|
Match
|
Document |
Document Title |
|
|
7619315 |
Stack type semiconductor chip package having different type of chips and fabrication method thereof
A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first...
|
|
|
7619313 |
Multi-chip module and methods
A substrate includes first and second regions over which first and second semiconductor devices are to be respectively positioned. The first region is located at least partially within the second...
|
|
|
7619308 |
Multi-lid semiconductor package
A multi-lid semiconductor package includes one or more die disposed on a substrate, an interconnect disposed on the substrate, one or more die lids, a die thermal interface between the one or more...
|
|
|
7619303 |
Integrated circuit package
An integrated circuit package is described that includes two dice. The active surface of each die includes a plurality of I/O pads. The active surface of the first die is positioned adjacent first...
|
|
|
7619296 |
Circuit board and semiconductor device
A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface...
|
|
|
7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board
Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a...
|
|
|
7615856 |
Integrated antenna type circuit apparatus
An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes...
|
|
|
7615855 |
IC card and method of manufacturing the same
An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured....
|
|
|
7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing...
|
|
|
7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
|
|
|
7612443 |
Inter-chip communication
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods...
|
|
|
7612439 |
Semiconductor package having improved thermal performance
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
|
|
|
7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
|
|
|
7608921 |
Multi-layer semiconductor package
A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on top of the die. The bottom side of the...
|
|
|
7608920 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
|
|
|
7608919 |
Interconnect packaging systems
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods...
|
|
|
7606042 |
High capacity thin module system and method
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
|
|
|
7606040 |
Memory module system and method
Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of...
|
|
|
7605466 |
Sealed wafer packaging of microelectromechanical systems
Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a...
|
|
|
7605459 |
Coreless substrate and manufacturing thereof
An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper...
|
|
|
7605454 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
|
|
|
7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module
A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting...
|
|
|
7601563 |
Small form factor molded memory card and a method thereof
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer...
|
|
|
7598617 |
Stack package utilizing through vias and re-distribution lines
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
|
|
|
7598606 |
Integrated circuit package system with die and package combination
An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and...
|
|
|
7598123 |
Semiconductor component and method of manufacture
A semiconductor component comprising two stacked semiconductor dice and a method of manufacture. A leadframe having an active area that includes leadframe leads and a cavity is mounted to a support...
|
|
|
7596850 |
Method for temporarily inactivating a wireless communication device
A wireless communication device such as a cell phone is rendered temporarily inoperable by enclosing the device in a container such as a heat sealable bag ( 1 ) which has been metallized so that...
|
|
|
7595550 |
Flex-based circuit module
A form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex...
|
|
|
7592704 |
Etched interposer for integrated circuit devices
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected...
|
|
|
7592702 |
Via heat sink material
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be...
|
|
|
7592696 |
Power module having at least two substrates
The invention relates to a power module 3 and a method for producing it. The power module 3 has a first substrate 1 having power semiconductor chips 4, and a second substrate 2 populated...
|
|
|
7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same
A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the semiconductor module including the active top...
|
|
|
7589400 |
Inverter and vehicle drive unit using the same
The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first...
|
|
|
7586179 |
Wireless semiconductor package for efficient heat dissipation
Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides...
|
|
|
7583511 |
Semiconductor die package with internal bypass capacitors
Embodiments of the present invention provide a computer system that reduces voltage noise for a processor chip. The computer system includes a package which is configured to be sandwiched between...
|
|
|
7582963 |
Vertically integrated system-in-a-package
According to one embodiment of the invention, a method of forming a system-in-a-package includes providing a first substrate, coupling a first die to a top surface of the first substrate, coupling...
|
|
|
7579691 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate...
|
|
|
7579690 |
Semiconductor package structure
A semiconductor package structure relates to a chip-embedded semiconductor package electrically connected to a second semiconductor component. The semiconductor package structure comprises a first...
|
|
|
7579689 |
Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package
An integrated circuit package ( 1 ) comprising first and second dies on a laminate ( 5 ) in a resin encapsulating housing ( 6 ) comprises a digital signal processing integrated circuit ( 8 )...
|
|
|
7579681 |
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
|
|
|
7579260 |
Method of dividing an adhesive film bonded to a wafer
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
|
|
|
7579214 |
Semiconductor device and a method of manufacturing the same
To form a driver circuit to be mounted to a liquid crystal display device or the like on a glass substrate, a quartz substrate, etc., and to provide a display device mounting driver circuits formed...
|
|
|
7576440 |
Semiconductor chip having bond pads and multi-chip package
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
|
|
|
7576433 |
Semiconductor memory device and manufacturing method thereof
A semiconductor memory device has a plurality of core chips and an interface chip, whose specification can be easily changed, while suppressing the degradation of its reliability. The device has an...
|
|
|
7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid...
|
|
|
7576431 |
Semiconductor chip package and multichip package
The present invention provides a multichip package wherein a plurality of semiconductor chip packages ( 100 ) in each of which first electrode pads ( 16 a ) provided in a main surface of a...
|
|
|
7573136 |
Semiconductor device assemblies and packages including multiple semiconductor device components
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g.,...
|
|
|
7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an...
|
|
|
7573107 |
Power module
A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.
|
|
|
7572671 |
Stacked module systems and methods
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a...
|