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9041211 Semiconductor package and method for manufacturing the semiconductor package embedded with semiconductor chip  
A semiconductor package includes a first semiconductor chip including a target circuit surface and a side surface, a first sealing insulating layer including a first surface positioned toward the...
9041184 Chip-housing module and a method for forming a chip-housing module  
A chip-housing module is provided, the chip-housing module including a carrier configured to carry one or more chips; the carrier including a first plurality of openings, wherein each opening of...
9041179 Semiconductor device and method of manufacturing the same  
A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element...
9041176 Hybrid semiconductor module structure  
Some implementations provide a structure that includes a first package substrate, a first component, a second package substrate, a second component, and a third component. The first package...
9041198 Maskless hybrid laser scribing and plasma etching wafer dicing process  
Maskless hybrid laser scribing and plasma etching wafer dicing processes are described. In an example, a method of dicing a semiconductor wafer having a front surface with a plurality of...
9035453 Semiconductor device  
A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut...
9035442 Semiconductor module  
A semiconductor module having a second semiconductor package 200 mounted on a first semiconductor package 100, wherein the first semiconductor package 100 includes: pads 15 formed on the top...
9030002 Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer  
A semiconductor device includes an interface layer, a smooth conductive layer disposed over the interface layer, and a first insulating layer disposed over a first surface of the smooth conductive...
9030006 Integrated circuit package system with internal stacking module  
An integrated circuit package system includes: providing an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a...
9029903 Light emitting diode package and method of manufacturing the same  
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips,...
9024451 Integrated lighting apparatus and method of manufacturing the same  
An integrated lighting apparatus comprises a first control device including a semiconductor substrate, an integrated circuit block formed above a first portion of the semiconductor substrate, and...
9026872 Flexible sized die for use in multi-die integrated circuit  
An integrated circuit (IC) structure can include a first die and a second die. The second die can include a first base unit and a second base unit. Each of the first base unit and the second base...
9024426 Semiconductor device and method of manufacturing the same  
Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device includes an interposer and a first semiconductor package comprising a first substrate, and a...
9024420 Power quad flat no-lead (PQFN) package  
Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One...
9013040 Memory device with die stacking and heat dissipation  
A memory device with die stacking is provided. A plurality of substrates layers are stacked together into a stack. Each substrate layer may include a substrate having a plurality of cavities to...
9006872 Semiconductor chip package having via hole and semiconductor module thereof  
In one embodiment, a semiconductor chip package includes an insulation frame having an opening part formed in a center thereof and a via hole formed around the opening part; a semiconductor chip...
9006908 Integrated circuit interposer and method of manufacturing the same  
Systems and methods are provided for an interposer for coupling two or more integrated circuit dies to a circuit package. A first integrated circuit portion is disposed on a first location of a...
9006876 Semiconductor apparatus and manufacturing method thereof  
A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates...
9006882 Semiconductor device and method of forming recessed conductive vias in saw streets  
A semiconductor die has an insulating material disposed in a peripheral region around the die. A blind via is formed through the gap. A conductive material is deposited in the blind via to form a...
9006889 Flip chip packages with improved thermal performance  
Systems and methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal...
9003637 Method of manufacturing a microphone assembly  
A method of manufacturing a microphone assembly having an ear set function includes assembling a mike cell unit; obtaining a region for connection with the mike cell unit on a PCB, mounting only a...
9000583 Multiple die in a face down package  
A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and...
9000497 Trench MOSFET having an independent coupled element in a trench  
A trench MOSFET is disclosed that includes a semiconductor substrate having a vertically oriented trench containing a gate. The trench MOSFET further includes a source, a drain, and a conductive...
8994163 Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices  
Stacked semiconductor devices, semiconductor assemblies, methods of manufacturing stacked semiconductor devices, and methods of manufacturing semiconductor assemblies. One embodiment of a...
8987009 Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product  
A method for tracking an interposer die of a stacked silicon interconnect technology (SSIT) product includes forming a plurality of dummy components on the interposer die, and modifying one or...
