiconductor die in an interior thereof. The metal can has a recess formed on a top portion thereof. The...
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7470980 |
Apparatus and method for manufacturing a display device substrate
An apparatus and method for manufacturing a display device substrate are provided. In one embodiment, the apparatus comprises a clamp for clamping an edge of a plastic substrate, and a tension...
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7460372 |
Fixing means for heat dissipater
A fixing means for a heat dissipater is provided to position the heat dissipater and a heat-generating element, which includes a heat-dissipating base and a positioning frame. The surface of the...
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7443681 |
Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator
A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a...
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7443026 |
IC chip package having force-adjustable member between stiffener and printed circuit board
An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener...
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7436670 |
Heat sink retaining device
A heat sink retaining device for attaching a heat sink on a chip unit is provided, which includes a retaining component and a rotating component. The retaining component is locked to the heat sink...
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7436057 |
Elastomer interposer with voids in a compressive loading system
An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit...
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7433194 |
Heat sink fastening assembly
A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg...
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7427813 |
Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package
Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the...
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7426112 |
Heat dissipating module
A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a...
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7414847 |
Heat dissipation device
A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of...
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7409751 |
Clip for heat sink
A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an...
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7397666 |
Wedge lock
Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
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7397663 |
Clip for heat dissipation device
A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the...
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7397120 |
Semiconductor package structure for vertical mount and method
In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A...
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7394658 |
Heat sink with twist lock mounting mechanism
A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external...
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7391615 |
Clip for heat sink
A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a...
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7385822 |
Clip assembly
A clip assembly ( 30 ) for mounting a heat sink ( 20 ) on a printed circuit board ( 10 ) includes a closed annular positioning portion ( 32 ) interferingly engaging with the heat sink, a securing...
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7375963 |
System and method for cooling a module
Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first...
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7375422 |
Stacked-type semiconductor package
Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission...
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7372702 |
Heat spreader
According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a...
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7362575 |
Cooling method use diamond pins and heat pipes
An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal...
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7362573 |
Heat dissipation device
A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for...
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7361880 |
Digital camera module for detachably mounting with flex printed circuit board
A digital camera module ( 100 ) includes a holder, an image sensor chip package ( 30 ), a number of conductive elements ( 24 ) and a circuit board ( 40 ). The holder defines a receiving portion....
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7360586 |
Wrap around heat sink apparatus and method
A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that...
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7358106 |
Hermetic MEMS package and method of manufacture
A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral...
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7324333 |
Lock for notebook computer or other personal electronic device
A notebook/laptop computer or other personal electronic device locking assembly includes a locking base secured to a working surface. The locking base locks the notebook computer or other personal...
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7324155 |
Camera case structure for a mobile communication device
A support structure for reducing shock to a camera module for use in a mobile communications terminal is provided. The mobile communication terminal comprises a camera case for housing the camera...
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7323363 |
Contact load profile modification for a compression socketed CPU
A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top...
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7315443 |
Notebook computer locking base
A notebook/laptop computer locking assembly includes a locking base secured to a working surface. The locking base has a first rear wall to receive a keyboard portion of the notebook computer, with...
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7295445 |
Holder for surface mount device during reflow
Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one...
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7282790 |
Planar array contact memory cards
A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a...
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