|
Match
|
Document |
Document Title |
|
|
7616443 |
Cooling device for electrical power units of electrically operated vehicles
A cooling device for an electrical power unit of electrically operated vehicles, comprising at least one power section and at least one control section. A first cooling circuit containing a heat...
|
|
|
7614247 |
Cooling arrangement
A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line...
|
|
|
7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply...
|
|
|
7612447 |
Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices
A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor...
|
|
|
7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
|
|
|
7599414 |
Laser device
A laser apparatus ( 100 ) has a semiconductor laser device ( 12 a to 12 c ), coolant jetting means ( 24 ), and a heatsink ( 18 a to 18 c ). The semiconductor laser device has a light output...
|
|
|
7595987 |
Heat dissipation assembly for computing devices
Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from...
|
|
|
7593232 |
Electronic apparatus and circuit board unit
An electronic apparatus is provided with a housing, a circuit board section and a heat transfer member. The circuit board section is accommodated in the housing. The circuit board section includes...
|
|
|
7592697 |
Microelectronic package and method of cooling same
A microelectronic package comprises a chip stack ( 110 ) that includes a substrate ( 111 ), a first die ( 112 ) over the substrate and a second die ( 113 ) over the first die, a first underfill...
|
|
|
7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
|
|
|
7586747 |
Scalable subsystem architecture having integrated cooling channels
A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at...
|
|
|
7586126 |
Light emitting diode lighting module with improved heat dissipation structure
A light emitting diode (LED) lighting module with an improved heat dissipative structure comprises a plurality of the LEDs and a heat pipe apparatus on which at least a circuit layer is provided....
|
|
|
7582962 |
Heat dissipation device
A heat dissipation device comprises a multilayer substrate, a channel formed in the multilayer substrate, and tubes disposed within the channel, the tubes suitable for removing heat from a heat...
|
|
|
7580261 |
Semiconductor cooling system for use in electric or hybrid vehicle
A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first...
|
|
|
7561429 |
Power converter unit
A power converter unit comprises: a metal casing; a power module mounted in the metal casing and equipped with two or more power semiconductor devices; a metal plate disposed on the power module...
|
|
|
7561425 |
Encapsulated multi-phase electronics heat-sink
An apparatus and method for cooling electronics is disclosed. An encapsulated inert non-conductive fluid is used to transfer heat directly from an electrical circuit including a die on a substrate...
|
|
|
7560813 |
Chip-based thermo-stack
A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through chip connection including a bounding material...
|
|
|
7551441 |
Heat dissipation assembly for computing devices
An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat...
|
|
|
7551439 |
Fluid cooled electronic assembly
An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining...
|
|
|
7551435 |
Heat-absorbing member, cooling device, and electronic apparatus
Electronic components differing in height (a CPU 2 a, a capacitor 2 b, and coil elements 2 c ) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the...
|
|
|
7548425 |
Heat-Receiving apparatus and electronic equipment
A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving...
|
|
|
7548424 |
Distributed transmit/receive integrated microwave module chip level cooling system
A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication...
|
|
|
7545648 |
Cooling structure using rigid movable elements
An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further...
|
|
|
7545644 |
Nano-patch thermal management devices, methods, & systems
Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an...
|
|
|
7542291 |
Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink
In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least...
|
|
|
7539016 |
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls
The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop...
|
|
|
7538427 |
Microchannel structure and manufacturing method therefor, light source device, and projector
A microchannel structure that has plural microchannels through which fluid flows, including: a housing section formed in a block; and a pipe array arranged in the housing section and formed by...
|
|
|
7538426 |
Cooling system of power semiconductor module
A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor...
|
|
|
7538425 |
Power semiconductor package having integral fluid cooling
A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for...
|
|
|
7537048 |
Integrated liquid cooling system for electronic components
An integrated liquid cooling system ( 100 ) includes a heat absorbing member ( 10 ), a heat dissipating member ( 20 ) and a pump ( 15 ). The heat absorbing member defines therein a fluid flow...
|
|
|
7537047 |
Liquid-cooling heat sink
A liquid-cooling heat sink includes a base ( 10 ), a heat exchanger ( 30 ), a housing ( 20 ), an inlet ( 26 ) and an outlet ( 27 ). The heat exchanger ( 30 ) has a hollow ( 33 ) formed therein, and...
|
|
|
7518867 |
Electronic device cooling device and electronic device cooling method
An electronic device includes a cooling apparatus having: a primary cooling unit which is disposed in close proximity with an electronic device so as to face a surface thereof; an auxiliary cooling...
|
|
|
7515416 |
Structures for holding cards incorporating electronic and/or micromachined components
This invention provides a structure for holding cards having electronic and/or micromachined components. A chassis comprises a plurality of bays for receiving cards such that the cards are oriented...
|
|
|
7515415 |
Embedded microchannel cooling package for a central processor unit
An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server...
|
|
|
7511957 |
Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus...
|
|
|
7508676 |
Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability
A method of cooling a module attached to a board by a spring mechanism that provides access to the module during testing. A cold plate assembly features a dry thermal interface coupled with spring...
|
|
|
7505268 |
Electronic device package with an integrated evaporator
The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to...
|
|
|
7505267 |
Cooling system for an electronic box
The invention relates to a cooling system for an electronic box capable of releasing heat. It comprises a passive cooling device able to be connected to the electronic box and an element consisting...
|
|
|
7504720 |
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is...
|
|
|
7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
|
|
|
7502228 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Heat transfer mechanism, heat dissipation system, and communication apparatus
A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped...
|
|
|
7501699 |
Method and apparatus for electrical isolation of semiconductor device
A package includes a thermal solution to thermal couple to a semiconductor device to remove heat generated by the semiconductor device, and a device to electrically isolate at least a portion of...
|
|
|
7499279 |
Cold plate stability
A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate....
|
|
|
7499278 |
Method and apparatus for dissipating heat from an electronic device
The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic...
|
|
|
7498672 |
Micropin heat exchanger
An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate.
|
|
|
7495916 |
Low cost cold plate with film adhesive
An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The...
|
|
|
7486515 |
Fluid circulator for fluid cooled electronic device
An electronic device is provided having a bimetallic fluid circulator for circulating fluid coolant in relation to electrical circuitry to provide enhanced heat exchange. The fluid circulator...
|
|
|
7485957 |
Fluid cooled encapsulated microelectronic package
An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips...
|
|
|
7477517 |
Integrated heat spreader and exchanger
Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is...
|
|
|
7477513 |
Dual sided board thermal management system
A dual sided board thermal management system for efficiently thermally managing a printed circuit board having electronic components on opposing sides thereof. The dual sided board thermal...
|