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6191478 |
Demountable heat spreader and high reliability flip chip package assembly
A demountable heat spreader assembly utilizing a unique retainer frame for demountably retaining a heat spreader having a flexible thermal interface material disposed in a cavity of the heat...
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6188131 |
Clip for retaining a heatsink onto an electronic component
An electronic component assembly includes an electronic component mounted on a socket, a heatsink seated on top of the electronic component for removing at least some of the heat produced by the...
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6188579 |
Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage
A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the...
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6188577 |
Protective device for central processing unit
A protective device for a central processing unit contains a supporter disposed on a central processing unit (CPU), wherein a window is formed in the central portion of the supporter; a plurality...
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6184580 |
Ball grid array package with conductive leads
A ball grid array package with conductive leads comprising a silicon chip, a heat sink, a plurality of conductive leads, bonding wires, and solder balls, a substrate and a molding compound. The...
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6181559 |
Device for attaching a heat sink
A device for attaching a heat sink having a first and a second surface to an element generating heat in an electronic system, which element has an upper plane side contacting the first surface of...
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6181556 |
Thermally-coupled heat dissipation apparatus for electronic devices
A thermally-coupled heat-dissipation apparatus (10) surrounds a solid state electronic device mounted on an adapter circuit board (14) or a thermal transfer column (74) extending upwardly from a...
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6177727 |
Saddle bracket for solid state pressure gauge
A semiconductor component (31) and a method for coupling a semiconductor device (36) to a substrate (81). The semiconductor component (31) includes a saddle (34) and the semiconductor device (36)....
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6169660 |
Stress relieved integrated circuit cooler
The invention is an integrated circuit cooler in which a heat spreader is mounted atop a weight sensitive integrated circuit package, and at least one heat pipe is attached to the heat spreader and...
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6166435 |
Flip-chip ball grid array package with a heat slug
An extended flip chip ball grid array package includes a metal heat slug bonded to the surface of a semiconductor chip. The heat slug has a bonding structure for connecting itself and a BGA...
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6160704 |
Integral heat-sink and motor assembly for printed circuit boards
An integrated spring assembly having a first part for attachment to a miniature electric fan, a second part for attachment to a heat sink and a third part for attachment to a printed circuit board....
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6156587 |
Method of attaching solid state imaging device
First, a CCD package is attached to a plane of a flexible substrate. A reference plane, which is parallel to an image forming plane of a solid state imaging device chip, is formed at the top of the...
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6153932 |
Fix base of integrated circuit chipset and heat sink
An improved fix base of a heat sink used to dissipate the heat produced by an integrated circuit chipset in a personal computer is disclosed. The fix base includes a rectangular frame, which has...
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6151214 |
Bearing structure of a central processing unit
Disclosed is a bearing structure of a central processing unit comprises a radiating plate, a back plate, a plurality of screws and elastic elements. The radiating plate has a heat conductive...
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6144092 |
Electronic power device heatsink clamping system
In a preferred embodiment, an electronic power device heatsink clamping system, including: a heatsink; at least one electronic power device disposed adjacent a side of the heatsink; at least one...
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6137682 |
Air-cooled electronic apparatus
An electronic apparatus includes a circuit board, a connector provided on the circuit board, an integrated circuit module attached to the connector, and a heat sink attached to the integrated...
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6134112 |
Heat sink attachment
To restrain detachment of heat sinks from printed circuit boards (PCBs) or the components mounted on such boards, a body is attached to the board and extends above the tops of the heat sinks. Above...
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6128191 |
Heat sink with integral self-locking clamp
The present invention provides a heat sink for use with a heat-generating electrical component. The heat sink comprises a heat-conducting body having first and second opposing edges, and a clamping...
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6125037 |
Self-locking heat sink assembly and method
A heat sink assembly includes a heat sink having torque bars, the torque bars including lips and guides extending from the lips. A package is located between the heat sink and a circuit board. A...
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6118661 |
Clip for retaining a heat sink on a chip
A clip is configured for retaining a heat sink on a chip and socket combination. The clip includes an arcuate pressing portion, first and second engaging arms downwardly extending from opposite...
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6118660 |
Circuit module with improved heat transfer
An electronic assembly having one or more heat producing semiconductor components in the form of a chip or die has improved heat dissipation properties. The semiconductor components are formed into...
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6109341 |
Electronic component cooling apparatus including elongated heat sink
An electronic component cooling apparatus capable of minimizing or substantially preventing a reduction in cooling efficiency even when discharge of air heated is restricted to two directions. The...
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6111314 |
Thermal cap with embedded particles
The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More...
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6111752 |
Device for fastening a heat sink to a heat-generating electrical component
A clip for fastening a heat sink to a CPU mounted on a ZIF connector is made by stamping a metal sheet. The clip has an elongated body portion for pressing the heat sink toward the CPU. A first arm...
