Matches 601 - 650 out of 836 < 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 >
Match Document Document Title
5661639 Structure for attaching a heat sink to a semiconductor device  
In a structure for attaching a heat sink to a semiconductor device in which a frame is encapsulated in a resin mold, a pin is formed integrally with the semiconductor device, and a hole engageable...
5654587 Stackable heatsink structure for semiconductor devices  
A stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending...
5621244 Fin assembly for an integrated circuit  
A fin assembly for dissipating heat generated by an integrated circuit chip mounted on a socket having a pair of positioning ears disposed at two opposite sides thereof is disclosed. The fin...
5619399 Multiple chip module mounting assembly and computer using same  
A mounting assembly for a multiple chip module or other circuit module, which includes a board having a surface including an array of board contacts, such as a printed wiring board in a computer...
5615224 Apparatus and method for stabilization of the bandgap and associated properties of semiconductor electronic and optoelectronic devices  
A structure for stabilizing the wavelength and output power of uncooled diode semiconductor lasers using stress caused by differential expansion to counteract the effects of temperature fluctuation...
5611393 Clamping heat sink  
A clamping heat sink formed of a thermally conductive material for releasable attachment to an electronic component. The clamping heat sink includes a horizontal base wall, a pair of vertical side...
5603374 Heat sink assembly for an integrated circuit  
A heat sink assembly for an integrated circuit comprises a base plate defining a central opening and an integrated circuit receiving slot, a fin plate defining a downwardly extending protrusion, a...
5589711 Semiconductor package  
In a semiconductor package comprising a heat spreader, a heat sink, a wiring board, and a connector, a heat spreader mounted on a remaining region of the upper surface of a substrate. The heat sink...
5587608 Structure heat sink for power semiconductors  
An improved structure of a heat sink for power semiconductors is provided in the form of a U-shaped heat sink extruded from an aluminum material. The heat sink has a number of individual and...
5583746 Heat sink assembly for a central processing unit of a computer  
A heat sink assembly for a central processing unit (C.P.U.) of a computer consists of a baseplate to which a fan is attached, a plurality of spacers, a corresponding plurality of plates, the...
5583378 Ball grid array integrated circuit package with thermal conductor  
A ball grid array package and low cost method for manufacture of the same is disclosed herein. The ball grid array package includes a thermal conductor which is a linearly co-extensive outer layer...
5576578 High voltage insulating disk  
An insulating disk composed of electrically insulating and thermally conducting material. The disk has one side provided with a central recess having a cross section which is equal to a cross...
5565705 Electronic module for removing heat from a semiconductor die  
An electronic module (10) for removing heat from a semiconductor die (41) and a method of making the electronic module (10). The electronic module (10) has a baseplate (11) mated with an isolation...
5560423 Flexible heat pipe for integrated circuit cooling apparatus  
A heat pipe which is flexible and thus conformable to the space in which it is to be deployed consists of two or three layers, namely, a relatively thin, highly conductive plate as a bottom layer,...
5561325 Mounting structure and fastener for heat sink  
A heat sink mounting structure which can increase a cooling efficiency and easily mount a heat sink. The heat sink mounting structure includes an integrated circuit package, a heat sink mounted on...
5559675 Computer CPU heat dissipating and protecting device  
A heat dissipating and protecting device for computer central processing unit (CPU) mounted on a printed circuit board (PCB) includes a first conduction member directly disposed on the CPU and a...
5552634 Method and apparatus for dissipating heat in an electronic device  
Method and apparatus for cooling an electronic dissipate heat. The method includes the steps of providing a heat sink made from a powdered metal, placing the heat sink in thermal communication with...
5549155 Integrated circuit cooling apparatus  
The apparatus is a cooling device for an integrated circuit chip which includes a heat conductive pad for contact with the top surface of the chip and for attachment to a heat pipe to dispose of...
5548487 Flat circuit module mounting using an elastic pad in a depression of a circuit board  
A flat circuit module assembly includes a circuit board and unpackaged, or housingless, chips mounted on its surface, with an elastic pressure pad between the circuit board and the chips. To...
5543662 Low heat loss and secure chip carrier for cryogenic cooling  
An integrated circuit package is disclosed. The integrated circuit package includes a substrate having a cavity formed therein for enclosing an integrated circuit. The integrated circuit package...
5521439 Combination and method for coupling a heat sink to a semiconductor device  
A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink,...
5510650 Low mechanical stress, high electrical and thermal conductance semiconductor die mount  
This invention includes semiconductor devices including the heat sink with a slitted metal strip, such as copper, which is coiled or folded to produce an array of flexible flat fingers for...
5509465 Heat-dissipating device for a central processing unit chip  
A heat-dissipating device for a central processing unit chip includes a plurality of heat-dissipating fins. Each fin has at least one through-hole, a lower edge, and a flange connected...
5506752 Apparatus for cooling an integrated circuit chip  
An apparatus for cooling an integrated circuit chip that comprises an air movement device, a plurality of mounting clips, and a plurality of fasteners. The mounting clips are for clipping the air...
