Matches 301 - 350 out of 1660 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7271470 Electronic component having at least two semiconductor power devices  
An electronic component includes at least two vertical semiconductor power devices and an electrically conductive contact clip. Each vertical semiconductor device has a first side with at least one...
7265451 Semiconductor and method for producing a semiconductor  
A semiconductor device comprises at least one first semiconductor component being located in a first plane and comprising an active area which has a first contact region and at least one second...
7259459 Semiconductor module and DC-DC converter  
A semiconductor module includes a supporting substrate having a connecting section on a first major surface thereof. A first semiconductor chip includes a first MIS transistor a source of which is...
7259450 Double-packaged multi-chip semiconductor module  
A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence...
7256484 Memory expansion and chip scale stacking system and method  
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance...
7253091 Process for assembling three-dimensional systems on a chip and structure thus obtained  
A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or...
7250675 Method and apparatus for forming stacked die and substrate structures for increased packing density  
A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and...
7250677 Die package structure  
The present invention relates to a die package structure. The package structure comprises a first substrate, a first die, a sub-package and a first molding compound. The first die is disposed on...
7250676 Multi-package module with heat spreader  
A multi-package module (MPM) with a heat spreader is disclosed, which comprises a substrate, a chip, a plurality of chip scale packages (CSP), and a heat spreader. The CSPs are disposed on the...
7250684 Circular wire-bond pad, package made therewith, and method of assembling same  
A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also...
7247934 Multi-chip semiconductor package  
A multi-chip semiconductor package and a fabrication method thereof are provided. At least one first chip is mounted on and electrically connected to an upper surface of a substrate via solder...
7247950 Semiconductor device and method of manufacturing the same  
A semiconductor device comprises a frame provided on a substrate to form a semiconductor-chip accommodating part on the substrate. A semiconductor chip is provided in the semiconductor-chip...
7247945 Semiconductor apparatus  
A semiconductor apparatus includes a printed circuit board, a peripheral type first semiconductor package which has a first group of ball electrodes arranged in a peripheral type first arrangement...
7247932 Chip package with capacitor  
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor...
7242092 Substrate assembly with direct electrical connection as a semiconductor package  
A substrate assembly with direct electrical connection as a semiconductor package is disclosed, which includes a carrier structure formed with at least a cavity; at least a semiconductor chip...
7242091 Stacked semiconductor packages and method therefor  
A stackable semiconductor package and method includes providing a first semiconductor package having a first plurality of lower leads and a first plurality of upper leads. A second semiconductor...
7239029 Packages for semiconductor die  
A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the...
7235885 Semiconductor device and method of manufacturing the same, circuit board and electronic device  
A semiconductor device includes a wiring board having a wiring pattern, a semiconductor chip that has an integrated circuit and is mounted on a first surface of the wiring board to electrically...
7235871 Stacked microelectronic dies  
An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device...
7233065 Semiconductor device having capacitors for reducing power source noise  
A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip...
7230320 Electronic circuit device with reduced breaking and cracking  
In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness...
7230329 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device  
A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes onto lands, which are formed on a first carrier substrate,...
7227258 Mounting structure in integrated circuit module  
Embodiments of the present invention may include an integrated circuit module structure for a high-density mounting. An embodiment may include a wiring board, having a mounting space with a...
7227251 Semiconductor device and a memory system including a plurality of IC chips in a common package  
A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable...
7227240 Semiconductor device with wire bond inductor and method  
A semiconductor device ( 10 ) includes a semiconductor die ( 20 ) and an inductor ( 30, 50 ) formed with a bonding wire ( 80 ) attached to a top surface ( 21 ) of the semiconductor die. The bonding...
7227252 Semiconductor component having stacked, encapsulated dice and method of fabrication  
A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first...
7227259 Low-inductance circuit arrangement for power semiconductor modules  
A circuit arrangement for a power semiconductor module provides low parasitic inductances and low loss. An electrically insulating substrate supports metallic ribbon connectors which in turn power...
7227198 Half-bridge package  
A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The...
7227249 Three-dimensional stacked semiconductor package with chips on opposite sides of lead  
A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on...
7224075 Methods and systems for attaching die in stacked-die packages  
A system and a method for producing a multiple-die device by attaching a die to a substrate using a first die-attach material having a first processing temperature and attaching a subsequent die...
7224052 IC card with controller and memory chips  
An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip...
7224062 Chip package with embedded panel-shaped component  
A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical...
7224053 Semiconductor device responsive to different levels of input and output signals and signal processing system using the same  
A semiconductor device which integrates a plurality of semiconductor chips into a single package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip...
7221043 Integrated circuit carrier with recesses  
An integrated circuit carrier includes a wafer having a receiving zone. The receiving zone is demarcated by a bore in the wafer. A plurality of island-defining portions is arranged about the...
7217995 Apparatus for stacking electrical components using insulated and interconnecting via  
An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active...
7217993 Stacked-type semiconductor device  
A stacked-type semiconductor device includes a first wiring substrate on which a semiconductor device element is mounted, a second wiring substrate stacked on the first wiring substrate through a...
7217994 Stack package for high density integrated circuits  
A stack package for a high density memory module includes at least one memory chip, an ASIC and an interposer, wherein the interposer comprises a first surface having contacts arranged in...
7215021 Electronic device  
The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member...
7215026 Semiconductor module and method of forming a semiconductor module  
In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the...
7215022 Multi-die module  
A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die...
7211885 Vertical electrical interconnections in a stack  
In a memory and/or data processing device having at least two stacked layers which are supported by a substrate or forming a sandwiched self-supporting structure, wherein the layers include memory...
7211884 Implantable medical device construction using a flexible substrate  
A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating “chip-and-wire” microelectronic circuits...
7211900 Thin semiconductor package including stacked dies  
A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric...
7208758 Dynamic integrated circuit clusters, modules including same and methods of fabricating  
A semiconductor wafer or other bulk semiconductor substrate having a plurality of dice thereon is manufactured using conventional processing techniques. The wafer is subjected to testing to...
7208833 Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate  
An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor...
7208824 Land grid array module  
Disclosed is a land grid array module comprising: a substrate; a plurality of active and passive components mounted on both sides of the substrate; and a molding compound for encapsulating the both...
7208832 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device  
A semiconductor device includes a plurality of insulating layers laminated on a substrate to cover passive elements such as a capacitor, an inductor, and the like, and to fix an IC chip in a face...
7208828 Semiconductor package with wire bonded stacked dice and multi-layer metal bumps  
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
7208825 Stacked semiconductor packages  
A semiconductor package and a fabrication method thereof are provided in which a chip is mounted on a substrate, and a dielectric layer is applied over the substrate and chip, with bond fingers...
7205655 Multilayer circuit including stacked layers of insulating material and conductive sections  
The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate...
Matches 301 - 350 out of 1660 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >