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7019978 |
Heat dissipating device incorporating clip
A heat dissipating device for a heat generating unit, includes a heat sink placed on the heat generating unit, and two clip members located at opposite sides of the heat sink for securing the heat...
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7019976 |
Methods and apparatus for thermally coupling a heat sink to a circuit board component
A heat sink has a flexure member attached to a base of the heat sink and located between the base and an associated circuit board component. As the heat sink attaches to a circuit board carrying...
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7017258 |
Mounting system for high-mass heatsinks
A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard,...
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7009843 |
Heat sink clip with pressing post
A heat sink clip ( 20 ) includes a main body, a post ( 26 ), and a spring ( 27 ). The main body includes a longitudinal portion ( 31 ), first and second locking arms ( 32, 24 ) extending downwardly...
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7009292 |
Package type semiconductor device
A package type semiconductor device comprising: a semiconductor chip having a semiconductor part; a main electrode for connecting to a first region of the semiconductor part; a control wiring layer...
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7009844 |
Wire form heat sink retention module
A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that...
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7009284 |
Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element
A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided...
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7009290 |
Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method
A heat sink for semiconductor components or similar devices, especially produced from an extruded aluminum alloy. The heat sink comprises cooling ribs which rise at a distance from a base plate and...
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7005739 |
High power semiconductor module
The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are...
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6992894 |
Method and apparatus for EMI shielding
An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic...
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6992383 |
Semiconductor device having radiation structure
A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the...
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6992893 |
Heat sink attachment
An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.
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6988533 |
Method and apparatus for mounting a heat transfer apparatus upon an electronic component
A heat transfer apparatus comprises a thermally conductive member including a base having one or more surfaces adapted to absorb heat from an electronic component, and a mounting assembly including...
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6987672 |
Blindmate heat sink assembly
An engageable assembly comprising a socket and a heat sink. The socket comprises a surface having an array of mounting holes that receive connector pins of an electronic device in order to mount...
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6982875 |
Attaching device for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board, a mount board having the board, the semiconductor device, and the heat sink, and an attaching method of the semiconductor device and the heat sink provided on the semiconductor device on the board
An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to...
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6978827 |
Active heat sink
A cooling device is provided for dissipating heat from a heat source such as, e.g., an integrated circuit. The cooling device includes a heat sink having a fin structure, a blower assembled with...
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6979843 |
Power semiconductor device
A power semiconductor device that uses a lead frame for making connection to a semiconductor device and has a structure less subject to fatigue failure at the connection part of the lead frame. A...
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6977434 |
Semiconductor assembly and spring member therefor
A semiconductor assembly comprises a semiconductor package comprising a substrate, a die positioned on the substrate, and a lid positioned on the die. A receiver receives the semiconductor package....
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6977816 |
Heat sink mounting assembly
A heat sink mounting assembly includes a socket ( 90 ) having first and second side, a retaining clip ( 10 ) cooperating with the socket to sandwich a heat sink ( 70 ) therebetween. A pair of ears...
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6977814 |
Dual material heat sink core assembly
A heat sink core assembly includes a base plate fabricated from a first material. The base plate comprises an opening therein, and the opening defines an insert engagement surface. An insert is...
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6975028 |
Thermal apparatus for engaging electronic device
An apparatus for controlling the temperature of an electronic device utilizes a thermal head attached to a base structure including an integral isolation arrangement. For example, the isolation...
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6962192 |
Heat dissipation assembly with retaining device
A heat dissipation assembly includes a printed circuit board ( 70 ) with a heat-generating device ( 74 ) mounted thereon, a heat sink ( 60 ) mounted on the heat-generating device for dissipating...
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6963133 |
Semiconductor device and method for manufacturing semiconductor device
A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating...
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6961243 |
CPU heatsink fastener
A retaining apparatus for securely fastening a heat sink to a CPU includes a press plate part, a hold bar part, and a retaining bar part. The retaining apparatus is installed by engaging hook legs...
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6958535 |
Thermal conductive substrate and semiconductor module using the same
A semiconductor module includes a circuit substrate composed of a wiring pattern, an electrical insulating layer and a thermal radiation board, and in use is fixed to an external thermal radiation...
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6956282 |
Stabilizer/spacer for semiconductor device
The invention is a leadframe/stabilizer ( 35 ) for use with semiconductor devices. Stabilizer ( 35 ) is for stabilizing the space between of lead frame leads ( 36–39 ) and improving the lead to...
