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7206204 |
Electric circuit module
An electric circuit module comprising: an electric device comprising an electric circuit to serve for passage and interruption of electric current, a packing material packing the electric circuit...
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7202420 |
Methods to prevent mechanical flexure related BGA failure
Methods and associated apparatus of reducing stress in a package are described in which a package is provided comprising an array of interconnects that are connected to a substrate, and then...
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7193851 |
Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
Structures and methods for holding heat sinks in contact with electronic devices are described herein. In one embodiment, an assembly for holding a heat sink in contact with an electronic device...
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7193853 |
Heat sink protecting retention module
A heat sink protecting retention module is described. The heat sink protecting retention module has a main frame, protective feet, hooks, and a positioning mechanism. The protective feet are...
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7190586 |
Heat sink retention assembly and related methods
Heat sink retention assemblies and related methods are described. In one embodiment, a system comprises a base, a handle rotatably mounted on the base, and heat sink retention structure joined with...
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7190584 |
Retaining device for heat sink
A retainer ( 20 ) for a heat sink includes a supporting member ( 22 ), a bracket member ( 24 ), a pair of locking members ( 26 ) and an operating member ( 28 ). The supporting member defines a pair...
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7187551 |
Module for solid state relay for engine cooling fan control
A power module that includes a lead frame having conductive pads molded in at the base thereof and a heatsink in thermal contact with the conductive pads through a thermally conductive adhesive.
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7180743 |
Fastener for heat sink
A fastener for a heat sink of the present invention includes a length-variable operating member ( 10 ), a piston member ( 20 ), an embracing member ( 30 ), a resilient member ( 40 ) and a post ( 58...
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7170165 |
Circuit board assembly with a brace surrounding a ball-grid array device
An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a...
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7164583 |
Mounting device for heat sink
A mounting device ( 10 ) for mounting a heat sink ( 20 ) to a circuit board ( 40 ), includes a locking member ( 16 ) extending through the heat sink and including a through hole ( 162 ) and barbs (...
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7142430 |
Heat dissipating device assembly
A heat dissipating device assembly for an electronic components ( 70 ), includes a heat sink ( 10 ) for contacting the electronic component, and a locking device ( 20 ) and a back plate unit ( 40 )...
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7142422 |
Heat dissipation device
A heat dissipation device includes a mounting plate ( 21 ) for mounting the heat dissipation device to a circuit board ( 3 ) on which a CPU ( 4 ) and a plurality of capacitors ( 31 ) are mounted, a...
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7139174 |
Techniques for attaching a heat sink assembly to a circuit board component
A circuit board module has a circuit board, a component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a base member having a first edge and a second edge....
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7136287 |
Clip for mounting heat sink to circuit board
A clip ( 10 ) includes a body ( 12 ) including spaced first and second end portions, a first locking part ( 20 ) extending from the first end portion for attaching to a heat sink ( 80 ), and a...
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7131199 |
Mechanical highly compliant thermal interface pad
A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the...
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7133288 |
Processor heat sink retention module and assembly
A heat sink retention module for an electronic device includes a base comprising mounting lugs configured to be mounted to a circuit board, and frame elements extending between the mounting lugs to...
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7126218 |
Embedded heat spreader ball grid array
A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying...
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7126826 |
Quick-connect thermal solution for computer hardware testing
The present invention represents a significant advancement in the field of thermal solutions for computer hardware. In one embodiment, a quick-connect system for cooling a heat-generating...
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7126824 |
Heat dissipation device assembly incorporating retention member
A heat dissipation device assembly includes a heat sink ( 20 ) placed on an electronic component ( 52 ) which is mounted on a printed circuit board (PCB) ( 50 ) and including a pair of shoulders (...
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7126823 |
Locking device for heat dissipating device
A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of fasteners extending upwardly...
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7126819 |
Chassis air guide thermal cooling solution
A chassis air guide thermal cooling solution including a fan to which protruding edges are wedged at wedge grooves of a locating assembly to locate the fan therein, locating notches of a flexible...
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7123482 |
Levers for support of heatsink component
An apparatus in one example comprises a plurality of levers that convert a lesser input force to a greater output force for support of a heatsink component coupled with an electronic component.
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7120027 |
Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat...
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7116556 |
Heat sink mounting apparatus
A mounting apparatus ( 1 ) includes a locking pin ( 10 ) and an operation member ( 20 ) attaching to the locking pin. Resilient prongs ( 13 ) are formed at a first end of the locking pin. A detent...