5500556 Packaging structure for microwave circuit  
A packaging structure for a microwave circuit having excellent heat radiation and obviating an intricate and large-sized shielding case is provided, the packaging structure comprising a circuit...
5495392 CPU heat dissipating apparatus  
A CPU heat dissipating apparatus including a radiating panel attached to the top side of a CPU to hold a fan between two opposite upright side walls on the radiating panel, and a mounting frame...
5489802 Pressure contact type semiconductor device and heat compensator  
A semiconductor substrate (2) is pressed against heat compensators (6, 31) for electrical contact therewith without brazing. Silicone rubber (32) fixes the outer peripheral edge of the...
5489805 Slotted thermal dissipater for a semiconductor package  
An integrated circuit package that contains a heat spreader which has a plurality of legs stamped from a sheet of metal material. The heat spreader also has a plurality of slots which allow plastic...
5488255 Cooling device for semiconductor packages, having flexible film heat expulsion means  
A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened...
5483103 Means for clamping a semi-conductor to a support  
Apparatus is presented herein for resiliently clamping at least one semi-conductor device to a support having an upper surface and wherein the semi-conductor device includes a housing having upper...
5477916 Retainer frame assembly for dissipating heat generated on an integrated circuit chip  
A retainer frame assembly for dissipating heat generated on an integrated circuit chip comprising a generally rectangular base frame configured to enclose a chip, a heat-dissipating cover to be...
5466970 Hooked spring clip  
A spring clip having a flat base and a spring portion extending from the base portion intermediate its ends supporting a finger is used to hold an electronic device package in thermal contact with...
5464054 Spring clamp and heat sink assembly  
A mounting clip for securing a heat sink to a device package is secured to the heat sink by forming a groove in the heat sink, positioning the central body portion of the clip in the groove and...
5459352 Integrated circuit package having a liquid metal-aluminum/copper joint  
An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a...
5455462 Plastic molded package with heat sink for integrated circuit devices  
An integrated circuit package including a heat sink is disclosed. The package incorporates an sealing (or locking) ring located circumferentially around the heat sink to provide a better seal...
5442234 Apparatus for thermally coupling a heat sink to a leadframe  
A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A...
5440172 Integral heat sink interface  
An apparatus comprises a thermal energy generating device and a thermal energy dissipating device having a reduced thermal resistance of the interface between the two. The reduction is achieved by...
5424919 Repairable electronic circuit package  
A dismountable, materially separable circuit package is made up by stacking pairs of heat sink, carrier, and bridge components in a back to back fashion. The package is mechanically clamped to form...
5420752 GPT system for encapsulating an integrated circuit package  
The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold...
5402004 Heat transfer module for ultra high density and silicon on silicon packaging applications  
A system for dissipating heat from semiconductor chips disposed on a substrate which may individually produce differing amounts of heat, the substrate secured to a device uniformly distributing the...
5399906 High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator  
A high-frequency semiconductor hybrid integrated circuit device with desirable high-frequency properties and reduced floating capacitance that is easily manufactured at lower cost with reduced...
5397919 Heat sink assembly for solid state devices  
A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink...
5396402 Appliance for attaching heat sink to pin grid array and socket  
A device for attaching a heat sink to a chip having an integrated circuit and a pin grid array socket. The device includes a leaf spring pre-assembled to two plastic clips, each of the plastic...
5386144 Snap on heat sink attachment  
A heat sink (44-48) is detachably mechanically connected to an electronic component package (10) by means of a pair of mutually spaced and parallel spring rods (16, 18) that are fixed to the...
5381041 Self clamping heat sink  
A self clamping heat sink for releasable connection to an electrical component having a bottom surface and a top surface. The self clamping heat sink includes a base and a pair of inverted U-shaped...
5381305 Clip for clamping heat sink module to electronic module  
A spring clip for clamping a heat sink module to an electronic module. The heat sink module has a flat upper surface and a plurality of vertical cooling elements which extend upwardly from the...
5375652 Heat radiating apparatus for semiconductor device  
A heat radiating apparatus for a semiconductor device, in which said semiconductor device mounted on a circuit board is cooled by a radiator. The radiator is provided with a stepped portion, and...
5373418 Electrical device for mounting electrical components with enhanced thermal radiating properties  
An electrical device for mounting electrical components includes an integrally die-cast aluminum base 20 having at an upper side thereof recesses 20a for receiving the electrical components and at...
5373099 Fixing device for fixing electronic component against a wall of a heatsink  
A fixing device for fixing an electronic component (10) against a first wall (11) of a heatsink (12) includes at least one end branch engaged in a recess (81) provided in a second wall (82) of the...
5371753 Laser diode mount  
A laser diode mount having a thermal coupling for a laser diode heat sink utilizes a shape memory alloy in the maintaining of laser diode arrays within an operational temperature bandwidth. A diode...
Matches 601 - 650 out of 836 < 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 >