8989411 Differential microphone with sealed backside cavities and diaphragms coupled to a rocking structure thereby providing resistance to deflection under atmospheric pressure and providing a directional response to sound pressure  
A vacuum sealed directional microphone and methods for fabricating said vacuum sealed directional microphone. A vacuum sealed directional microphone includes a rocking structure coupled to two...
8987884 Package assembly and methods for forming the same  
A device includes a first package component, and a second package component underlying the first package component. The second package component includes a first electrical connector at a top...
8987787 Semiconductor structure and method for manufacturing the same  
A semiconductor structure includes first and second chips assembled to each other. The first chip includes N of first conductive lines, M of second conductive lines disposed on the first...
8987885 Packaged microdevices and methods for manufacturing packaged microdevices  
Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors...
8987883 Semiconductor package with multiple conductive clips  
One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor and a sync transistor disposed on a common leadframe pad,...
8981546 Semiconductor package  
A semiconductor package and a carrier for a semiconductor package are provided, the carrier having a top surface and a bottom surface separated by side walls. The carrier includes a seat for a...
8981539 Packaged power semiconductor with interconnection of dies and metal clips on lead frame  
A power semiconductor device comprises a lead frame unit, a control die, a first MOSFET die and a second MOSFET die, wherein the lead frame unit comprises at least a die paddle for mounting the...
8981881 Stacked module  
A stacked module includes a first multilayer substrate including an opening having a stepwise wall face, and a first transmission line including a first grounding conductor layer, a second...
8980691 Semiconductor device and method of forming low profile 3D fan-out package  
A semiconductor device includes a substrate having an insulating layer and a conductive layer embedded in the insulating layer. The conductive layer is patterned to form conductive pads or...
8975752 Multiple access over proximity communication  
A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on...
8975755 Chip package  
An embodiment of the disclosure provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface...
8975758 Semiconductor package having interposer with openings containing conductive layer  
A semiconductor package includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first...
8975507 Solar cell module  
A solar cell module includes a plurality of solar cells, whereby in each solar cell a conductive adhesive film includes a first portion contacting a back electrode current collector and a second...
8969140 Embedded semiconductive chips in reconstituted wafers, and systems containing same  
A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are embedded in the rigid mass. The plurality...
8970020 Semiconductor device  
Provided is a semiconductor device which includes a bonding wire, one end of which is connected to a bipolar device, the other end of which is connected to a conductive member, and the center of...
8963304 Semiconductor device and semiconductor device mounting structure  
A semiconductor device includes a plurality of functional element chips, an electric connection member joined to two of the functional element chips, a first wire and a resin configured to cover...
8963307 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Compact device package
 
Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another....
8963314 Packaged semiconductor product and method for manufacture thereof  
Packaged semiconductor product (2) including a first semiconductor device (4A) and a packaging structure with a protective envelope (6) and a first and second external electrode (8,10). The first...
8963318 Packaged semiconductor device  
A packaged semiconductor device includes a substrate including a first major surface, a second major surface, first vias running between the first major surface and the second major surface, first...
8952527 Semiconductor device and manufacturing method thereof  
Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory...
8951858 Imager device with electric connections to electrical device  
An imager device is disclosed including a first substrate having an array of photo-sensitive elements formed thereon, a first conductive layer formed above the first substrate, a first conductive...
8952533 Devices and methods for 2.5D interposers  
Polyimide-based redistribution layers (RDLs) can be employed to reduce thermo-mechanical stress that is exerted on conductive interconnections bonded to interposers in 2.5 D semiconductor...
8951834 Methods of forming solder balls in semiconductor packages  
Methods of forming solder balls for semiconductor packages using film-assisted molding include providing a substrate, forming a plurality of solder balls on the substrate where each solder ball...
8952540 In situ-built pin-grid arrays for coreless substrates, and methods of making same  
A coreless pin-grid array (PGA) substrate includes PGA pins that are integral to the PGA substrate without the use of solder. A process of making the coreless PGA substrate integrates the PGA pins...
8946882 Semiconductor module and semiconductor device  
A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate,...