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7417312 |
Use of solder paste for heat dissipation
A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of...
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7400506 |
Method and apparatus for cooling a memory device
A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat...
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7400035 |
Semiconductor device having multilayer printed wiring board
A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support...
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7397664 |
Heatspreader for single-device and multi-device modules
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric...
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7382618 |
Heat dissipating apparatus for computer add-on cards
A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of...
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7365418 |
Multi-chip structure
A multi-chip structure at least including a first chip, a second chip and a first thermal-conductive layer is provided. The first chip has a first surface and a plurality of first pads disposed on...
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7365422 |
Package of leadframe with heatsinks
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed...
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7359201 |
Heat-generating electronic part cover and cover mounting method
A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body ( 20 ) of rectangular prism shape having...
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7358605 |
Heat dissipation structure for electronic device
A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering...
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7355276 |
Thermally-enhanced circuit assembly
A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit...
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7348664 |
Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device
A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first...
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7332807 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric...
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7330355 |
Fixed pillar with heat loss
A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body....
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7327027 |
Thermal interface structure with integrated liquid cooling and methods
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved...
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7323776 |
Elevated heat dissipating device
The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate....
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7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate
First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of...
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7315080 |
Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader
A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded...
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7312525 |
Thermally enhanced package for an integrated circuit
A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the...
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RE39957 |
Method of making semiconductor package with heat spreader
A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least...
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7304381 |
Package and method for attaching an integrated heat spreader
In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat...
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7304372 |
Semiconductor package
A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration.
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7301232 |
Integrated circuit package with carbon nanotube array heat conductor
An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat...
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7285851 |
Liquid immersion cooled multichip module
In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid...
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7274105 |
Thermal conductive electronics substrate and assembly
An electronics assembly is provided including a circuit board substrate having a top surface and a bottom surface and a plurality of thermal conductive vias extending from the top surface to the...
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7268428 |
Thermal paste containment for semiconductor modules
A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal...
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7256492 |
Heat sink and display panel including heat sink
A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor...
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7245022 |
Semiconductor module with improved interposer structure and method for forming the same
Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an...
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7235876 |
Semiconductor device having metallic plate with groove
A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block...
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7235880 |
IC package with power and signal lines on opposing sides
A package for integrated circuits is described. The package has a package substrate with a land side and an opposite die side, a first set of low level signal connectors on the die side to connect...
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7236367 |
Power electronics component
The invention relates to a power electronics component that comprises a planar ceramics substrate ( 2 ) on whose one face condutor tracks ( 6 ), applied in thick-film technique, are disposed for...
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7211890 |
Integrating thermoelectric elements into wafer for heat extraction
An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare...
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7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment
There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device...
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7205654 |
Programmed material consolidation methods for fabricating heat sinks
Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that...
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7200006 |
Compliant thermal interface for electronic equipment
A thin metallic sheet having an array of alternating domes, directed away from opposite sides of the sheet, to bridge a gap between a top surface of a processor package and a bottom surface of a...
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7196426 |
Multilayered substrate for semiconductor device
A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting...
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7193328 |
Semiconductor device
Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and...
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7193316 |
Integrated circuit coolant microchannel with movable portion
According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the...
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7183642 |
Electronic package with thermally-enhanced lid
Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the...
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7166914 |
Semiconductor package with heat sink
A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element...
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7166912 |
Isolated thermal interface
An isolated thermal interface is presented. The inventive interface includes a flexible graphite sheet having two major surfaces, at least one of the major surfaces coated with a protective coating...
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7151671 |
Power supply
A power supply comprising switching elements ( 20 ), wherein the power supply is provided with first heat sinks ( 30 ) having electrical conductivity to which the switching elements are fitted and...
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7145225 |
Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
An interposer includes a substrate, first and second sets of contact pads carried by the substrate, and receptacles formed in a surface of the substrate and exposing contact pads of the second set....
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7142426 |
Heat dissipating device and method for manufacturing it
A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an...
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7135644 |
Permeable conductive shield having a laminated structure
A permeable conductive shield providing protection from electromagnetic interference and electrostatic discharge has a laminated structure suitable for application to the foil side or the component...
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7133286 |
Method and apparatus for sealing a liquid cooled electronic device
A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary...
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7132746 |
Electronic assembly with solder-bonded heat sink
A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive...
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7129640 |
Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
An integrated circuit (IC) device for driving a light emitting device, such as a laser diode, includes a heat-absorbing structure fabricated on a substrate over an electrical component, such as an...
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7115988 |
Bypass capacitor embedded flip chip package lid and stiffener
The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also...
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7112883 |
Semiconductor device with temperature control mechanism
A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal...
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7106766 |
Optical device, method of manufacturing the same, optical module, optical transmission system
In a conventional optical device which mounts a semiconductor light emitting element, the processing is difficult and a manufacturing process cost is expensive because of the necessity of forming...
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