Matches 401 - 450 out of 1664 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
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7145247 Offset-bonded, multi-chip semiconductor device  
The present invention is aimed at bonding a lower chip and an upper chip through bumps in a highly reliable manner, while ensuring a sufficient area for an external connection terminal region, by...
7145226 Scalable microelectronic package using conductive risers  
This invention relates to an apparatus and methods for increasing the microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package...
7145224 Semiconductor device  
In the semiconductor device, a control power MOSFET chip 2 is disposed on the input-side plate-like lead 5 , and the drain terminal DT 1 is formed on the rear surface of the chip 2 , and the...
7141875 Flexible multi-chip module and method of making the same  
A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in...
7138712 Receptacle for a programmable, electronic processing device  
A processing device embodied in an integrated circuit may be divided into first and second functional units. A mount for the integrated circuit may be assigned to the first functional unit, which...
7138708 Electronic system for fixing power and signal semiconductor chips  
An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.
7138709 Microelectronic package array  
This invention relates to an apparatus and method for increasing microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package...
7132752 Semiconductor chip and semiconductor device including lamination of semiconductor chips  
To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side...
7132753 Stacked die assembly having semiconductor die overhanging support  
A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a...
7132739 Encapsulated stack of dice and support therefor  
Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports...
7132746 Electronic assembly with solder-bonded heat sink  
A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive...
7129583 Multi-chip package structure  
The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first...
7126214 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements  
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable...
7126219 Small memory card  
A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots of the substrate, then the...
7122907 Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor dice  
A method and apparatus for increasing the integrated circuit density in a flip chip semiconductor device assembly and decreasing the time for dielectrically filling such assembly using less...
7122882 Low cost power MOSFET with current monitoring  
A semiconductor integrated circuit package having a common source current sensing circuit includes a main die having an integrated circuit, the main die including a source bonding pad and a gate...
7122829 Probe look ahead: testing parts not currently under a probehead  
A semiconductor substrate, probe card, and methods for stressing and testing dies on a semiconductor substrate are provided. The semiconductor substrate, typically a semiconductor wafer, comprises...
7122912 Chip and multi-chip semiconductor device using thereof and method for manufacturing same  
The chip for the multi-chip semiconductor device having the markings for alignment formed on the front surface and/or the back surface of the chip only by the processing from the front surface of...
7119427 Stacked BGA packages  
Provided are double stacked and multiple stacked BGA packages in which two or more BGA packages are stacked to increase the packaging density. Each of the individual BGA packages included in the...
7119428 Semiconductor device  
A semiconductor device capable of reducing a temperature increase during operation thereof is provided. In the semiconductor device, an interface chip is stacked on a plurality of stacked...
7119425 Stacked multi-chip semiconductor package improving connection reliability of stacked chips  
The chip package includes a first and second semiconductor chip. The first semiconductor chip has a first connection structure that electrically connects to a bond pad on a first surface of the...
7120027 Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures  
Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat...
7119436 Memory module  
The memory module includes a plurality of memory units, each of which include a memory substrate, at least a memory chip having a predetermined memory capacity mounted on the memory substrate, and...
7119445 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board  
An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such...
7119426 Semiconductor device and manufacturing method of same  
In a semiconductor device in which a second semiconductor chip is layered on a first semiconductor chip mounted on a substrate, a mounting-use bonding layer being formed on a reverse surface of the...
7115983 Multilayer, thin-film electronic devices  
Multilayer thin-film electronics are manufactured at high speed, even while the various component functions are manufactured separately under conditions tailored to optimize component performance...
7112878 Die stacking scheme  
An improved die stacking scheme is provided. In accordance with one embodiment of the present invention, a multiple die semiconductor assembly is provided comprising a substrate, first and second...
7109576 Semiconductor component having encapsulated die stack  
A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first...
7109560 Micro-electromechanical system and method for production thereof  
A micro-electromechanical system comprises a substrate (S) and at least two micro-elements ( 1, 2 ) of which a first is bistably switchable. The micro-elements ( 1, 2 ) have faces ( 3 a, 4 a )...
7109575 Low-cost flexible film package module and method of manufacturing the same  
Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package...
7106600 Interposer device  
The present invention provides devices and techniques for replacing at least one processor in a multi-processor computer system with an interposer device that maintains at least some of the...
7102238 Semiconductor device and manufacturing method thereof  
A stacked MCM is manufactured at reduced cost without using expensive apparatus. A first wiring and a second wiring are formed on a surface of a semiconductor chip of a first semiconductor device...
7102227 Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof  
A passive element chip permits a reduced size and a higher packaging density to be achieved. The passive element chip has a substrate, a plurality of passive elements formed by metal wires on the...
7102224 Encapsulated component and method for the production thereof  
A component includes a chip having a first chip face and a second chip face, where the first chip face includes component structures and connector metallizations associated with the component...
7098544 Edge seal for integrated circuit chips  
A structure for a chip or chip package is disclosed, with final passivation and terminal metallurgy which are mechanically decoupled but electrically coupled to the multilayer on-chip...
7098534 Sacrificial component  
A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some...
7095104 Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same  
An approach to DRAM memory chip packaging leveraging the chip center position for wire bond pads to minimize time-of-flight and impedance effects resulting from stacking in a BGA application. A top...
7091607 Semiconductor package  
A semiconductor package includes a substrate, a chip, and at least one capacitor. The chip adheres to the substrate and has an active surface, a grounding area disposed on the active surface and at...
7091605 Highly moisture-sensitive electronic device element and method for fabrication  
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a...
7091606 Circuit device and manufacturing method of circuit device and semiconductor module  
After a trench 54 is formed in a conductive foil 60 , the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being...
7091620 Semiconductor device and manufacturing method thereof  
A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings...
7091587 Semiconductor device  
An electrode on a main surface of a module board, to which an emitter electrode of a semiconductor chip which includes a switching element of a power supply control circuit that supplies a power...
7091623 Multi-chip semiconductor package and fabrication method thereof  
A multi-chip semiconductor package and a fabrication method thereof are provided. A substrate having an upper surface and a lower surface is prepared. At least a first chip is mounted on the upper...
7091588 Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation  
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
7091061 Method of forming a stack of packaged memory dice  
A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor...
7087992 Multichip wafer level packages and computing systems incorporating same  
The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die contained...
7084513 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same  
A semiconductor device includes a first semiconductor chip ( 5 ) having a first terminal ( 7 ) on one surface, a second semiconductor chip ( 1 a ) which is larger than the first semiconductor chip...
7084512 Circuit substrate and its manufacturing method  
A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the...
7081671 Power module  
In a power module ( 111 ), a free-wheeling diode ( 1 A), an IGBT ( 1 B), and a capacitor ( 20 ) for smoothing direct current are disposed directly on a surface ( 2 BS) of a conductive heat sink ( 2...
7078788 Microelectronic substrates with integrated devices  
A microelectronic substrate including at least one microelectronic device disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within...
Matches 401 - 450 out of 1664 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >