Matches 351 - 400 out of 1664 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7208832 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device  
A semiconductor device includes a plurality of insulating layers laminated on a substrate to cover passive elements such as a capacitor, an inductor, and the like, and to fix an IC chip in a face...
7208828 Semiconductor package with wire bonded stacked dice and multi-layer metal bumps  
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
7208825 Stacked semiconductor packages  
A semiconductor package and a fabrication method thereof are provided in which a chip is mounted on a substrate, and a dielectric layer is applied over the substrate and chip, with bond fingers...
7205655 Multilayer circuit including stacked layers of insulating material and conductive sections  
The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate...
7205178 Land grid array packaged device and method of forming same  
A method of packaging an integrated circuit die ( 12 ) includes the steps of providing a foil sheet ( 30 ) and forming a layer of solder ( 32 ) on a first side of the foil sheet. A first side of...
7205656 Stacked device package for peripheral and center device pad layout device  
An assembly method is disclosed that includes providing a substrate, securing a first semiconductor device on a first surface thereof, and superimposing at least a second semiconductor device at...
7205646 Electronic device and chip package  
The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is...
7202557 Co-packaged control circuit, transistor and inverted diode  
A copackaged electronic device comprises a diode device having an anode coupled to a drain electrode of a switching device and a cathode capable of being coupled to an external circuit. The...
7202556 Semiconductor package having substrate with multi-layer metal bumps  
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
7202545 Memory module and method for operating a memory module  
A memory module has an electronic printed circuit board and a plurality of semiconductor memory chips. A series circuit of the semiconductor memory chips is formed with the aid of two leads that...
7199458 Stacked offset semiconductor package and method for fabricating  
In the stacked semiconductor package, on a first semiconductor chip, a second semiconductor chip is stacked offset such that a portion of the first semiconductor chip is exposed. At least one first...
7199468 Hybrid integrated circuit device with high melting point brazing material  
In order to prevent short-circuiting when a chip component is brazed to pads of a conductive wiring layer, a hybrid semiconductor circuit includes the chip component with terminal electrodes formed...
7199459 Semiconductor package without bonding wires and fabrication method thereof  
A semiconductor package without bonding wires and a fabrication method are provided. The semiconductor package includes a substrate having a front surface and a back surface, two chips formed on...
7200022 Apparatus and method for mounting microelectronic devices on a mirrored board assembly  
The present invention is directed to a system, a module, and an apparatus and method for forming a microelectronic memory device. In one embodiment, a system includes a processor and a controller...
7195957 Packaged microelectronic components  
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
7196412 Multi-chip press-connected type semiconductor device  
A multi-chip press-connected type semiconductor device comprises: a plurality of active element chips to control an electric current flowing in one direction; a plurality of diode chips that...
7196411 Heat dissipation for chip-on-chip IC packages  
Disclosed herein are IC package devices and related methods of manufacturing. In one embodiment, an package device includes first and second package substrates, and a first IC chip having at least...
7196418 Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device  
A semiconductor device includes a semiconductor element having a plurality of electrodes provided on one principal surface thereof and a wiring substrate having a conductive layer on an insulating...
7196427 Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element  
Two or more semiconductor packages are stacked with an intervening element that is positioned between within an area surrounded by conductive bumps of a bottom surface of the overlying package....
7193306 Semiconductor structure having stacked semiconductor devices  
A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of...
7193311 Multi-chip circuit module and method for producing the same  
A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A...
7190060 Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same  
A three-dimensional stacked semiconductor package device includes first and second semiconductor package devices and a conductive bond. The first device includes a first insulative housing, a first...
7190070 Modular power semiconductor module  
A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load...
7183643 Stacked packages and systems incorporating the same  
A microelectronic assembly incorporates units stacked one above the other and may include a plurality of similar stacks mounted to a circuit board. Some of the stacks may be inverted, rotated or...
7183616 High speed switching MOSFETS using multi-parallel die packages with/without special leadframes  
This invention discloses a method for configuring a power MOSFET package by packaging several paralleled and separated MOSFET chips in the assembly. The method further includes a step of connecting...
7180180 Stacked device underfill and a method of fabrication  
Numerous embodiments of a stacked device underfill and a method of formation are disclosed. In one embodiment, a method of forming stacked semiconductor device with an underfill comprises forming...
7180171 Single IC packaging solution for multi chip modules  
A multilayer printed circuit board (PCB) interface includes a top PCB layer, a middle PCB layer, and a bottom PCB layer. A top surface of the top PCB layer receives at least one top module. The...
7180167 Low profile stacking system and method  
The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of a...
7176560 Semiconductor device having a chip—chip structure  
A semiconductor device having a chip-on-chip structure wherein; a first semiconductor chip with a memory macro control circuit where a plurality of inter-chip connection terminals and a plurality...
7176565 Capacitors having separate terminals on three or more sides  
A multilayer capacitor comprises separate terminals on at least three sides, and on as many as six sides. The capacitor can be fabricated in a large number of different configurations, types, and...
7176506 High frequency chip packages with connecting elements  
A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame...
7173325 Expansion constrained die stack  
Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection...
7173328 Integrated circuit package and method having wire-bonded intra-die electrical connections  
A semiconductor package having a substrate mounted die. The die configured having active circuit components and a top surface having bond pads electrically connected with circuitry of the die. The...
7170121 Computer system architecture using a proximity I/O switch  
One embodiment of the present invention provides a proximity I/O switch, which is configured to transfer data between the components in a computer system. This proximity I/O switch is comprised of...
7170157 Semiconductor package having multiple embedded chips  
A semiconductor package includes multiple embedded chips, each chip including a common circuit having substantially the same common function. The common circuit in a selected one of the chips is...
7170153 Semiconductor device and its manufacturing method  
In order to manufacture a thin and small semiconductor device at low cost, the semiconductor device and its manufacturing method are disclosed. The semiconductor device comprises: a film wiring...
7170183 Wafer level stacked package  
Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper...
7170091 Probe look ahead: testing parts not currently under a probehead  
A semiconductor substrate, probe card, and methods for stressing and testing dies on a semiconductor substrate are provided. The semiconductor substrate, typically a semiconductor wafer, comprises...
7166915 Multi-chip module system  
Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed...
7161810 Stacked chip electronic package having laminate carrier and method of making same  
A multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The...
7161249 Multi-chip package (MCP) with spacer  
A multi-chip package includes a substrate having first bonding pads and second bonding pads, a first chip having chip pads on an active surface, spacers attached to the substrate between the first...
7157309 Manufacture of microelectronic fold packages  
An elongated strip of a sheetlike substrate bearing microelectronic elements such as semiconductor chips is advanced in a downstream direction through one or more folding stations where successive...
7154173 Semiconductor device and manufacturing method of the same  
This invention miniaturizes a package of a semiconductor device and simplifies a manufacturing procedure to reduce a manufacturing cost. A semiconductor wafer formed of a plurality of semiconductor...
7154186 Multi-flip chip on lead frame on over molded IC package and method of assembly  
A multichip module package uses bond wire with plastic resin on one side of a lead frame to package an integrated circuit and flip chip techniques to attach one or more mosfets to the other side of...
7154175 Ground plane for integrated circuit package  
An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround...
7148562 Power semiconductor device and power semiconductor module  
A plurality of power semiconductor chips (power transistors or the like) are arranged, being separated from each other with a free space of a terminal board interposed therebetween. A radiating...
7148578 Semiconductor multi-chip package  
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
7148563 Multi-chip package for reducing parasitic load of pin  
A multi-chip package includes first through Nth semiconductor chips, each of which includes an input/output pad, an input/output driver coupled to the input/output pad, and an internal circuit....
7148567 Semiconductor integrated circuit device  
A semiconductor integrated circuit device has two semiconductor integrated circuit chips ( 20 and 30 ) respectively provided with a plurality of PADs ( 40 a –40 e, 41 a –41 e and 42 a...
7145779 Memory module  
A memory module includes a plurality of memory units and an assembling holder. Each of the memory units includes a memory substrate, at least a memory chipset having a predetermined memory capacity...
Matches 351 - 400 out of 1664 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >