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4542401 |
Semiconductor device with sprayed metal layer
A semiconductor device has a sprayed metal layer formed by a method such as plasma spraying on a metal substrate of a material such as aluminum, and a semiconductor element attached to the sprayed...
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4538169 |
Integrated alternator bridge heat sink
An apparatus is provided for sinking heat from the diodes of an alternator bridge whereby the heat is transferred directly to the alternator casting. A mounting base is mounted on the alternator...
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4538168 |
High power semiconductor package
A high power semiconductor package having a unitary extruded metal housing which serves as an efficient thermal heat sink and which includes integral constituents for retaining an encapsulating...
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4495515 |
Electrically isolating two piece mounting washer arrangement
A mounting washer arrangement for a new type power transistor package comprises two interlocking washers. A first mounting washer part of heat sinking material fits under the transistor body; a...
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4482915 |
Lead frame for plastic encapsulated semiconductor device
The invention provides a lead frame for a plastic encapsulated semiconductor device wherein one of the external leads connected to a first connecting band extends from one edge of a substrate...
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4460917 |
Molded-in isolation bushing for semiconductor devices
An improved molded-in insulated bushing is provided to electrically isolate the mounting fastener used to attach the metallic heat spreader of a semiconductor power device to an external heat sink....
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4450471 |
Semi-conductor power device assembly and method of manufacture thereof
A heat spreader has a thin ceramic layer plasma sprayed onto its lower surface which may be chamfered. The upper surface of the spreader is then plated with a thin nickel or gold layer and a...
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4449292 |
Method of clamping a circuit package to enhance heat transfer
The compact circuit package (11) includes an insulating housing (12) providing a circuit retaining cavity (19) substantially surrounded by a pair of spaced side walls (15, 16) each terminating at a...
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4404739 |
Method for mounting, electrically isolating and maintaining constant pressure on a semiconductor element
A semiconductor element is positioned between opposing faces of two thermally and electrically conductive members. An external force is then applied to the two members to move the opposing faces of...
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4396936 |
Integrated circuit chip package with improved cooling means
An integrated circuit package in which an integrated circuit chip having flexible beam leads, the inner lead bonding sites of which are bonded to input and output terminals on the active face of...
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4390891 |
Semiconductor component with a plurality of semiconductor elements
Semiconductor component having a plurality of semiconductor elements disposed in a case, including a bottom of the case, and case terminals, including conductor bars electrically connecting the...
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4352120 |
Semiconductor device using SiC as supporter of a semiconductor element
In a semiconductor device, an active element is mounted on a supporter made of silicon carbide SiC. Since the thermal expansion coefficient of SiC is nearly equal to that of the semiconductor...
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4342068 |
Mounting assembly for semiconductor devices and particularly power transistors
A mounting assembly for a semiconductor device, particularly a power transistor, which encloses and holds the device upon a plate which serves as a heat sink securely on a printed circuit board has...
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4338577 |
Semiconductor laser apparatus
Semiconductor laser apparatus wherein a semiconductor laser device and a temperature sensor for sensing the temperature of the laser device are mounted on a heat sink or base and airtightly...
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4333101 |
Semiconductor heat sink mounting assembly
A field replaceable silicon controlled rectifier (SCR) heat sink with reliable thermal and electrical connection to the SCR or other electronic device for an electronic circuit forming part of a...
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4303935 |
Semiconductor apparatus with electrically insulated heat sink
A semiconductor element, either a diode or a controlled rectifier, is electrically insulated relative to the heat sink on which it is mounted by either an insulating layer or an insulating diode of...
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4288839 |
Solid state device mounting and heat dissipating assembly
By providing a retaining surface, upon which a solid state device is positioned, and a device securing means movable into and out of compression engagement with a portion of the solid state device,...
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4278990 |
Low thermal resistance, low stress semiconductor package
A semiconductor device having especially low thermal impedance between a semiconductor element and a heatsink is described wherein the semiconductor element is directly disposed upon a thin, low...
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4270138 |
Enhanced thermal transfer package for a semiconductor device
A semiconductor device for flush mounting to an external heatsink includes an integral encapsulating body and an internal heatsink having a surface for heat transfer to an external heatsink. The...
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4266267 |
Mounting arrangement for transistors and the like
A power transistor, solid state device, or electronic component is mounted on a chassis or heat sink with a thin sheet of insulating material between the transistor and chassis. Machine screws hold...
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4237086 |
Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction
The bottom surface of a substrate and the support surface of a base on which the substrate is to be mounted are treated with a release agent. A thin layer of a conformable resin is interposed...
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4231058 |
Tungsten-titanium-chromium/gold semiconductor metallization
Improved TRAPATT diodes in which the improvement comprises a high-temperae metallization on silicon from which the diodes are formed. Metallization is applied to a silicon wafer by sputtering a...
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4218695 |
Semiconductor rectifier housing assembly
Semiconductor component includes a closed housing having a base and a cover and being formed with a plurality of recesses therewithin, a plurality of semiconductor elements received in the...
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4209799 |
Semiconductor mounting producing efficient heat dissipation
In order to efficiently dissipate heat from both sides of a semiconductor vice to an associated cooling element, the device is contacted at its two load current conducting sides by conductive...
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4183041 |
Self biasing of a field effect transistor mounted in a flip-chip carrier
A field effect transistor is mounted in a flip-chip carrier which is in contact with one surface of a metal plate, the other surface of the plate being in contact with one surface of a block of...
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4180414 |
Concentrator solar cell array module
A concentrator solar cell array module having a metallic heat sink with a planar mounting surface. A semiconductor spacer is provided. The semiconductor spacer is provided with a layer of...
