|
Match
|
Document |
Document Title |
|
|
7629684 |
Adjustable thickness thermal interposer and electronic package utilizing same
An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively...
|
|
|
7629682 |
Wafer level package configured to compensate size difference in different types of packages
A wafer level package including a semiconductor chip having a plurality of bonding pads on a front surface thereof; a lower insulation layer formed on the semiconductor chip to expose the bonding...
|
|
|
7626259 |
Heat sink for a high capacity thin module system
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
|
|
|
7622803 |
Heat sink assembly and related methods for semiconductor vacuum processing systems
An assembly for supporting a substrate during vacuum processing operations includes a thermally conductive heat sink tray including at least one wafer pocket recessed therein, and a thermally...
|
|
|
7615862 |
Heat dissipating package structure and method for fabricating the same
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second...
|
|
|
7612446 |
Structures to enhance cooling of computer memory modules
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at...
|
|
|
7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply...
|
|
|
7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
|
|
|
7608923 |
Electronic device with flexible heat spreader
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat...
|
|
|
7602060 |
Heat spreader in a flip chip package
A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface...
|
|
|
7595540 |
Semiconductor device and method of manufacturing the same
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
|
|
|
7589401 |
Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components
A hermetically sealed package for electronic circuit components includes a generally hollow, titanium body, having a reduced thickness bottom wall/floor, whose interior surface is laminated with a...
|
|
|
7586191 |
Integrated circuit apparatus with heat spreader
An integrated circuit apparatus with heat removal has an electrical interconnection network. The electrical interconnection network has a plurality of electrically and thermally conductive vias in...
|
|
|
7582959 |
Driver module structure with flexible circuit board
A driver module structure includes a flexible circuit board ( 2 ) provided with a wiring pattern ( 7 ), a semiconductor device mounted on the flexible circuit board ( 2 ), and an electrically...
|
|
|
7579687 |
Circuit module turbulence enhancement systems and methods
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
|
|
|
7579686 |
Thermal interface material with hotspot heat remover
The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material is described. In one embodiment, the heat spreader includes a surface having a...
|
|
|
7573131 |
Die-up integrated circuit package with grounded stiffener
A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate...
|
|
|
7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein
A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each...
|
|
|
7564124 |
Semiconductor die package including stacked dice and heat sink structures
A semiconductor package including stacked packages is disclosed. The semiconductor die package includes a first heat sink structure, a first semiconductor die attached to the first heat sink...
|
|
|
7557442 |
Power semiconductor arrangement
A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is...
|
|
|
7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
A stacked die package includes a substrate ( 210, 310 ), a first die ( 220, 320 ) above the substrate, a spacer ( 230, 330 ) above the first die, a second die ( 240, 340 ) above the spacer, and a...
|
|
|
7554808 |
Heat sink with thermoelectric module
An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with...
|
|
|
7554179 |
Multi-leadframe semiconductor package and method of manufacture
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached...
|
|
|
7547966 |
Power semiconductor module
A power semiconductor module with its thermal resistance and overall size reduced. Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power...
|
|
|
7528413 |
Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly...
|
|
|
7521789 |
Electrical assembly having heat sink protrusions
An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its...
|
|
|
7521794 |
Intrinsic thermal enhancement for FBGA package
A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the...
|
|
|
7521791 |
Method and apparatus for dissipating heat from an integrated circuit
An apparatus ( 100 ) is provided for dispersing heat from an integrated circuit ( 202 ) to a heat sink ( 404 ). The apparatus ( 100 ) is formed on a nonconductive body ( 102 ) having at least two...
|
|
|
7518233 |
Sealing structure for multi-chip module
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in...
|
|
|
7514782 |
Semiconductor device
An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation...
|
|
|
7508066 |
Heat dissipating semiconductor package and fabrication method thereof
A heat dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted on a chip carrier. A heat sink is mounted on the chip, and includes an...
|
|
|
7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
|
|
|
7505109 |
Heat dissipation structure of backlight module
The heat dissipation structure of the backlight module of the present invention comprises a circuit board, a heat-conductive element (such as thermally conductive glue) and a light-emitting diode...
|
|
|
7502398 |
Thermally tuned diode-laser bar package
A directly cooled diode-laser bar package includes a diode-laser bar bonded to a heat-sink. The operating temperature of the diode-laser bar can be selectively varied by varying the thermal...
|
|
|
7479695 |
Low thermal resistance assembly for flip chip applications
An assembly comprises a stiffener, a circuit substrate and an integrated circuit (IC) chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers the...
|
|
|
7476967 |
Composite carbon nanotube thermal interface device
Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may...
|
|
|
7464462 |
Method of forming anisotropic heat spreading apparatus for semiconductor devices
A method for forming a heat spreading apparatus for semiconductor devices is disclosed. The method includes extruding a frame material to form multiple individual cells including fillable openings...
|
|
|
7456052 |
Thermal intermediate apparatus, systems, and methods
Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached...
|
|
|
7446408 |
Semiconductor package with heat sink
A package is provided for a semiconductor device including a semiconductor device support substrate having at least one interconnect metal therein connectible to a ground and having at least one...
|
|
|
7446410 |
Circuit module with thermal casing systems
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the...
|
|
|
7446412 |
Heat sink design using clad metal
Some aspects include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and...
|
|
|
7443683 |
Cooling apparatus for electronic devices
In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core...
|
|
|
7439618 |
Integrated circuit thermal management method and apparatus
An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An...
|
|
|
7436669 |
3D multi-layer heat conduction diffusion plate
A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can...
|
|
|
7429502 |
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink
An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically...
|
|
|
7427807 |
Chip heat dissipation structure and manufacturing method
This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central...
|
|
|
7425762 |
Electronic apparatus
The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating...
|
|
|
7416789 |
Refractory metal substrate with improved thermal conductivity
A substrate for semiconductor and integrated circuit components including:
a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material,...
|
|
|
7405448 |
Semiconductor device having a resistance for equalizing the current distribution
A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the...
|
|
|
7400035 |
Semiconductor device having multilayer printed wiring board
A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support...
|