Matches 101 - 150 out of 641 < 1 2 3 4 5 6 7 8 9 10 11 12 13 >
Match Document Document Title
7106766 Optical device, method of manufacturing the same, optical module, optical transmission system  
In a conventional optical device which mounts a semiconductor light emitting element, the processing is difficult and a manufacturing process cost is expensive because of the necessity of forming...
7105858 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density  
An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for...
7102226 Device and method for package warp compensation in an integrated heat spreader  
A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled...
7091603 Semiconductor device  
In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the...
7091604 Three dimensional integrated circuits  
A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit...
7075180 Method and apparatus for applying body bias to integrated circuit die  
In some embodiments, a method includes providing an integrated circuit (IC) die in a package. The IC die may have a metal layer on a back surface of the IC die. The method may also include applying...
7064428 Wafer-level package structure  
A wafer-level package structure, applicable to a flip-chip arrangement on a carrier, which comprises a plurality of contact points, is described. This wafer-level package structure is mainly formed...
7061103 Chip package structure  
A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is...
7061079 Chip package structure and manufacturing method thereof  
The present invention provides a chip package structure and the manufacturing method thereof, which affords higher heat dissipation efficiency and is suitable to fabricate the stack type package...
7056566 Preappliable phase change thermal interface pad  
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that...
7052937 Method and structure for providing improved thermal conduction for silicon semiconductor devices  
Thermal cooling structures of diamond or diamond-like materials are provided for conducting heat away from semiconductor devices. A first silicon-on-insulator embodiment comprises a plurality of...
7049695 Method and device for heat dissipation in semiconductor modules  
A structure and method are provided for dissipating heat from a semiconductor device chip. A first layer of a dielectric material (e.g. polyimide) is formed on a front side of a heat spreader...
7049696 IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device  
A connection structure including an IC chip, a substrate disposed with a conductive layer, and a heat-radiating mechanism that is mounted on the substrate, disposed between the IC chip and the...
7045890 Heat spreader and stiffener having a stiffener extension  
A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate.
7046155 Fault detection system  
A fault detection system detecting malfunctions or deteriorations, which may result in an inverter fault, is provided. The system has a temperature sensor installed on a semiconductor module to...
7042081 Semiconductor device having heat dissipation layer  
A semiconductor device includes a semiconductor constructing body which has a semiconductor substrate, a plurality of external connection electrodes formed on the semiconductor substrate, and heat...
7030484 Lidless chip package effectively having co-planar frame and semiconductor die surfaces  
A “lidless” integrated circuit package includes a support member that is arranged to support at least part of a load placed on the integrated circuit package. The support member has or is...
7031162 Method and structure for cooling a dual chip module with one high power chip  
Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to...
7026719 Semiconductor package with a heat spreader  
A semiconductor package with a heat spreader is described, including a first chip, a second chip, a heat spreader and a substrate. The first chip has an active surface over which the second chip is...
7022553 Compact system module with built-in thermoelectric cooling  
An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational...
7019395 Double-sided cooling type semiconductor module  
A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor...
7015072 Method of manufacturing an enhanced thermal dissipation integrated circuit package  
In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to...
7015578 Semiconductor unit with cooling system  
A semiconductor unit has semiconductor modules and cooling members. The semiconductor module includes power devices with a flat shape, the first electrode bonded to the first device surface, the...
7009289 Fluxless die-to-heat spreader bonding using thermal interface material  
A thinned semiconductor die is coupled to an integrated heat spreader with thermal interface material to form a semiconductor package. The method for forming the package comprises forming a...
7009284 Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element  
A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided...
7002247 Thermal interposer for thermal management of semiconductor devices  
A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has...
6995463 Integrated chip package having intermediate substrate and multiple semiconductor chips  
The present integrated chip package provides a low cost package that is suitable for high density semiconductors that have high power dissipation. The integrated chip package includes at least one...
6989592 Integrated power module with reduced thermal impedance  
A dual-side thermal interface and cooling design of an integrated power module is disclosed which effectively reduces the equivalent thermal impedance on the power module by 20%. This in turn...
6984887 Heatsink arrangement for semiconductor device  
A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the...
6982481 System for dissipating heat and shielding electromagnetic radiation produced by an electronic device  
Described is an apparatus for dissipating heat and shielding electromagnetic radiation from at least one electronic device on a printed circuit board. The apparatus includes a printed circuit board...
6975027 Multi-chip electronic package and cooling system  
A multi-chip electronic package comprised of a plurality of integrated circuit chips secured together in a stack formation. The chip stack is hermetically sealed in an enclosure. The enclosure...
6975028 Thermal apparatus for engaging electronic device  
An apparatus for controlling the temperature of an electronic device utilizes a thermal head attached to a base structure including an integral isolation arrangement. For example, the isolation...
6975513 Construction for high density power module package  
A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips....
6969907 Cooling structure for multichip module  
A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically...
6967403 Package structure with a heat spreader and manufacturing method thereof  
A package structure with a heat spreader and manufacturing method thereof is disclosed. The package structure includes a substrate, a ground pad, a heat spreader, a non-conductive adhesive layer,...
6963131 Integrated circuit system with a latent heat storage module  
The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat...
6958536 Microelectronic packages having rail along portion of lid periphery  
The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention,...
6956282 Stabilizer/spacer for semiconductor device  
The invention is a leadframe/stabilizer ( 35 ) for use with semiconductor devices. Stabilizer ( 35 ) is for stabilizing the space between of lead frame leads ( 36–39 ) and improving the lead to...
6949838 Integrated circuit device  
The present invention includes integrated circuit devices, synchronous-link dynamic random access memory devices, methods of forming an integrated circuit device and methods of forming a...
6949823 Method and apparatus for high electrical and thermal performance ball grid array package  
A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film...
6946729 Wafer level package structure with a heat slug  
A wafer level package structure and a method for packaging said wafer level package structure are described. The wafer level package structure at least comprises a die, a heat slug covering said...
6946730 Semiconductor device having heat conducting plate  
A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating...
6947285 Thermal interface material  
A thermal interface material ( 40 ) includes a polymer matrix and a number of carbon nanocapsules incorporated in the polymer matrix. The thermal interface material is sandwiched between a heat...
6936919 Heatsink-substrate-spacer structure for an integrated-circuit package  
A packaged integrated circuit that includes a substrate 310 ; a chip 300 mounted on the substrate; and a heatsink 350 mounted on the chip. The heatsink has a spacer 360 attached to one of...
6933602 Semiconductor package having a thermally and electrically connected heatspreader  
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The substrate includes at least one...
6928380 Thermal measurements of electronic devices during operation  
A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic...
6924559 Electronic device with heat conductive encasing device  
The invention relates to the field of electronic devices with a thermally conducting encapsulant for draining away some of the energy dissipated by the electronic components contained in the...
6921973 Electronic module having compliant spacer  
The present invention provides for an electronic control module including a support board, an electronic package, and a compliant spacer disposed between the electronic package and the support...
6921974 Packaged device with thermal enhancement and method of packaging  
A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially...
6920052 Dynamic isolating mount for processor packages  
The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation...
Matches 101 - 150 out of 641 < 1 2 3 4 5 6 7 8 9 10 11 12 13 >