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4172261 |
Semiconductor device having a highly air-tight package
A semiconductor device is provided with a metal header of a size sufficiently small such that only a semiconductor element holding plate which requires heat dissipation can be mounted thereon. The...
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4160992 |
Plural semiconductor devices mounted between plural heat sinks
A microwave semiconductor device with improved thermal properties is disclosed wherein multiple active semiconductor bodies are disposed between two electrically and thermally isolated heat sinks....
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4150393 |
High frequency semiconductor package
A low parasitic microwave transistor package is provided including a metal header formed from a base member and having a cylindrical center portion; a metallized ceramic insulator formed in an...
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4145708 |
Power module with isolated substrates cooled by integral heat-energy-removal means
The evaporating area of a heat pipe or thermosiphon evaporator is used as the thermal sink for one face of an electrically isolated substrate upon the opposite face of which are mounted and...
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4141136 |
Method of fabricating semiconductor devices with a low thermal resistance and devices obtained by the method
A method of fabricating highly miniaturized semiconductor devices which must be electrically but not thermally insulated from ground, by replacing the conventional disk of beryllium oxide with a...
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4132856 |
Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
A process of packaging an electronic integrated circuit which comprises a film carrier having metallized connector leads formed thereon to provide the connector leads for the integrated circuit (a...
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4124864 |
Plastic encapsulated semiconductor devices
A plastic packaged semiconductor device having a heat sink includes a semiconductor device which requires ultrasonically bonded leads. External leads are attached to the heat sink and have end...
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4117508 |
Pressurizable semiconductor pellet assembly
Disclosed is a semiconductor body mounted on an electrically-insulative, thermally-conductive plate which also carries metallized contacts electrically connected to the various contact areas...
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4103321 |
Composite electric circuit structure of a printed circuit and heat generating discrete electrical component
To prevent failure of solder connections between projecting pins from discrete electrical components, such as power transistors, and printed circuit paths formed on an insulated substrate, the...
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4081825 |
Conduction-cooled circuit package
A circuit package exhibiting an excellent heat transfer path from a semiconductor chip or other heat-generating device to the heat-sink can or cover of the package. A heat-conducting pad is...
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4079410 |
Semiconductor rectifier device with improved cooling arrangement
An improved semiconductor rectifier arrangement of the type in which two ncapsulated rectifier elements, each having at least one pn-junction, are each fastened, via respective metal contact discs...
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4074342 |
Electrical package for LSI devices and assembly process therefor
An electrical package for Large Scale Integrated (LSI) devices includes a carrier having (a) thermal expansion similar to a semiconductor, (b) a standard array of terminal pins (100 or more) and...
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4067041 |
Semiconductor device package and method of making same
The specification discloses a semiconductor device package which includes a conductive heat sink support member which is bonded to a planar face of a ceramic body. A conductive pattern is formed on...
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4047197 |
Housing and lead structure for a series connected semiconductor rectifier arrangement
A semiconductor rectifier arrangement in which two semiconductor rectifier evices which each have at least one pn junction are fastened with their connecting components to one side of a common...
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4000509 |
High density air cooled wafer package having improved thermal dissipation
A high density low profile air cooled wafer package including flip chip and embedded logic or memory islands upon a wafer package mounted within a heat dissipating cover having improved thermal...
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3996603 |
RF power semiconductor package and method of manufacture
High frequency power transistor carriers are made by bonding a metalized ceramic base to a lead frame strip, cutting the lead frame strip to isolate the base and collector leads while still...
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3943556 |
Method of making a high frequency semiconductor package
A method for manufacturing a low cost high frequency transistor package including a metal header, a metallized apertured ceramic insulator affixed to the header, a metallized beryllia insulator,...
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3936866 |
Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate
Integrated circuit chips are mounted in electronic assemblies with the chip terminal pads "up" or on the opposite side of the chip from the substrate of the circuit board. The lower chip surface is...
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3890161 |
Diode array
A method and apparatus for rectifying thermal electrical noise, the preferred apparatus comprising a dielectric ultra-filtration screen membrane having a plurality of cylindrical pores, each pore...
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3870930 |
IMPROVED SEMICONDUCTOR RECTIFIER ASSEMBLY HAVING A PIVOTABLE CONTROL MODULE
An improved mounting for a semiconductor rectifier, its associated heat sink, control module and protective circuitry in which the rectifier is mounted so that wiring at both the front and rear of...
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3852806 |
NONWICKED HEAT-PIPE COOLED POWER SEMICONDUCTOR DEVICE ASSEMBLY HAVING ENHANCED EVAPORATED SURFACE HEAT PIPES
At least one of the two pressure plates used for mounting a replaceable power semiconductor device with pressure interfaces is utilized with an evaporating surface enhancement means as an...
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3846824 |
IMPROVED THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATIVE MOUNTING SYSTEMS FOR HEAT SINKS
A two-part adhesive system for mounting heat sinks to power supply cases. A heat sink made of some suitable material such as aluminum is provided having holes or slots for mounting semiconductors...
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3829598 |
COPPER HEAT SINKS FOR ELECTRONIC DEVICES AND METHOD OF MAKING SAME
A copper layer is fabricated according to a method including the initial step of forming a molybdenum-manganese bonding layer. Thereafter a layer containing copper oxide or copper is formed on the...
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3828228 |
MICROWAVE TRANSISTOR PACKAGE
A package for containing a microwave transistor chip is constructed so that a surface on which the transistor chip is to be mounted is recessed below a metallized surface which serves as an...
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