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9041192 Hybrid thermal interface material for IC packages with integrated heat spreader  
Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first...
9033515 Heat dissipation device of light engine with fan module and heat sink  
A heat dissipation device of a light engine for a projector has a housing, a fan module, a light engine and a heat sink. The light engine is positioned in the housing and connected to the heat...
9030005 Semiconductor device  
In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat...
9018744 Semiconductor device having a clip contact  
A semiconductor device comprises a carrier. Further, the semiconductor devices comprises a semiconductor chip comprising a first main surface and a second main surface opposite to the first main...
9018861 Performance optimization of a field emission device  
A field emission device is configured as a heat engine. Different embodiments of the heat engine may have different configurations that may include a cathode, gate, suppressor, and anode arranged...
9013040 Memory device with die stacking and heat dissipation  
A memory device with die stacking is provided. A plurality of substrates layers are stacked together into a stack. Each substrate layer may include a substrate having a plurality of cavities to...
9006889 Flip chip packages with improved thermal performance  
Systems and methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal...
9000582 Power semiconductor module and power conversion device  
A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is...
9001512 Heat spreader for electrical components  
A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the...
8994168 Semiconductor package including radiation plate  
A semiconductor package includes a wiring board; a semiconductor chip mounted on the wiring board; and a radiation plate mounted on the semiconductor chip, including an insulating member including...
8995129 Heat radiator and manufacturing method thereof  
A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the...
8987895 Clad material for insulating substrates  
A clad material 1A for insulating substrates is provided with a Ni layer 4 made of Ni or a Ni alloy, a Ti layer 6 made of Ti or a Ti alloy and arranged on one side of the Ni layer, and a first Al...
8981555 Ridged integrated heat spreader  
An integrated circuit package is presented. In an embodiment, the integrated circuit package has a package substrate, an integrated circuit die attached to the package substrate, and a package...
8975743 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Semiconductor device
 
In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat...
8952525 Semiconductor module and method for manufacturing semiconductor module  
A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween....
8941234 Manufacturing process and heat dissipating device for forming interface for electronic component  
A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface...
8941233 Integrated circuit package with inter-die thermal spreader layers  
Integrated circuit (IC) packages with an inter-die thermal spreader are disclosed. A disclosed IC package includes a plurality of stacked dies disposed on a package substrate. A heat spreader is...
8941232 Metal bumps for cooling device connection  
The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition,...
8933557 Semiconductor module and cooling unit  
A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant...
8928130 Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same  
A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to...
8916966 Integrated circuit including a heat dissipation structure  
One embodiment of an integrated circuit includes a discrete device that defines a top surface, an integrated circuit substrate, and a heat dissipation structure fully covering the top surface of...
8916964 Semiconductor device and method of producing same  
A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining...
8890217 Electronic device  
An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each...
8872328 Integrated power module package  
An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the...
8860207 Method of fabricating land grid array semiconductor package  
A fan-out wafer level package is provided with a semiconductor die embedded in a reconstituted wafer. A redistribution layer is positioned over the semiconductor die, and includes a land grid...
8847383 Integrated circuit package strip with stiffener  
An integrated circuit package strip employs a stiffener layer that houses a passive electronic component to maintain mechanical properties when a thinner substrate is used. The use of either a...
8836110 Heat spreader for use within a packaged semiconductor device  
A packaged semiconductor device includes a package substrate, an integrated circuit (IC) die mounted on the package substrate, and a heat spreader mounted on the package substrate. The heat...
8823153 Semiconductor package  
Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead...
8815646 Semiconductor device adapted to improve heat dissipation  
A semiconductor device is formed by molding using a resin with a semiconductor element and one or two heat dissipating plates contained therein, said one or two heat dissipating plates being...
8796840 Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers  
A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first...
8759961 Underfill material dispensing for stacked semiconductor chips  
A template having tapered openings can be employed to enable injection of underfill material through gaps having a width less than a lateral dimension of an injector needle for the underfill...
8759963 Underfill material dispensing for stacked semiconductor chips  
A template having tapered openings can be employed to enable injection of underfill material through gaps having a width less than a lateral dimension of an injector needle for the underfill...
8743548 Electric circuit device, electric circuit module, and power converter  
The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line...
8736077 Semiconductor package substrate  
Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base...
8725458 Heat sink blockage detector  
A method, a data processing system, and a computer program product identify blockages in a heat sink of a data processing system. An electromagnetic emitter and an electromagnetic detector are...
8723310 Integrated circuit packaging system having warpage prevention structures  
A method of manufacture of an integrated circuit packaging system includes providing a substrate; connecting an integrated circuit die; forming a molding having a temperature-dependent...
8723214 Submount and manufacturing method thereof  
A submount and a manufacturing method thereof are provided. The submount, on which at least a semiconductor die is disposed, is mounted on a circuit board. The submount includes a substrate made...
8710650 Semiconductor devices having through electrodes and methods of fabricating the same  
Provided are semiconductor devices having through electrodes and methods of fabricating the same. The method includes providing a substrate including top and bottom surfaces facing each other,...
8704362 Resin-diamagnetic material composite structure  
A composite structure 10 of a resin-diamagnetic material, including a diamagnetic material layer 12 and a resin layer 14 is obtained by a method including disposing particles of a diamagnetic...
8681500 Integrated circuit nanotube-based subsrate  
Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube...
8680673 Integrated heat pillar for hot region cooling in an integrated circuit  
The thermal energy transfer techniques of the disclosed embodiments utilize passive thermal energy transfer techniques to reduce undesirable side effects of trapped thermal energy at the circuit...
8681493 Heat shield module for substrate-like metrology device  
A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an...
8674509 Integrated circuit die assembly with heat spreader  
A packaged semiconductor device comprises a package substrate comprising a first package substrate contact and a second package substrate contact, and a semiconductor die over the package...
8670239 Heat-release configuration, bracket for supporting heat-release plate and method of assembling heat-release configuration  
A heat-release configuration includes a printed board on which a semiconductor component is mounted, a heat-release plate which is mounted on the semiconductor component, and configured to diffuse...
8664759 Integrated circuit with heat conducting structures for localized thermal control  
An integrated circuit die includes a substrate having an upper surface, at least one active device formed in a first area of the upper surface of the substrate, and a plurality of layers formed on...
8659130 Power module and power module manufacturing method  
A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor...
8659146 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing  
A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat...
8648462 Semiconductor power module  
A semiconductor power module includes an active element and a passive element serving as semiconductor elements each having a first electrode on a front surface and a second electrode on a back...
8648478 Flexible heat sink having ventilation ports and semiconductor package including the same  
A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first...
8643174 Calibration of temperature sensitive circuits with heater elements  
One or more heating elements are disposed on a semiconductor substrate proximate a temperature sensitive circuit disposed on the substrate (e.g., bandgap circuit, oscillator). The heater...