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7626251 |
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
A microelectronic die assembly. The die assembly includes a microelectronic die, and a thermally conductive element attached to the backside of the die with a thermal interface material. The...
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7626822 |
Heat sink assembly for multiple electronic components
A heat sink assembly for removing heat from a plurality arrays of heat generating-components mounted on a printed circuit board includes a fist and a second heat sink, a plurality of fastening...
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7626823 |
Heat sink assembly
A heat sink assembly includes a first heat sink, a second heat sink, and a wire clip connecting the first and second heat sinks together. Each of the first and second heat sinks includes a base and...
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7623350 |
Thermal conducting medium protector
A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector...
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7619893 |
Heat spreader for electronic modules
A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second...
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7616444 |
Gimballed attachment for multiple heat exchangers
One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint...
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7612446 |
Structures to enhance cooling of computer memory modules
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at...
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7612992 |
Cooling device for memory chips
A cooling device for memory chip includes a first part and a second part which is pivotably connected to the first part at a top thereof. Each of the first and second parts includes an elongate...
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7613005 |
Mounting device for mounting heat sink onto electronic component
A mounting device ( 10 ) for mounting a heat sink ( 40 ) onto a printed circuit board ( 60 ) with a heat generating electronic component ( 50 ) mounted thereon. The mounting device includes a...
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7609522 |
Heat sink assembly
A heat sink assembly ( 10 ) compatible with an ATX motherboard ( 20 ) and a BTX motherboard ( 30 ), includes a heat sink and a plurality of fasteners ( 15 ) extending through the heat sink. The...
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7606030 |
Heat dissipation device
A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally...
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7606033 |
Mounting a heat sink in thermal contact with an electronic component
A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the...
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7606036 |
Heat dissipation device
A heat dissipation device includes a thermal attach block ( 10 ), a heat pipe ( 30 ) thermally attached to the block, and a fin unit ( 90 ) thermally attached to the heat pipe. The block includes a...
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7606031 |
Heat dissipating device
A heat dissipating device includes a circuit board ( 23 ), an electronic component ( 24 ) being arranged on the circuit board, a base ( 211 ) being thermally attached to the electronic component,...
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7595993 |
Mounting structure with heat sink for electronic component and female securing member for same
A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each...
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7592688 |
Semiconductor package
A multi-chip semiconductor package that includes two power semiconductor devices arranged in a half-bridge configuration between two opposing circuit boards.
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7592698 |
Power semiconductor modules having a cooling component and method for producing them
An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal...
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7593228 |
Technique for forming a thermally conductive interface with patterned metal foil
A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive...
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7589967 |
Heat dissipation device
A heat dissipation device includes a heat sink ( 10 ) for contacting a heat-generating component and a fan ( 20 ) mounted to the heat sink. The fan includes a frame ( 22 ) and a motor ( 24 )...
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7589418 |
Pressure contact power semiconductor module
A power semiconductor module in a pressure contact embodiment, for disposition on a cooling component, in which load terminals are formed as metal molded bodies, each with at least one flat portion...
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7589972 |
Electrical connector with clip mechanism
An electrical connector assembly ( 100 ) made in accordance with a preferable embodiment of the present invention comprises an electrical socket ( 20 ) with a plurality of contacts received...
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7583505 |
Processor apparatus
A processor apparatus is disclosed. The apparatus includes a case with air passages, and a heat dissipation plate structure having a thermally conductive material within the case. It includes a...
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7583504 |
Cooling assembly
A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the...
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7580265 |
Heat sink, circuit board, and electronic apparatus
A heat sink that radiates n exoergic circuit elements mounted on a circuit board includes a housing that has a heat-receiving surface that receives heat from the n exoergic circuit elements, and...
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7576989 |
Heat sink assembly having supporting clip
A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each fastener comprises a bolt and a...
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7576987 |
Clip for heat dissipation device
A clip includes a body with a first end and a second end, an actuating member pivotally coupled to the second end of the body via a pivot, and a movable fastener pivotally coupled to the actuating...
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7569928 |
Assembly structure of electronic element and heat sink
An assembly structure of an electronic element and a heat sink is disclosed. An assembly structure of an electronic element and a heat sink comprises a fastening element, an electronic element...
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7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein
A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each...
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7564687 |
Heat dissipation device having a fixing base
A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite...
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7564689 |
Clip for heat sink
A clip ( 100 ) includes a body ( 10 ), a handle ( 30 ) and a movable fastener ( 20 ). The body has a first end terminating in a supporting portion ( 16 ) and a second end terminating in a latching...
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7557442 |
Power semiconductor arrangement
A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is...
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7558067 |
Retaining tool for a heat sink
A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two...
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7554809 |
Heatsink assembly structure
A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one...
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7554810 |
Mounting apparatus for securing heat dissipation module to circuit board
A heat dissipating apparatus includes a plurality of posts for being detachably attached to a circuit board adjacent a socket mounted thereon, a mounting frame for being attached to the heat...
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7551438 |
Information processing blade and information processing apparatus using the same
An information processing blade computer includes a board having a blade structure such that the board is stored in a main body of an information processing apparatus; a part contained in a circuit...
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7549790 |
Measuring apparatus for thermal resistance of heat dissipating device
A measuring apparatus for measuring the thermal resistance of a heat dissipating device, the heat dissipating device includes a fan and a heat sink. The measuring apparatus includes a base, and a...
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7525187 |
Apparatus and method for connecting components
An apparatus for connecting at least two components contains a lower die and an upper die. The lower die has the components which are to be connected, with the first component supporting the at...
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7522420 |
Clip module and heat-dissipation device having the same
A clip module and heat-dissipation device having the same is disclosed. The heat-dissipation device includes a retention module (RM) disposed on a circuit board having a heat-source, a heat sink...
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7522421 |
Split core circuit module
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
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7518875 |
Securing heat sinks to a device under test
Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids...
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7518235 |
Method and structure to provide balanced mechanical loading of devices in compressively loaded environments
An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally...
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7518233 |
Sealing structure for multi-chip module
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in...
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7515426 |
Heat dissipating device for an integrated circuit chip
An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip...
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7511362 |
Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be...
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7508067 |
Semiconductor insulation structure
A semiconductor insulation structure is disclosed for a semiconductor module, incorporating therein a semiconductor element, with which an electrically conductive structural body is held in...
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7508667 |
Heat sink backplate module, circuit board, and electronic apparatus having the same
An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate...
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7508674 |
Fixture for attaching a heat sink to a heat generating device
A heat sink fixture for fixing a heat sink to a heat generating device is disclosed. The heat sink fixture at least has a suppressing section, two force-exertion sections and two fixing sections....
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7505271 |
Heat sink mount
A heat sink mount including a body, a first operating member, and two second operating members is provided. The body is formed with a first side, a second side opposite to the first side, a third...
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7505274 |
Heat sink fastening device and assembling process thereof
A heat sink fastening device is used for facilitating fixing a heat sink on a circuit board. The heat sink fastening device includes a first connecting portion, a second connecting portion and at...
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