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7615832 |
Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip
A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip...
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7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply...
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7612446 |
Structures to enhance cooling of computer memory modules
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at...
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7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
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7608915 |
Heat dissipation semiconductor package
A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is...
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7602060 |
Heat spreader in a flip chip package
A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface...
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7586964 |
Laser package and laser module
A laser package has at least one laser device and a hermetically sealed package including a package base and a cap having a light transmissive window for emitting light. The at least one laser...
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7586190 |
Optoelectronic component and a module based thereon
An optoelectronic component ( 1 ) having a semiconductor arrangement ( 4 ) which emits and/or receives electromagnetic radiation and which is arranged on a carrier ( 22 ) which is thermally...
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7579687 |
Circuit module turbulence enhancement systems and methods
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
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7576428 |
Melting temperature adjustable metal thermal interface materials and application thereof
A melting temperature adjustable metal thermal interface material (TIM) is provided. The metal TIM includes In, Bi, Sn, and Ga. A content of Ga ranges from 0.01 wt % to 3 wt %. The metal TIM has an...
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7569930 |
Semiconductor module and radiator plate
A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12 a , 12 b ...
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7569928 |
Assembly structure of electronic element and heat sink
An assembly structure of an electronic element and a heat sink is disclosed. An assembly structure of an electronic element and a heat sink comprises a fastening element, an electronic element...
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7557442 |
Power semiconductor arrangement
A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is...
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7554179 |
Multi-leadframe semiconductor package and method of manufacture
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached...
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7554168 |
Semiconductor acceleration sensor device
A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, and an adhesive portion comprised of a silicone or fluorine resin and...
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7550845 |
Ball grid array package with separated stiffener layer
In a ball grid array (BGA) package, a first stiffener is attached to a surface of a substrate. A second stiffener is attached to the surface of the substrate to be co-planar with the first...
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7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the...
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7545034 |
Thermal energy removal structure and method
An electrical structure including a first substrate comprising a plurality of electrical components, a first thermally conductive film layer formed over and in contact with a first electrical...
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7538426 |
Cooling system of power semiconductor module
A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7521794 |
Intrinsic thermal enhancement for FBGA package
A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the...
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7521789 |
Electrical assembly having heat sink protrusions
An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its...
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7518235 |
Method and structure to provide balanced mechanical loading of devices in compressively loaded environments
An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally...
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7518233 |
Sealing structure for multi-chip module
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in...
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7515426 |
Heat dissipating device for an integrated circuit chip
An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip...
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7514785 |
Semiconductor device and manufacturing method thereof
A semiconductor device includes a solder dam for restricting the flow of solder during manufacturing. The device includes a semiconductor chip bonded to a first side of a circuit board, a metal...
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7514784 |
Electronic circuit device and production method of the same
An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered...
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7511320 |
Semiconductor device and manufacturing method of the same
The invention is directed to an improvement of reliability in a chip-size package type semiconductor device and a manufacturing method thereof. A semiconductor substrate formed with a pad electrode...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7501699 |
Method and apparatus for electrical isolation of semiconductor device
A package includes a thermal solution to thermal couple to a semiconductor device to remove heat generated by the semiconductor device, and a device to electrically isolate at least a portion of...
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7492041 |
Diamond-silicon hybrid integrated heat spreader
An electronic device includes a die further having a first major surface, and a second major surface. The electronic device also includes a plurality of connectors associated with the first major...
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7476967 |
Composite carbon nanotube thermal interface device
Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may...
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7470983 |
Semiconductor device reducing warping due to heat production
A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between...
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7466016 |
Bent lead transistor
A metal backing tab supports the semiconductor device and has an extending portion extending from an edge. A top leg, a middle leg and a bottom leg are all coupled to the semiconductor device and...
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7459784 |
High capacity thin module system
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
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7456052 |
Thermal intermediate apparatus, systems, and methods
Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached...
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7453145 |
Electronics unit
An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components...
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7450174 |
Two-dimensional image detector with disturbance-blocking buffer
A two-dimensional image detector includes a sensitive semiconductor layer for converting optical information or radiological information corresponding to a two-dimensional image of a detection...
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7449775 |
Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion
A decoupling package stack including a circuit board, a substrate mounted on and electrically coupled to the circuit board, a semiconductor die mounted on and electrically coupled to the substrate...
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7446410 |
Circuit module with thermal casing systems
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the...
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7439614 |
Circuit device with dummy elements
In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D 1 is provided on a first wiring layer 18 A. Furthermore, a second...
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7436060 |
Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly
A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the...
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7431071 |
Fluid circuit heat transfer device for plural heat sources
A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources....
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7427566 |
Method of making an electronic device cooling system
A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a...
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7417312 |
Use of solder paste for heat dissipation
A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of...
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7417299 |
Direct connection multi-chip semiconductor element structure
A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips...
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7400506 |
Method and apparatus for cooling a memory device
A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat...
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7400035 |
Semiconductor device having multilayer printed wiring board
A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support...
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7397664 |
Heatspreader for single-device and multi-device modules
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric...
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7382618 |
Heat dissipating apparatus for computer add-on cards
A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of...
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