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7113406 |
Methods and apparatus for fastening a set of heatsinks to a circuit board
A circuit board module has a circuit board which includes a circuit board structure and a set of components mounted to the circuit board structure. The circuit board module further includes a set...
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7110261 |
Heat dissipation assembly
A heat dissipation assembly of the present invention includes a printed circuit board ( 50 ), an electronic component ( 60 ) mounted on the printed circuit board, a heat dissipation device ( 70 )...
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7106592 |
Coolant cooled type semiconductor device
A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are...
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7106591 |
Locking device for heat sink
A locking device, for locking a heat sink ( 30 ) to a socket ( 10 ) on which an electronic component ( 20 ) is mounted, includes a pair of clips ( 60 ) each having a handle ( 62 ) and a ring ( 66...
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7106594 |
Simplified mounting configuration that applies pressure force to one central location
A heat transfer assembly comprising of an electronic component attached to an attachment point located on a circuit board and a clamping mechanism which applies a downward force against a block. In...
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7105858 |
Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for...
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7102226 |
Device and method for package warp compensation in an integrated heat spreader
A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled...
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7102889 |
Method and apparatus for attaching heat sink to a component with a flexible leaf spring mount
The apparatus and method may have the following: a spring element that pivots about a pivot axis; a flexible mount coupled to the spring element such that the pivot axis of the spring element is...
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7099156 |
Locking device for heat dissipating device
A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a first locking member extending the heat sink and the circuit board and having a block for pressing...
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7095614 |
Electronic module assembly
Methods of engaging an electronic module interconnected to a circuit board to a heat sink using clamping assemblies that maintain integrities of an interconnection grid array and the electronic...
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7082034 |
Circuit cooling
A housing cover to cause electrical components to engage with at least one component pad of a heat sink, the cover including a projection integrally formed from the housing cover and positioned on...
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7075790 |
Heat dissipating device incorporating clip
A heat dissipating device includes a heat sink ( 50 ) and two clips ( 10 ) for mounting the heat sink to a retention module ( 60 ) which surrounds an electronic component ( 65 ). The heat sink...
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7072183 |
Locking device for heat dissipating device
A locking device ( 30 ) for mounting a heat sink ( 40 ) to a CPU ( 70 ), includes a supporting member ( 32 ), a pair of locking members ( 33 ) pivotably attached to the supporting member and each...
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7061764 |
Heat sink clip with rotating CAM
A clip ( 10 ) includes a main body ( 20 ), a buckling piece ( 40 ), and a camming member ( 30 ). The main body includes a pressing part ( 22 ), a first leg ( 24 ) extending downwardly from one end...
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7057897 |
Means for securing a cooling device
Means for securing a cooling device includes a main body attached to the cooling device and at least a secure unit. The main body provides at least an axial hole corresponding to the secure unit....
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7057295 |
IC module assembly
An IC module assembly includes an IC module including a plurality of pads disposed on a bottom thereof, a plurality of resilient members respectively soldering to the pads, and a PCB having a...
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7056566 |
Preappliable phase change thermal interface pad
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that...
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7054158 |
Cooling body
The present invention relates to a heat sink ( 1 ) with a main body ( 2 ) for accommodating at least one electronic structural element ( 5 ), and with a spring element ( 3 ) for pressing the...
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7049688 |
Semiconductor device having a pair of heat sinks and method for manufacturing the same
A semiconductor device includes a heater element; a first heat sink disposed on one side of the heater element; a second heat sink disposed on the other side of the heater element; and a resin mold...
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7050302 |
Captive socket actuator
Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of...
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7042727 |
Heat sink mounting and interface mechanism and method of assembling same
In some embodiments, a method includes providing a circuit board having a plurality of holes formed therethrough and mounting a spring to an underside of the circuit board such that the mounted...
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7042728 |
Clamping structure and heat dissipating module using same
A clamping structure is used to fix a heat-dissipating body on a chip module. The clamping structure comprises a clamping body, two clamping portions, a pivot element, a top frame and a bottom...
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7032305 |
Method for mounting integrated circuits on a printed circuit card
A method of mounting electrical component assemblies on opposite sides of a printed circuit card including inserting a chock on a first side of the printed circuit card; inserting a standoff and...
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7034395 |
Power semiconductor module with cooling element and pressing apparatus
A semiconductor power module ( 1 ) comprises at least a substrate ( 2 ) including at least a semiconductor element ( 6, 7, 8 ) and a pressing device ( 40 ) which acts on the substrate ( 2 ). The...
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7019979 |
Heat dissipating device having improved fastening structure
A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure...
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7019395 |
Double-sided cooling type semiconductor module
A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor...
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