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6105215 |
Clip heat assembly for heat sink
A clip assembly comprises a body and a pair of separate fasteners. The body comprises a base for engaging with a heat sink, a pair of arms extending from opposite diagonal corners of the base, and...
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6104609 |
Structure computer central processing unit heat dissipater
An improved structure computer central processing unit heat dissipater, more specifically a computer central processing unit heat dissipation structure having modular heat sink element capability....
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6101096 |
Heat sink clip for an electronic assembly
A fastener for an electronic assembly. The fastener may have a spring arm that extends from a stem. The fastener can attach a cover to a heat sink of an electronic assembly. The stem may be...
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6097600 |
Electric device
In a box-shaped molded resin body having side walls and a flat plate part in which a heat discharging plate made of a metal is embedded, a part of the heat discharging plate is exposed from a...
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6093961 |
Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment
An molded heat sink assembly includes an integrally molded attachment clip for securing the assembly to a semiconductor package to be cooled. The assembly removes heat from a semiconductor device...
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6088226 |
Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink
The present invention provides a multiple-component clamp for use with multiple, heat-generating components and a heatsink. In one embodiment, the multiple-component clamp comprises a clamp body...
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6081029 |
Resin encapsulated semiconductor device having a reduced thickness and improved reliability
A lead frame including signal-connecting leads, a die pad and support leads is provided. A semiconductor chip is bonded to the die pad with an adhesive. The semiconductor chip, electrode pads and...
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6078359 |
Vacuum compatible miniature CCD camera head
A charge-coupled device (CCD) camera head which can replace film for digital imaging of visible light, ultraviolet radiation, and soft to penetrating x-rays, such as within a target chamber where...
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6075208 |
Component mounting arrangement and assembly
Heat-generating power transistors (3) hanging from a circuit board (2) are mounted pressed flush against the inside surface of a heat dissipating thin sheet metal box (1), by using spring metal...
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6072238 |
Semiconductor component
A semiconductor device (10) suitable for use in RF applications and a method of forming the semiconductor device (10). An RF transistor die (31) is bonded to a heatsink (21). The heatsink (21)...
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6061235 |
Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board...
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6061240 |
Push pin assembly for heat sink for cooling electronic modules
An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which...
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6055159 |
Heat dissipating module for a heat generating electronic component
A heat dissipating module is adapted for use with an electronic component on one side of a circuit board, and includes a heat sink having a contacting portion to be brought into contact with the...
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6049457 |
Device for fastening a heat dissipator to a central process unit
A device which can effectively fasten a heat dissipator to a CPU by a simple operation is disclosed. The device includes a pair of fasteners respectively received in a corresponding channel defined...
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6037660 |
Device for securing a finned radiating structure to a computer chip
The present invention relates to a type of chips radiating structure, there being a radiating plate on the chips on an interface card, and a fixing unit on the radiating plate; wherein said fixing...
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6035523 |
Method and apparatus for supporting a component on a substrate
A support is provided for a component on a substrate to minimize unacceptable bending or displacement. In a preferred embodiment, a suitable amount of a thermoplastic material is injected through a...
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6038156 |
Power inverter with improved heat sink configuration
An inverter for producing AC power from a DC source is disclosed. The inverter uses a transformer and switches to convert current from a battery or other DC source into AC power that can be used to...
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6034874 |
Electronic device with heat radiating member
The electronic device of the present invention includes a printed wiring board having wiring patterns, a heat generating component connected to the wiring patterns, a heat radiating member formed...
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6025991 |
Electronic apparatus having heat dissipating arrangement
An electronic apparatus is provided to efficiently dissipate the heat generated by a heat generating electronic component. The electronic apparatus comprises a framework formed of a metal sheet to...
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6025990 |
Processor support assembly
A method and apparatus for supporting within a chassis enclosure a plurality of microprocessors, each operably coupled to a heat sink, includes mounting within the chassis enclosure one or more...
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6020649 |
Plastic molded semiconductor package and a method for producing the same
In construction of a plastic molded semiconductor package provided with a heat sink and electrically conductive leads attached to the periphery of the heat sink, a conventional electrically...
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6021045 |
Heat sink assembly with threaded collar and multiple pressure capability
A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region and installed in a socket,...
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6018193 |
Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is...
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6018194 |
Transistor clamping fixture
A removable transistor clamping fixture is disclosed which comprises an outer housing with a crosspiece configured to sit on top of the transistor. A U-shaped plunger straddles the crosspiece and...
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6018460 |
Flexible thermal conductor with electromagnetic interference shielding capability for electronic components
A thermal conductor having electromagnetic interference shielding capabilities for electronic components. The conductor comprises a conductive strip and a support surface connected to the...
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6011304 |
Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate;...
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