Matches 451 - 500 out of 640 < 1 2 3 4 5 6 7 8 9 10 11 12 13 >
Match Document Document Title
5049976 Stress reduction package and process  
An integrated circuit package (10) has a layer (22) of silicon positioned between copper die attach pad (18) and silicon integrated circuit die (12). The layer (22) should have a thickness of about...
5043797 Cooling header connection for a thyristor stack  
In a liquid cooled thyristor stack in which a plurality of disk thyristors are stacked between a plurality of cold plates such that each thyristor has a cold plate on either side thereof,...
5043796 Isolating multiple device mount with stress relief  
A substrate of copper clad alumina lamina bearing a number of semiconductor dies is adapted to be soldered to a heatsink to provide electrically isolated thermal relief for the dies. Channels of...
5021925 Electrical isolator device  
An electrical isolator device which comprises at least one heat sink (steel plate), and a non-conductive housing which partially encases the heat sink, such that at least one surface of the heat...
5008492 High current feedthrough package  
A high current feedthrough package comprising a plurality of alternating rings respectively comprising a thermally conductive material and an electrically conductive material. The thermally...
5006925 Three dimensional microelectric packaging  
A three dimensional chip package comprising a plurality of semiconductor substrates, each having at least one semiconductor electronic device mounted thereon; wherein at least a subset of said...
5006921 Power semiconductor switching apparatus with heat sinks  
A semiconductor switching apparatus includes a member for radiating heat generated from semiconductor switching element chips and for reducing a thermal stress. The lengths of gate electrode wires...
4983840 Measuring system constituted by a radiation detection circuit, a reading circuit and a support such as a cryostat cold finger  
Measuring system constituted by a radiation detection circuit (3) welded to a reading circuit (2) by metal members (4), which is itself welded to a grooved cover (9) by other metal members (19)....
4982274 Heat pipe type cooling apparatus for semiconductor  
A heat pipe type cooling apparatus for a semiconductor, comprises a plurality of first copper pipes, each of the first pipes having a plurality of V-shaped grooves formed in an inner surface...
4971633 Photovoltaic cell assembly  
A photovoltaic assembly for converting high intensity solar radiation into lectrical energy in which a solar cell is separated from a heat sink by a thin layer of a composite material which has...
4965660 Integrated circuit package having heat sink bonded with resinous adhesive  
An integrated circuit package produced by bonding a rear surface of an insulating substrate enclosed in the package to a heat sink such as a cooling fin by a resinous adhesive, which may include...
4945396 Semiconductor device having Darlington transistors  
A semiconductor device, CHARACTERIZED in that a Darlington transistor in which in one surface of a semiconductor of a first conductivity type, base regions of a second conductivity type, the number...
4916518 Plastic encapsulated semiconductor device and method for manufacturing the same  
A semiconductor device has a lead frame. The lead frame has a mount portion and a lead portion. A semiconductor chip is mounted on one major surface of the mount portion of the lead frame. The...
4914551 Electronic package with heat spreader member  
An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with...
4910581 Internally molded isolated package  
A semiconductor package having an internally isolated die flag form an externally exposed heatsink is provided by using a two stage molding process. The first molding stage provides a uniform layer...
4901137 Electronic apparatus having semiconductor device  
Disclosed is an electronic apparatus wherein a large power consumption type semiconductor device is mounted on a ceramic substrate of sintered aluminum nitride with high thermal conductivity for...
4876588 Semiconductor device having ceramic package incorporated with a heat-radiator  
A semiconductor device in which a heat-radiator is bonded by a resin film to a metal plate constituting a part of a package is disclosed. Gold plating layers are employed in bonding pads, outer...
4858073 Metal substrated printed circuit  
A semiconductor fabrication having thermal characteristics comparable to hybrid ceramic packages comprises a flexible copper foil printed circuit on a thin polyimide film layer thermally laminated...
4849803 Molded resin semiconductor device  
Diode chips 5, 6 soldered to a terminal plate 4 within a housing 1, 2 are surrounded by a low thermal expansion, high thermal conductivity thermosetting resin 13, 14, in turn covered by a flexible...
4849856 Electronic package with improved heat sink  
An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper...
4830678 Liquid-cooled sealed enclosure for concentrator solar cell and secondary lens  
The sealed enclosure for an electrical power generation solar concentrator holds and protects the photovoltaic cell from ambient conditions and thermal shock, while multiple fingers of front and...
4827329 Semiconductor array  
In a semiconductor array having a plastic casing and a cooling portion which is at least partly not embedded in the plastic, an insulating portion is provided which is designed to slide onto the...
4825284 Semiconductor resin package structure  
A semiconductor resin package structure formed according to the flip-chip connection method and permitting to cool the rear surface of semiconductor chips, comprising semiconductor chip and carrier...
4807018 Method and package for dissipating heat generated by an integrated circuit chip  
An integrated circuit package having a semiconductor integrated circuit chip thermally and mechanically coupled to a cooling plate is described. The leadframe conductors for the package have bent...
4803590 Electric switching device  
An electrical switching device includes a hermetically sealed housing enclosing at least one power switching component mounted on a cooling plate and a plurality of connector parts which are guided...
