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7623350 |
Thermal conducting medium protector
A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector...
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7619894 |
Heat dissipation device
A heat dissipation device, electrically connected to an intermittent power source, is used for dissipating heat generated by a heat-generating element on a circuit board. The heat dissipation...
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7619893 |
Heat spreader for electronic modules
A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second...
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7619890 |
Heat dissipation module
A heat dissipation module includes a heat dissipation device, a resilient bracket and a cylindrically shaped nut. The heat dissipation device is attached to a heat generating component. The...
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7616444 |
Gimballed attachment for multiple heat exchangers
One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint...
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7613005 |
Mounting device for mounting heat sink onto electronic component
A mounting device ( 10 ) for mounting a heat sink ( 40 ) onto a printed circuit board ( 60 ) with a heat generating electronic component ( 50 ) mounted thereon. The mounting device includes a...
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7609522 |
Heat sink assembly
A heat sink assembly ( 10 ) compatible with an ATX motherboard ( 20 ) and a BTX motherboard ( 30 ), includes a heat sink and a plurality of fasteners ( 15 ) extending through the heat sink. The...
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7606028 |
Heat dissipation device having a fan holder for attachment of a fan
A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder...
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7602060 |
Heat spreader in a flip chip package
A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface...
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7599187 |
Semiconductor module and heat radiating plate
A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed...
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7595993 |
Mounting structure with heat sink for electronic component and female securing member for same
A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each...
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7589972 |
Electrical connector with clip mechanism
An electrical connector assembly ( 100 ) made in accordance with a preferable embodiment of the present invention comprises an electrical socket ( 20 ) with a plurality of contacts received...
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7589967 |
Heat dissipation device
A heat dissipation device includes a heat sink ( 10 ) for contacting a heat-generating component and a fan ( 20 ) mounted to the heat sink. The fan includes a frame ( 22 ) and a motor ( 24 )...
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7583504 |
Cooling assembly
A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the...
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7583503 |
Thermal module allowing adjustment in the height of heat sink relative to fixing rack
A thermal module includes a fixing rack and a heat sink fitted in the fixing rack. The fixing rack is provided at an inner side with a plurality of stoppers and a plurality of projected portions...
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7576989 |
Heat sink assembly having supporting clip
A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each fastener comprises a bolt and a...
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7576987 |
Clip for heat dissipation device
A clip includes a body with a first end and a second end, an actuating member pivotally coupled to the second end of the body via a pivot, and a movable fastener pivotally coupled to the actuating...
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7576429 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite...
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7573716 |
Bolster plate assembly for printed circuit board
A bolster plate assembly for a printed circuit board includes a first structure member, a second structure member rotatably mounted to the first structure member, and a plurality of locking...
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7569928 |
Assembly structure of electronic element and heat sink
An assembly structure of an electronic element and a heat sink is disclosed. An assembly structure of an electronic element and a heat sink comprises a fastening element, an electronic element...
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7564689 |
Clip for heat sink
A clip ( 100 ) includes a body ( 10 ), a handle ( 30 ) and a movable fastener ( 20 ). The body has a first end terminating in a supporting portion ( 16 ) and a second end terminating in a latching...
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7564688 |
Heat dissipation assembly
A heat dissipation assembly for dissipating heat generated by an electronic component includes a heat sink contacting the electronic component, a pair of retaining members fixed on two lateral...
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7564687 |
Heat dissipation device having a fixing base
A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite...
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7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein
A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each...
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7561436 |
Circuit assembly with surface-mount IC package and heat sink
A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of...
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7561433 |
Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system
In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged,...
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7557442 |
Power semiconductor arrangement
A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is...
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7554809 |
Heatsink assembly structure
A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one...
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7550840 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die...
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7545643 |
Heat dissipation device with a fan duct
A heat dissipation device adapted for cooling a heat-generating electronic component includes a heat sink ( 30 ), a fan ( 40 ) mounted on the heat sink ( 30 ), a fan duct ( 70 ) mounted on the fan...
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7545034 |
Thermal energy removal structure and method
An electrical structure including a first substrate comprising a plurality of electrical components, a first thermally conductive film layer formed over and in contact with a first electrical...
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7528482 |
Embedded chip package with improved heat dissipation performance and method of making the same
A Chip-in Substrate Package (CiSP) includes a double-sided metal clad laminate including a dielectric interposer, a first metal foil laminated on a first side of the dielectric interposer, and a...
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7521791 |
Method and apparatus for dissipating heat from an integrated circuit
An apparatus ( 100 ) is provided for dispersing heat from an integrated circuit ( 202 ) to a heat sink ( 404 ). The apparatus ( 100 ) is formed on a nonconductive body ( 102 ) having at least two...
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7518874 |
Heat sink assembly
A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of...
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7518873 |
Heat spreader, semiconductor package module and memory module having the heat spreader
A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat...
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7518872 |
Attaching heat sinks to printed circuit boards using preloaded spring assemblies
A bottom loaded assembly for securing heat sinks to printed circuit boards may use a preloaded spring. The preloaded spring may be positioned on one side of the printed circuit board and the heat...
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7518233 |
Sealing structure for multi-chip module
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in...
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7515426 |
Heat dissipating device for an integrated circuit chip
An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip...
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7508674 |
Fixture for attaching a heat sink to a heat generating device
A heat sink fixture for fixing a heat sink to a heat generating device is disclosed. The heat sink fixture at least has a suppressing section, two force-exertion sections and two fixing sections....
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7505274 |
Heat sink fastening device and assembling process thereof
A heat sink fastening device is used for facilitating fixing a heat sink on a circuit board. The heat sink fastening device includes a first connecting portion, a second connecting portion and at...
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7505271 |
Heat sink mount
A heat sink mount including a body, a first operating member, and two second operating members is provided. The body is formed with a first side, a second side opposite to the first side, a third...
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7504720 |
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7502229 |
Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate...
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7499280 |
Heat dissipating device
A heat dissipating device which dissipates heat generated by a heat generating object mounted on a base includes a heat sink body, a heat-conducting area, a tip portion, an inclined surface, and a...
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7499279 |
Cold plate stability
A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate....
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7498673 |
Heatplates for heatsink attachment for semiconductor chips
An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid...
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7495924 |
Electronic device
An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat...
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7495922 |
Spring loaded heat sink retention mechanism
Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring...
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7495917 |
Heat dissipation device
A heat dissipation device includes a retention module ( 60 ), a heat sink ( 10 ), a fan bracket ( 50 ), a fan ( 70 ) mounted on the fan bracket, and a pair of wire clips ( 30 ) cooperating with the...
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