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4970579 |
Integrated circuit package with improved cooling means
An integrated circuit chip package is described wherein the chip has an active face including a plurality of input and output pads. The chip is mounted face down on a pluralilty of flexible inner...
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4962445 |
Housing for submersible equipment
The housing comprises a tubular vessel (1) which is rigid, heat-conducting, and closed in watertight manner at both ends, with electrical circuits being received in receptacles (2) which are rigid,...
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4945401 |
Heat dissipator for semiconductor unit
This improved heat dissipator for mounting a semiconductor unit is made of sheet metal laminated with eutectic metal coatings. The dissipator has a planar base, narrow platelike wings, springy tabs...
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4943890 |
Solid state motor starter
A solid state motor starter assembly having controlled semiconductors mounted between heat sink members. Electrical power to the assembly can be connected an disconnected by an electrically...
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4933746 |
Three-legged clip
A resilient spring clip for attaching a semiconductor to a heat sink comprising a first surface having a first edge with a first leg projecting from a central portion of the first edge, and a...
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4924350 |
Retention clip for a thermal protection sensor
A retention clip for retaining a thermal protection sensor in contact with a ballast transformer core is disclosed which includes a vertical support engageable with a ballast housing for minimizing...
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4922376 |
Spring grid array interconnection for active microelectronic elements
A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures...
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4887149 |
Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink
A package for semiconductor devices provided with an encased metallic heat sink, wherein an encapsulating body of resin extends beyond the perimenter of the heat sink to form two side extensions,...
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4878108 |
Heat dissipation package for integrated circuits
A package for heat dissipation of electronic components mounted on a strip of thermally conductive material. A plastic body is molded to encapsulate the component and strip with extended mold...
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4853828 |
Solid state device package mounting apparatus
Apparatus for mounting TO-220 solid state device packages on a heat sink. Each package includes an electrically conductive, heat dissipating, heat sinking tab which is common with one of the...
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4815595 |
Uniform leadframe carrier
A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier...
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4805007 |
Flip chip module
A flip chip module including a film having solder receptor pads and interconnect lines to which a plurality of electronic devices and the like are bonded. The film is folded at predetermined areas...
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4803545 |
Self-fixturing heat sink
A heat sink has a front side on which a plurality of transistors are situated and a back side in which groooves are formed, each groove being directly opposite a transistor. Two-legged clips each...
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4792878 |
Heat dissipating housing for a circuit component
A heat dissipating housing (W/Gl/G) for a circuit component (IC) consists of at least one bottom tub (G) and a cover (W) having a planar cover face. A frame-shaped portion of this cover face serves...
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4774632 |
Hybrid integrated circuit chip package
A hybrid integrated circuit chip package is disclosed which includes a hybrid, low loss, multilayer metallization, silicon printed wiring board as an interconnecting, two-sided module to reduce the...
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4764847 |
Support plate for electronic components
A support plate of metal has at least one receiving depression into which an electronic component having a base of copper is inserted. The component is held by holding parts which are extended...
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4731693 |
Connection apparatus for integrated circuit
An integrated circuit is mounted on the front face of a substrate of dielectric material and the substrate is fitted in an aperture that extends through a circuit board. The substrate has contact...
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4730235 |
Cascadable carrier for high power semiconductors or other electronic components
A carrier for electronic components which generate heat during their operation, such as high power semiconductors, is disclosed. The carrier includes complementary ends which are designed to permit...
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4720771 |
Heat sink assembly for a circuit board mounted integrated circuit
An assembly including a lower heat sink and an upper heat sink which allows for affixation of a semiconductor to a circuit board with automatic soldering equipment and also provides the lower heat...
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4710852 |
Spring retainer for encapsulated semiconductor device
A spring steel bayonet type retainer for securing encapsulated semiconductor devices to circuit boards either directly or through an intermediate heat dissipator. The retainer comprises a spring...
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4707726 |
Heat sink mounting arrangement for a semiconductor
An arrangement for mounting a packaged semiconductor with a heat sink includes the heat sink having a channel formed therein with a pair of opposed side walls and utilizes one or more spring beams...
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4669028 |
Heat sink for solid state devices connected to a circuit board
The present invention removably mounts a plurality of solid state devices and a circuit board to a chassis heat sink by utilizing a heat conductive device formed with a base and a leg portion with...
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4660123 |
Appliance for releasable fastening of a cooling member to an integrated module
A spring clip, bent into a H-shaped and comprising a centrally-disposed opening corresponding to the core diameter of the cooling member, the spring clip comprising a parting line for a...
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4652971 |
Printed circuit board fastener
The invention relates to a fastener assembly for use in attaching articles to printed circuit boards, and include a fastener, which has a generally tubular body, flanged at one end, is adapted to...
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4649460 |
Single-in-line integrated electronic component
An insulating package premolded on a metallic frame with electrical contacts contains in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical...
