|
Match
|
Document |
Document Title |
|
|
5373099 |
Fixing device for fixing electronic component against a wall of a heatsink
A fixing device for fixing an electronic component (10) against a first wall (11) of a heatsink (12) includes at least one end branch engaged in a recess (81) provided in a second wall (82) of the...
|
|
|
5371753 |
Laser diode mount
A laser diode mount having a thermal coupling for a laser diode heat sink utilizes a shape memory alloy in the maintaining of laser diode arrays within an operational temperature bandwidth. A diode...
|
|
|
5368094 |
Bipartite heat sink positioning device for computer chips
A bipartite heat sink positioning device for computer chips incorporates a two-piece heat sink including a plurality of fins projecting from upper surfaces thereof and generally flat bottom...
|
|
|
5367433 |
Package clip on heat sink
A heat sink-spring clip assembly for mounting on a PQFP electronic package wherein leaf spring legs engage with the outermost diametrically opposed ends of the bumpers on the PQFP, and the assembly...
|
|
|
5357404 |
EMI shield, and assembly using same
The assembly of an electronic package, a socket which holds the package, an electrically-conductive heat sink placed over and around the package, and an EMI shield for minimizing EMI leakage. The...
|
|
|
5345107 |
Cooling apparatus for electronic device
The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the...
|
|
|
5339519 |
Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels
A method of attaching a heat sink to a circuit board for cooling an electrical device mounting system employing a plurality of heat conductive layers embedded in a printed circuit board where heat...
|
|
|
5309979 |
Self clamping heat sink assembly
A heat sink assembly for clamping stand-up power components to a heat sink wherein the components are mounted on a circuit board and enclosed within a housing. A spring clamp lightly clamps an...
|
|
|
5307236 |
Heatsink for contact with multiple electronic components mounted on a circuit board
A heatsink to remove heat dissipated by electronic components mounted on a circuit board comprises a thermally conductive material plate disposed over the components and attached by fixing mean...
|
|
|
5304735 |
Heat sink for an electronic pin grid array
A heat sink in adapted to be attached to a pin grid array comprising a pair of grooves extending along opposite sides into which grooves the tops of attachment clips are disposed. The heat sink has...
|
|
|
5302853 |
Land grid array package
A combination heat sink (18, 41, 43) and circuit interface comprises a metallic wafer (15) disposed between an integrated circuit (11) and a printed circuit board (14) in a land grid array package...
|
|
|
5296739 |
Circuit arrangement with a cooling member
The circuit arrangement comprises a mounting plate carrying at least one preferably chip-form component and contact surfaces electrically conductively connected to the component by connecting...
|
|
|
5294830 |
Apparatus for indirect impingement cooling of integrated circuit chips
An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable,...
|
|
|
5291063 |
High-power RF device with heat spreader bushing
A high-power RF feedback resistor assembly includes a flat film resistor or other flat device mounted in thermal communication onto a bushing which is, in turn, mounted directly onto a cooling...
|
|
|
5285462 |
Laser beam emitting device
A laser package is fixed by a fixing block in a mounting hole formed in an optical base. The laser package is pressed against the fixing block by a pressing plate and held between the pressing...
|
|
|
5283467 |
Heat sink mounting system for semiconductor devices
A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is...
|
|
|
5280191 |
Lightwave packaging for pairs of optical devices having thermal dissipation means
An optical package particularly suited for use with a pair of optical devices is disclosed. In a preferred embodiment, the package may house an optical transmitting device and an optical receiving...
|
|
|
5280409 |
Heat sink and cover for tab integrated circuits
An apparatus providing a heat sink and protective cover for a Tape Automated Bonding ("TAB") integrated circuit mounted on a printed circuit board. The apparatus is comprised of a printed circuit...
|
|
|
5276585 |
Heat sink mounting apparatus
A clip having parallel edge frames with pockets at each end and connected by transverse beams is used to removeably secure a heat sink to an orthogonal device package by inserting the corners of...
|
|
|
5262925 |
Tab frame with area array edge contacts
The invention is embodied in a TAB frame with wide spaced area array contacts. The area array contacts serve to transform the narrow pitch contacts which connect to a chip mounted on the tab frame...
|
|
|
5260602 |
Hybrid integrated-circuit device having an asymmetrical thermal dissipator
A hybrid integrated circuit device includes first and second circuit boards having heat emitting semiconductor devices mounted on each circuit board, the circuit boards being respectively attached...
|
|
|
5258887 |
Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
An electrical device mounting system employing a plurality of heat conductive layers embedded in a printed circuit board where heat conduction therebetween is facilitated by a plurality of heat...
|
|
|
5257162 |
Bellows lid for c4 flip-chip package
An electronic package that has a lid that is in direct contact with an integrated circuit that is mounted to a substrate. The lid includes a plate portion that is in contact with the integrated...
|
|
|
5251101 |
Dissipating structure for central processing unit chip
A dissipating structure for central processing unit chip includes a frame, a fixture, a felt board, a dissipating board, and a fan, wherein an open end of the fixture is rotatably secured to the...
|
|
|
5251098 |
Multiple transistor clamping device and method
A heat sink-hybrid circuit assembly clamping device (100) and method (200) are provided for minimizing hybrid circuit assembly substrate-transistor solder joint stress. The clamping device is...
|
|
|
5247425 |
Semiconductor device
A container type semiconductor device containing many semiconductor elements is provided. The device allows heat to be dissipated from both sides of each semiconductor element by placing metal...