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6952348 |
Heat sink assembly incorporating mounting frame
A heat sink assembly includes a heat sink ( 10 ), a mounting frame ( 20 ) for mounting the heat sink to an electronic component ( 60 ), and a grease cover ( 40 ). The heat sink includes a base ( 12...
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6950309 |
Power amplifier module assembly
A power amplifier module assembly ( 100 ) includes a PA module ( 102 ) having a flange ( 104 ) and a mounting bracket ( 106 ) coupled thereto. A thermally conductive pad ( 108 ) having an...
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6946730 |
Semiconductor device having heat conducting plate
A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating...
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6944023 |
System and method for mounting a heat sink
The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for...
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6940721 |
Thermal interface structure for placement between a microelectronic component package and heat sink
A multi-layer thermal interface structure for placement between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about...
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6934157 |
Universal heat sink retention module frame
A heat sink retention frame includes a plurality of base members mounted on a board member. A plurality of retention members are provided, with each retention member having a first end moveably...
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6934155 |
Apparatus and method for a cooling solution fastening assembly
A fastener assembly including a base consisting of a pair of motherboard snaps on a first end and a hollow shaft on a second end, the motherboard snaps to be inserted through an aperture of a...
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6930386 |
Shock hardened mounting and cooling of a semiconductor device
A semiconductor mounting arrangement inclusive of a heat sink member enabling desirable resistance to physical impact damage to the semiconductor device, the heat sink and the printed circuit board...
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6930884 |
Land grid array assembly using a compressive liquid
Disclosed is land grid array (LGA) assembly using a compressive load. An LGA assembly includes a first component located on the top of the LGA assembly; a center load screw coupled to the first...
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6924982 |
Heat dissipation assembly including heat sink and fan
A heat dissipation assembly ( 100 ) includes a retention frame ( 90 ), a heat sink ( 80 ), a fan holder ( 10 ), a pair of clips ( 60 ) and a fan ( 20 ). The heat sink is mounted on the retention...
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6924980 |
Vibration isolation of computing device heat sink fans from attached fan shrouds and heat sinks
A device for use in cooling a microelectronic component in a data processing system with a heat sink and a fan. The device includes means for maintaining the fan in close proximity to the heat sink...
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6920688 |
Method for a semiconductor assembly having a semiconductor die with dual heat spreaders
A method of making an integrated circuit device using an encapsulated semiconductor die, having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant...
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6919220 |
Method of making chip package with grease heat sink
The present invention relates to enhanced protection of the active surface and the bond wires or ball array of a microelectronic device, and to thermal management of the microelectronic device as...
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6920044 |
Extendible and flexible heat-dissipation air conduit base as computer heat dissipation device
The present invention is related to an extendible and flexible heat-dissipation air conduit base as computer heat dissipation device. The invention mainly comprises an air conduit and fixtures. The...
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6916122 |
Modular heat sinks
The invention relates to modular heat-dissipating housing covers for opto-electronic modules, e.g. transceivers. The housing covers according to the present invention are constructed out of various...
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6917099 |
Die carrier with fluid chamber
A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically...
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6914321 |
Semiconductor device
It is an object to provide a semiconductor device having an improved heat dissipation characteristic. A power element is mounted on and jointed and to a metal block through a jointing material. An...
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6910271 |
Mechanical highly compliant thermal interface pad
A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the...
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6898083 |
Heat sink integrated retention system
A heat sink assembly for a circuit board component is provided. that includes a heat sink base, a frame coupled to the base, and a cam positionable relative to the base to lock the heat base to the...
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6890799 |
Device for sealing and cooling multi-chip modules
According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a...
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6890618 |
Method and apparatus for retaining a thermally conductive pin in a thermal spreader plate
An apparatus and method are provided for retaining thermal transfer pins in a spreader plate adapted to transfer thermal energy from an electronic component. The spreader plate includes pin holes...
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6885557 |
Heatsink assembly
A system assembly for the retention of heatsinks, in particular, high-mass heatsinks, is disclosed. The system assembly includes a backplate with standoffs extending transverse to a system board,...
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6867976 |
Pin retention for thermal transfer interfaces, and associated methods
Structure and methods are disclosed for transferring thermal energy from an object to a thermal spreader. A plurality of pins are biased against the object so that the plurality of pins contact...
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6864572 |
Base for heat sink
A heat sink base ( 10 ) includes a rectangular body ( 11 ) made of aluminum and a circular core ( 12 ) made of copper. The body defines a circular through opening ( 111 ). A diameter of the opening...
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