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9042100 System and method for cooling heat generating components  
An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of...
9041195 Phase changing on-chip thermal heat sink  
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes...
9041194 Pressure unit  
The pressure unit includes a spring member that is formed into a coil form obtained by winding a wire rod and that has a periodically changing pitch angle and a housing member to which end...
9041183 Power module packaging with double sided planar interconnection and heat exchangers  
A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die,...
9035452 Electronic device cooling with autonomous fluid routing and method of assembly  
An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit...
9030822 Power module cooling system  
A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic...
9030823 Heat dissipation system for power module  
Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second...
8994168 Semiconductor package including radiation plate  
A semiconductor package includes a wiring board; a semiconductor chip mounted on the wiring board; and a radiation plate mounted on the semiconductor chip, including an insulating member including...
8995129 Heat radiator and manufacturing method thereof  
A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the...
8987893 Heat dissipating interposers  
Embodiments of the present disclosure provide an apparatus that comprises a connection circuit situated within a substrate and configured to communicatively couple a first integrated circuit...
8987891 Heat sink apparatus for microelectronic devices  
One embodiment of the present invention is a heat sink apparatus for cooling a semiconductor device includes: (a) a rigid support ring having a top surface and a bottom surface; (b) a thermally...
8982558 Cooling device for a power module, and a related method thereof  
A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling...
8981556 Jet impingement cooling apparatuses having non-uniform jet orifice sizes  
Jet impingement cooling apparatuses having non-uniformly sized jet orifices for producing an array of impingement jets that impinge a target surface are disclosed. In one embodiment, a cooling...
8957517 Semiconductor device including cooler  
A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element...
RE45376 Cooling systems employing fluidic jets, methods for their use and methods for cooling  
In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet...
8953317 Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)  
Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a...
8953319 Heat-dissipating module  
A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a...
8944150 Dissipation utilizing flow of refrigerant  
A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion...
8946889 Semiconductor module with cooling mechanism and production method thereof  
A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a...
8941232 Metal bumps for cooling device connection  
The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition,...
8937810 Electronic assembly with detachable coolant manifold and coolant-cooled electronic module  
Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more...
8937390 Semiconductor device having a liquid cooling module  
A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said...
8937385 Electronic component and fabrication process of this electronic component  
An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on...
8937383 Direct semiconductor contact ebullient cooling package  
The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor...
8937384 Thermal management of integrated circuits using phase change material and heat spreaders  
At least one feature pertains to an apparatus having passive thermal management that includes an integrated circuit die, a heat spreader thermally coupled to the integrated circuit die, a phase...
8934250 Immersion-cooling of selected electronic component(s) mounted to printed circuit board  
Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling...
8929080 Immersion-cooling of selected electronic component(s) mounted to printed circuit board  
A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing...
8929074 Electronic device assemblies and vehicles employing dual phase change materials  
Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor...
8921702 Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments  
In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the...
8917507 Cooling device, electronic substrate and electronic device  
A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape....
8917508 Arrangement of a power semiconductor circuit  
The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module,...
8916964 Semiconductor device and method of producing same  
A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining...
8913383 Heat capture system for electrical components providing electromagnetic pulse protection  
An apparatus includes an electrically-powered component, a hermetically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a...
8912645 Semiconductor element cooling structure  
A semiconductor element cooling structure includes a side wall provided on a downstream side of flow of cooling air in a cooling air passage, a plurality of cooling fins forming cooling air branch...
8902589 Semiconductor module and cooler  
A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a...
8897010 High performance liquid cooled heatsink for IGBT modules  
A heat sink assembly includes a base plate coupled to a first side of an electronic device. A plurality of fins extend from the base plate and are positioned within a housing. The housing includes...
8889489 Metal injection molded heat dissipation device  
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a...
8891235 Thermal interface for multi-chip packages  
A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable...
8890311 Power conversion device  
A power conversion device is provided with a plurality of semiconductor modules. Each semiconductor module includes a heat dissipation member, an insulating substrate, a semiconductor element, an...
8884426 Semiconductor device including cooler  
A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element...
8878358 Semiconductor device  
Between a logic LSI (4) arranged on one side of a DRAM (1) and jointed to the DRAM and a radiating member (6) arranged on the other side of the DRAM (1) for irradiating the heats of the DRAM (1)...
8879254 Methods and apparatus for compact active cooling  
Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components...
8879256 Electric power conversion apparatus  
An electric power conversion apparatus includes a plurality of semiconductor modules, a frame, a control circuit board, and a reinforcing and fixing member. Each of the semiconductor modules has a...
8872328 Integrated power module package  
An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the...
8867210 Cooling apparatus for an electrical substrate  
A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid...
8859340 Molded interposer package and method for fabricating the same  
A method includes the operations performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first...
8861202 Integrated thermal and structural management solution for Rechargeable Energy Storage System assembly  
A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The...
8860212 Fluid cooled semiconductor die package  
A fluid cooled semiconductor die package includes a package support substrate with a die mounting surface and an opposite package mounting surface. The package support substrate has external...
8836092 Semiconductor device with thermal dissipation lead frame  
A lead frame for assembling a semiconductor device has a die pad surrounded by lead fingers. Each of the lead fingers has a proximal end close to but spaced from an edge of the die pad and a...
8829669 Semiconductor device  
A semiconductor device configured to enable efficient cooling of an element and downsizing of the device. The semiconductor device including an element unit connected to a surface of a cooler. A...