4788584 RF transistor package with capacitor  
A semiconductor device comprising a conductive layer; an insulting layer mounted on the conductive layer and having an opening; terminals deposited on the insulating layer; an active semiconductor...
4783428 Method of producing a thermogenetic semiconductor device  
A method is described for coupling the leadframe of a thermogenetic semiconductor device to a heatsink. This method consists of screening a first layer of thermally conductive epoxy on the...
4771366 Ceramic card assembly having enhanced power distribution and cooling  
A ceramic card assembly which provides high density three dimensional semiconductor device packaging and overcomes the power distribution and thermal management problems that have impaired prior...
4764804 Semiconductor device and process for producing the same  
A semiconductor device having improved heat-dissipating characteristics employs a thin insulator film made of diamond, which has excellent thermal conductivity, as an insulator film which is formed...
4750089 Circuit board with a chip carrier and mounting structure connected to the chip carrier  
A chip carrier is supported by a thermally conductive spacer block under its center, which provides mechanical connection to the circuit board. The external contact pads on the underside of the...
4750030 Resin-molded semiconductor device having heat radiating plate embedded in the resin  
A lead frame has a plurality of metallic heat radiating plates, leads connected to each metallic heat radiating plate, other leads separated from the metallic heat radiating plates and a common...
4748538 Semiconductor module  
A semiconductor module includes a multi-layer wiring substrate provided at a first surface with a plurality of input/output terminals and at a second surface with lead terminals connected to the...
4731693 Connection apparatus for integrated circuit  
An integrated circuit is mounted on the front face of a substrate of dielectric material and the substrate is fitted in an aperture that extends through a circuit board. The substrate has contact...
4707726 Heat sink mounting arrangement for a semiconductor  
An arrangement for mounting a packaged semiconductor with a heat sink includes the heat sink having a channel formed therein with a pair of opposed side walls and utilizes one or more spring beams...
4689583 Dual diode module with heat sink, for use in a cavity power combiner  
A composite diode module is provided having an impedance matching member integrally formed within the module. The module includes a base member, a heat sink holder member having an aperture, a gold...
4688077 Semiconductor device having radiator  
A semiconductor device having a semiconductor package and a radiator. The semiconductor package houses a semiconductor chip therein. The radiator includes a pillar which has a plurality of fins...
4685987 Method of preparing interfacings of heat sinks with electrical devices  
A relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being...
4672422 Semiconductor rectifier unit  
A semiconductor rectifier unit composed of at least two rectifier elements, late-shaped contact elements contacting each rectifier element, components producing spring pressure for clamping the...
4661835 Semiconductor structure and method of its manufacture  
To prevent damage upon removal of a locating templet used in positioning a plate-like semiconductor on a support carrier (2, 14), for example a base plate (2) of a transistor housing or a...
4646129 Hermetic power chip packages  
Hermetic power chip packages are constructed in building block form to reduce the cost of electrical testing of power chips. The power chip packages utilized dielectric plates with metallic sheets...
4646203 Mounting structure for semiconductor devices  
A mounting structure is disclosed for mounting a semiconductor device on a conductive heat sink while electrically insulating the two. A thin, flat thermally conductive electrically insulative...
4642716 Magnetic transducer head assembly with support system therefor  
A magnetic transducer head assembly having a support member in which a magnetic transducer head mounting portion, an integrated circuit element mounting portion and a plurality of lead terminals...
4631819 Low stress, tolerance free method for mounting power devices  
A low stress, tolerance free method for mounting a power device to a heat sink is disclosed. The power device is soldered into a break-away area created on a printed circuit (PC) board which is...
4631573 Cooled stack of electrically isolated semiconductors  
Electrical isolation of semiconductors in a stack with interposed heat sinks is attained through the use of a thin sheet 30 of electrical insulating material disposed between first and second,...
4628406 Method of packaging integrated circuit chips, and integrated circuit package  
An integrated circuit package comprises at least two integrated circuit chips each having a plurality of contact pads arranged in a first pattern on the interconnect face of the chip, and an...
4617729 Process for manufacturing miniaturized electronic power circuits  
Process for manufacturing miniaturized electronic power circuits comprising power elements soldered to a conducting network with interpositioning of an insulating layer on a good heat conducting...
4583283 Electrically isolated semiconductor power device  
An improved power semiconductor device and manufacturing method are described wherein the external, thermally conducting, heat transfer face of the device is electrically insulated by a glassy...
4574162 Compact circuit package with improved construction for clamping to enhance heat transfer  
The compact circuit package (11) includes an insulating housing (12) providing a circuit retaining cavity (19) substantially surrounded by a pair of spaced side walls (15, 16) each terminating at a...
4574299 Thyristor packaging system  
A thyristor packaging system utilizes structured metal, strain buffers to provide paths of high electrical and thermal conductivity from the anode and cathode of a thyristor to power conductors...
4571612 Corrosion-protected electrical circuit component  
To protect a weld connection between an external conductor (11, 12) and a projecting pin (5, 6) of an electronic component, the base plate (2) of the electronic component has a tubular element (8)...
Matches 451 - 500 out of 640 < 1 2 3 4 5 6 7 8 9 10 11 12 13 >