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4646203 |
Mounting structure for semiconductor devices
A mounting structure is disclosed for mounting a semiconductor device on a conductive heat sink while electrically insulating the two. A thin, flat thermally conductive electrically insulative...
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4631819 |
Low stress, tolerance free method for mounting power devices
A low stress, tolerance free method for mounting a power device to a heat sink is disclosed. The power device is soldered into a break-away area created on a printed circuit (PC) board which is...
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4609040 |
Self-securing heat sink
A self-securing heat sink for transistors and the like comprises a unitary member that is constructed from a malleable material having a high heat transfer coefficient. The unitary member includes...
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4605058 |
Heat dissipating retainer for electronic package
A heat dissipating retainer for a flat, rectangular solid state package of electronic components is made from a single piece of pliable, springy electrically conductive sheet material bent to form...
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4593342 |
Heat sink assembly for protecting pins of electronic devices
An electronic device, such as an integrated circuit chip, having pins for connection to a circuit board or the like is secured to a relatively massive heat sink. The heat sink is releasably secured...
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4574162 |
Compact circuit package with improved construction for clamping to enhance heat transfer
The compact circuit package (11) includes an insulating housing (12) providing a circuit retaining cavity (19) substantially surrounded by a pair of spaced side walls (15, 16) each terminating at a...
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4552206 |
Heat sinks for integrated circuit modules
In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin...
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4544942 |
Heat sinks with staked solderable studs
Heat sinks of the type which are fitted onto electronic solid-state devices to maintain acceptable thermal equilibrium conditions are provided with solderable sheet-metal appendages or studs staked...
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4518983 |
Assembly-heat sink for semiconductor devices
The present invention is directed to an assembly-heat sink for semiconductor fusions. The fusions are disposed within the assembly-heat sink between cylindrical metal members which both cool the...
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4509839 |
Heat dissipator for semiconductor devices
A heat dissipator including a thermally conductive material having a face adapted to contact a semiconductor to be cooled, and a clip for engaging the body and resiliently clamping the...
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4508163 |
Heat sinks for integrated circuit modules
In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin...
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4498530 |
Flexible thermal conduction element for cooling semiconductor devices
A flexible, extensible thermal conduction element for use in a semiconductor package to conduct heat from a device to a cold plate, or cover, featuring a plurality of thin flexible interleaved leaf...
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4481525 |
Heat dissipator for integrated circuit chips
A heat dissipator is provided including a radiator chimney and a separate heat conducting clamp for use with integrated circuit chips. The radiator chimney functions to conduct heat away from the...
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4415025 |
Thermal conduction element for semiconductor devices
A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending...
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4408220 |
Heat dissipator for a dual in line integrated circuit package
A heat dissipator for use with a dual in line integrated circuit package. The subject dissipator is unitary in construction and formed of a resilient material to facilitate rapid mounting and...
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4344106 |
Transistor heat sink assembly
A heat sink for a transistor is provided which comprises a long and a short vertical portion joining a sloped upper surface. The transistor is bolted to the sloped surface with its leads extending...
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4342068 |
Mounting assembly for semiconductor devices and particularly power transistors
A mounting assembly for a semiconductor device, particularly a power transistor, which encloses and holds the device upon a plate which serves as a heat sink securely on a printed circuit board has...
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4288839 |
Solid state device mounting and heat dissipating assembly
By providing a retaining surface, upon which a solid state device is positioned, and a device securing means movable into and out of compression engagement with a portion of the solid state device,...
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4261005 |
Miniature heat sink
A one-piece stamped sheet-metal heat sink for dissipation of heat which accumulates about the plastic housing and metallic tab of a miniature semiconductor power device is formed as a shallow...
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4259685 |
Clamp for securing an encased power frame to a heat sink
A semiconductor device, comprising a lead frame connected to an IC chip in a resinous block and a metallic strip projecting unilaterally from that block along a heat sink, is fastened to that heat...
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4254431 |
Restorable backbond for LSI chips using liquid metal coated dendrites
An improved arrangement for cooling a module packaged semiconductor integrated circuit chip having heat generating microcircuits thereon is disclosed. Enhanced cooling over prior art techniques is...
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4237086 |
Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction
The bottom surface of a substrate and the support surface of a base on which the substrate is to be mounted are treated with a release agent. A thin layer of a conformable resin is interposed...
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4235285 |
Self-fastened heat sinks
Dissipation of heat from miniature solid-state devices and the like is achieved by a resilient heat-sink structure which opens to receive a tab or other heat-transfer body freely between two...
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4215361 |
Winged self-fastened heat sinks for semiconductor devices
Heat accumulating about the plastic housing and metallic tab of a miniature electronic semiconductor power device is dissipated by a surrounding one-piece sheet metal heat sink shaped as a...
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4204248 |
Heat transfer mounting arrangement for a solid state device connected to a circuit board
A solid state device, such as a power transistor, is fastened to a mounting arrangement that provides good heat conduction to a chassis or heat sink, that holds the solid state device so that its...
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