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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply...
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7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
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7608923 |
Electronic device with flexible heat spreader
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat...
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7608917 |
Power semiconductor module
A power semiconductor module and an inverter apparatus in which a device or a joining part is not mechanically damaged even when the temperature in use becomes a high temperature in the range of...
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7605465 |
Semiconductor device for high frequency power amplification
A semiconductor device includes, a metal base plate, a semiconductor element mounted on the base plate, first and second dielectric plates are mounted on the base plate in the vicinity of the...
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7602060 |
Heat spreader in a flip chip package
A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface...
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7595540 |
Semiconductor device and method of manufacturing the same
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
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7593228 |
Technique for forming a thermally conductive interface with patterned metal foil
A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive...
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7592697 |
Microelectronic package and method of cooling same
A microelectronic package comprises a chip stack ( 110 ) that includes a substrate ( 111 ), a first die ( 112 ) over the substrate and a second die ( 113 ) over the first die, a first underfill...
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7592696 |
Power module having at least two substrates
The invention relates to a power module 3 and a method for producing it. The power module 3 has a first substrate 1 having power semiconductor chips 4, and a second substrate 2 populated...
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7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
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7589971 |
Reconfigurable heat sink assembly
An electrical assembly including a housing having an inner surface. At least one mounting feature protrudes from the inner surface. At least one heat sink is inserted onto the at least one mounting...
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7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7586126 |
Light emitting diode lighting module with improved heat dissipation structure
A light emitting diode (LED) lighting module with an improved heat dissipative structure comprises a plurality of the LEDs and a heat pipe apparatus on which at least a circuit layer is provided....
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7582964 |
Semiconductor package having non-ceramic based window frame
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
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7582959 |
Driver module structure with flexible circuit board
A driver module structure includes a flexible circuit board ( 2 ) provided with a wiring pattern ( 7 ), a semiconductor device mounted on the flexible circuit board ( 2 ), and an electrically...
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7579687 |
Circuit module turbulence enhancement systems and methods
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
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7579682 |
Power semiconductor module
A power semiconductor module has a ceramic substrate ( 9 ) which has on at least one side a patterned metallization ( 50 ) with a fineness of pattern of smaller than or equal to 800 μm, a first...
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7573131 |
Die-up integrated circuit package with grounded stiffener
A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate...
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7569931 |
Cooling semiconductor device and manufacturing method thereof
A semiconductor device includes a semiconductor substrate, a first diffusion region formed in the semiconductor substrate, a semiconductor element formed in the first diffusion region, and a...
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7569928 |
Assembly structure of electronic element and heat sink
An assembly structure of an electronic element and a heat sink is disclosed. An assembly structure of an electronic element and a heat sink comprises a fastening element, an electronic element...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein
A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each...
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7564128 |
Fully testable surface mount die package configured for two-sided cooling
A power semiconductor die is sandwiched between upper and lower heat conducting laminate structures to form a surface mount component that is configured for double-sided cooling. The upper heat...
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7564124 |
Semiconductor die package including stacked dice and heat sink structures
A semiconductor package including stacked packages is disclosed. The semiconductor die package includes a first heat sink structure, a first semiconductor die attached to the first heat sink...
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7560812 |
Cooling module against ESD and electronic package, assembly and system using the same
An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence...
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7554194 |
Thermally enhanced semiconductor package
A semiconductor package has a substrate having a first surface, a second surface, and a through hole opening. A heat spreader has a first surface, a second surface, and a plurality of notches...
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7554193 |
Semiconductor device
A semiconductor device capable of reducing the thermal resistance in a flip chip packaging structure while achieving both the high radiation performance and manufacturing readiness without...
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7554192 |
Semiconductor device having filler with thermal conductive particles
A semiconductor device that includes an insulating substrate having an upper conductor formed on an upper surface thereof and a lower conductor formed on a lower surface of the insulating...
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7554179 |
Multi-leadframe semiconductor package and method of manufacture
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached...
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7551437 |
Cooling mechanism for circuit board
A cooling mechanism for a circuit board includes a board having electronic components disposed thereon, one or more heat radiation plates disposed on the board, a cooling fan for cooling the board...
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7550847 |
Packaged microelectronic devices and methods for packaging microelectronic devices
Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a...
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7549790 |
Measuring apparatus for thermal resistance of heat dissipating device
A measuring apparatus for measuring the thermal resistance of a heat dissipating device, the heat dissipating device includes a fan and a heat sink. The measuring apparatus includes a base, and a...
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7546943 |
Apparatus, system, and method for positioning a printed circuit board component
An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The...
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7545647 |
Compliant thermal interface structure utilizing spring elements
A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar...
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7545032 |
Integrated circuit package system with stiffener
An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle;...
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7541670 |
Semiconductor device having terminals
The power semiconductor package includes a semiconductor mounting substrate, a mother case having an opening and containing the semiconductor mounting substrate therein, a securing member having a...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7538427 |
Microchannel structure and manufacturing method therefor, light source device, and projector
A microchannel structure that has plural microchannels through which fluid flows, including: a housing section formed in a block; and a pipe array arranged in the housing section and formed by...
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7538423 |
Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device
A heat sink includes a base portion formed of insulating diamond, and a plurality of pressure contacting members formed of the insulating diamond and arranged on the base portion
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7535727 |
Light source module
A light source module includes a circuit board on which a predetermined conductive pattern is formed, a semiconductor light emitting element mounted on the circuit board, and a plurality of power...
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7535714 |
Apparatus and method providing metallic thermal interface between metal capped module and heat sink
An apparatus and method for creating a metallic thermal interface is shown for connecting an electronic module to a heat sink. Using an interface metal such as indium or malleable indium alloys,...
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7535099 |
Sintered metallic thermal interface materials for microelectronic cooling assemblies
A microelectronic cooling assembly and method for fabricating the same are described. In one example, a microelectronic cooling assembly includes a microelectronic device, a heat spreader, and a...
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7535098 |
Structure of substrate
A substrate having a metallic panel and an insulator is provided. The metallic panel comprises two patterned metallic layers. The two patterned metallic layers are disposed on the respective sides...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7532480 |
Power delivery for electronic assemblies
Embodiments of methods, apparatuses, devices, and/or systems for power delivery for electronic assemblies are disclosed.
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7532475 |
Semiconductor chip assembly with flexible metal cantilevers
A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and...
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7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames
Semiconductor equipment includes: a first lead frame having a first semiconductor device; a second lead frame having a second semiconductor device; a thermal resistor for preventing heat transfer...
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