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8184439 |
Semiconductor module
A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in...
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8183574 |
Thermal isolation of electronic devices in submount used for LEDs lighting applications
The present invention relates to an electronic device for providing improved heat transporting capability for protecting heat sensitive electronics and a method for producing the same. The present...
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8174112 |
Integrated circuit device with low capacitance and high thermal conductivity interface
An integrated circuit device includes an integrated circuit formed in a semiconductor die and an integrated circuit package containing the semiconductor die. The integrated circuit package includes...
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8164904 |
Electronic component module
An electronic component module includes at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43)...
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8154119 |
Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing
The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of...
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8149574 |
Cooling fan housing assembly
A cooling fan housing assembly for assembling to a heat sink includes a boosting portion and a connecting portion extended from the boosting portion. The connecting portion includes a first part...
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8138597 |
Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer
A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first...
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8139360 |
Multi-specification fixing module and motherboard with multi-specification fixing module
A multi-specification fixing module used at a motherboard and a cooler. The multi-specification fixing module includes a plurality of the fixing sheet and a specification adjusting base plate. Each...
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8134835 |
Compression clamping of semiconductor components
The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally...
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8120171 |
Power drive unit including a heat sink and a fastener
A power drive unit is configured to comprise a heat sink, a power module pressed by a press member to the heat sink to be fastened thereto and a spring member that has a substantially circular...
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8115301 |
Methods for manufacturing thermally enhanced flip-chip ball grid arrays
Methods for fabricating flip-chips are disclosed. In an exemplary method, a flip-chip is mounted, active-surface downward, onto a substrate such that a back-side of the flip-chip is facing upward...
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8089146 |
Semiconductor device and heat radiation member
A semiconductor device includes a semiconductor element mounted on a substrate; at least one electronic part arranged around the semiconductor element; and a heat radiation member bonded to a...
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8081481 |
Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system
A clip for coupling a first board and second board, the first board having plurality of first post coupled thereto, the second board having a plurality of second posts coupled thereto, each second...
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8081475 |
Heat sinking assembly and method for power electronics in a trolling motor controller head
To prevent water intrusion, trolling motor heads cannot utilize ventilation methods of removing heat from power electronics. The assembly and method of the present application utilizes the existing...
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8077476 |
Electronic device mounting structure
An electronic device mounting structure includes a thermally conductive base, a busbar located on the base, an electronic device mounted on the busbar, a thermally conductive wall standing on the...
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8076774 |
Transistor clamping device
A transistor-clamping device for a transistor is provided with a holding block and a spring. The holding block engages over the transistor, so that the spring is pre-tensioned. A pressure plate is...
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8072047 |
Integrated circuit package system with shield and tie bar
An integrated circuit package system includes: providing a tie bar and a lead adjacent thereto; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the...
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8053889 |
Semiconductor module
A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a...
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8053888 |
System for clamping heat sink
A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The...
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8040675 |
Optical module
According to an aspect of the embodiment, an optical module includes a case, an optical transceiver part in the case, a radiating part on the case; a thermal conductive sheet having a property of...
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8030755 |
Integrated circuit package system with a heat sink
An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated...
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8022533 |
Circuit apparatus provided with asperities on substrate surface
Circuit elements including a plurality of semiconductor devices and passive elements embedded in an insulating resin film are formed on a metal substrate having a surface roughness Ra of 0.3 to 10...
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8020609 |
Heat sink assembly having a clip
A heat sink assembly includes a heat sink and a clip. The clip includes a main body, two pressing portions extending outwardly from two opposite ends of the main body, two extension portions each...
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8017684 |
Heat conductive silicone grease compositions
Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to ...
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8018072 |
Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate
A semiconductor device has a substrate. A die is attached to a first surface of the substrate. A heat sink is provided having an approximately planer member and support members extending from the...
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8008769 |
Heat-dissipating semiconductor package structure and method for manufacturing the same
A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a...
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8004845 |
Fastening assembly for heat dissipation device
A fastening assembly used for securing a heat dissipation device to a printed circuit board, comprises a sleeve, an inserting device extending through the sleeve, a spring encircling the inserting...
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7995344 |
High performance large tolerance heat sink
A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to...
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7990714 |
Heat dissipation device and fasteners thereof
A heat dissipation device includes a heat sink, a heat absorbing plate, a heat pipe thermally connecting the heat sink and the absorbing plate, a pressing plate secured to the heat absorbing plate...
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7990718 |
Heat dissipation device having a clip assembly
A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board includes a heat sink, a wire clip and two operating members. The heat sink has a bottom...
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7983048 |
Structure for mounting semiconductor package
A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor...
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7977698 |
System and method for surface mountable display
A system and method is disclosed for allowing a solid substrate, such as a printed circuit board (PCB), to act as the support structure for an electronic circuit. In one embodiment, the LEDs which...
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7978475 |
Strain reduction fixing structure
A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection...
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7974098 |
Mechanism to make a heat sink in contact with a pluggable transceiver, a pluggable optical transceiver and a cage assembly providing the same
A heat-dissipating mechanism with a thermo-conducting sheet is arranged between a pluggable optical transceiver and a heat sink. One of the optical transceiver and the heat sink includes the...
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7974099 |
Apparatus and methods for thermal management of light emitting diodes
An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may...
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7969742 |
Bracket for mounting heat sink
A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the...
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7961469 |
Method and apparatus for distributing a thermal interface material
Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface...
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7961473 |
Retention module for toolless heat sink installation
An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes...
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7955900 |
Coated thermal interface in integrated circuit die
Some embodiments of the invention include a coated thermal interface to bond a die with a heat spreader. The coated thermal interface may be used to bond the die with the heat spreader without...
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7957148 |
Low profile computer processor retention device
A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a...
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7957135 |
Semiconductor module
A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching...
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7944695 |
Motor controller
A motor controller which is inexpensive and has high cooling performance by using an extrusion heat sink (1), reducing the number of parts, and reducing the man-hours of assembling is provided. In...
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7929309 |
Heat sink assembly having clip
A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is...
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7919856 |
Package mounted module and package board module
A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the...
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7915728 |
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof
The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located...
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7910952 |
Power semiconductor arrangement
One aspect relates to a power semiconductor arrangement includes a power semiconductor module which is mechanically connected to a heat sink. In order to improve the thermal cycling stability of...
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7903419 |
Heat dissipation device having a back plate unit
A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a...
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7903411 |
Cold plate stability
A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate....
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7903420 |
Fixing structure of fixing a thermal module
A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure...
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7903413 |
Coupling system and method for attaching thermal components in association with a board-mounted integrated circuit
A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication...
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