|
|
|
5243218 |
Cooling structure for electronics devices
A cooling structure for LSI or the like devices to be mounted in a small size electronic apparatus housing. A main printed circuit board has mounted thereon first electronic devices with low heat...
|
|
|
5241215 |
Method and apparatus for providing novel hybrid circuit assembly carrier bracket
An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a...
|
|
|
5227663 |
Integral dam and heat sink for semiconductor device assembly
A metallic or ceramic dam structure surrounding a semiconductor die in a semiconductor device assembly is disclosed. The dam structure forms a cavity containing a potting compound encapsulating the...
|
|
|
5214309 |
Thermally conductive bar cooling arrangement for a transistor
A cooling structure for a high frequency power transistor is mounted on a circuit board where heat generated by the transistor is conducted from the semiconductor material through the collector...
|
|
|
5206792 |
Attachment for contacting a heat sink with an integrated circuit chip and use thereof
An attachment for removably thermally contacting a heat sink with an integrated circuit chip located on a chip carrier which in turn is located on an integrated circuit card or board containing a...
|
|
|
5204804 |
GTO module with piggyback bypass diode
A power supply has a stack formed by a first bus plate, a gate take off (GTO) thyristor, a second bus plate, a bypass diode and a third bus plate all mounted to a heat sink by a single clamp, with...
|
|
|
5189509 |
Semiconductor device and electrode block for the same
A flat-pack type GTO thyristor (100) has an external cathode electrode (30) placed on a semiconductor element (1). The top surface of the external cathode electrode has a three-level step...
|
|
|
5184211 |
Apparatus for packaging and cooling integrated circuit chips
A packaging and cooling assembly for integrated circuit chips includes a base for reception of one or more circuit chips, and a combination heat sink and cover for attachment to the base. The...
|
|
|
5144532 |
Circuit board assembly
A circuit board assembly for data equipment such as those having large numbers of layers and great power requirements in a small space having high computer performance, includes a multi-layer...
|
|
|
5138524 |
Apparatus for securing electronic device packages to heat sinks
An elongated unitary clip apparatus having an S-shaped mid-section connecting end portions which extend in opposite directions from the mid-section is mounted within an aperture in a support base...
|
|
|
5132873 |
Diaphragm sealing apparatus
An article provides sealing of an electronic component connected to a mating fluid heat exchanger by providing a diaphragm with an opening shaped to fit about the heat exchanger, the opening...
|
|
|
5131456 |
Bimetallic insert fin for high conduction cooling structure
A high conduction cooling structure useful for dissipating heat from integrated circuit devices includes a cooling base (10), a bulk heat transfer element (18), adjacent spaced apart cooling fins...
|
|
|
5119175 |
High power density solid-state, insulating coolant module
A high power density semiconductor module of reduced size and weight wherein a fusion element assembly for meeting electrical power processing requirements is nested in a hollow casing for both...
|
|
|
5109318 |
Pluggable electronic circuit package assembly with snap together heat sink housing
A pluggable electronic circuit package assembly for use with an edge type connector has a two piece heat sink housing. The heat sink housing has internal retention posts and internal posts...
|
|
|
5107330 |
Self-adjusting heat sink design for VLSI packages
The present invention is an electronic circuit, such as a Hybrid Integrated Circuit (HIC), having an element mounted on a suitable support base, and a self-adjusting heat sink mounted on the...
|
|
|
5052481 |
High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology
The present invention dissipates the heat generated by high powered VLSI chips to a heat sink in a very efficient manner, providing a thermal resistance heretofore not possible in heat conduction...
|
|
|
5049981 |
Heat sink for electronic circitry
A thermally balanced electronic circuit having an element mounted on a suitable support base, a heat-sink having a bottom portion contacting the element and at least one flange projecting from the...
|
|
|
5040096 |
High force clip
A clip for attaching a semiconductor to a heat sink comprises an arcuate section having a lip which contacts a projection on a heat sink so that the remainder of the arcuate section is disposed...
|
|
|
5031028 |
Heat sink assembly
A heat sink/electromagnetic shield assembly for a circuit element disposed upon a circuit board. A spring clip containing at least one hooked projection forming the spring is positioned in a...
|
|
|
5023695 |
Flat cooling structure of integrated circuit
A circuit assembly with circulation of coolant. A plurality of chips of integrated circuit are arranged on a substrate separately from each other in rows and columns. A circulating unit disposed on...
|
|
|
5019942 |
Insulating apparatus for electronic device assemblies
Disclosed are insulating covers for electronic device packages secured to heat sinks by clips. The covers provide minimum predetermined creepage distance between the electronic device packages and...
|
|
|
5016090 |
Cross-hatch flow distribution and applications thereof
A cold plate and an integrated circuit cooling module embodying a cross-hatch coolant flow distribution scheme. Cross hatch flow distribution is achieved by way of two sets of channels which run...
|
|
|
5014777 |
Cooling structure
A cooling structure which includes a substrate, at least one heat generating member fixed on the substrate, a heat radiating member provided above the heat generating member, and an elastic heat...
|
|
|
5005638 |
Thermal conduction module with barrel shaped piston for improved heat transfer
An otherwise conventional multi-chip circuit module called a thermal conduction module (TCM) is provided with "barrel shaped" pistons that give improved cooling for chips that may be tilted with...
|