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6784540 |
Semiconductor device package with improved cooling
A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose...
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6784538 |
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer
The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said...
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6777792 |
Semiconductor device and package with high heat radiation effect
A conductive mounting board provided in a package has a recessed portion and a projecting portion, and an insulating mounting board is disposed on the recessed portion. The insulating mounting...
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6774482 |
Chip cooling
In an integrated circuit structure, such as in an MCM or in an SCM, a particulate thermally conductive conformable material, such as a thermal paste, is applied between a heat-generating chip and a...
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6774450 |
Semiconductor device with thermoelectric heat dissipating element
A thermoelectric converting element is constituted of an N-type semiconductor region, a P-type semiconductor region and metal interconnections. The N-type semiconductor region is formed...
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6775141 |
Heat dissipation structure for use in combination with electronic circuit board
To provide a heat dissipation structure for an electronic circuit board, a recessed portion is formed in a surface of a heat dissipation board to extend to at least one side surface thereof. A...
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6771505 |
Power electronics unit
A power electronics unit with a sheet-like carrier element, on which interconnects 5 are arranged for the electrical Connection of electrical power components 6 and control components 7 of a...
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6770967 |
Remote thermal vias for densely packed electrical assemblage
A densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating...
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6770971 |
Semiconductor device and method of fabricating the same
A semiconductor device includes a semiconductor structure including a semiconductor substrate having an integrated circuit portion, and a plurality of connecting pads connected to the integrated...
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6765291 |
IC package with dual heat spreaders
A method of making an integrated circuit device using an encapsulated semiconductor die having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant...
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6760223 |
Apparatus and method for contacting device with delicate light-transparent pane
A heat-sinking apparatus ( 62, 64, 66 , and 68 ) containing a light-transparent pane ( 72 ) is configured in a way that enables the pane to be brought into contact with a device ( 40 ) such as a...
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6757967 |
Method of forming a chip assembly
A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact...
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6756665 |
Integrated circuit package structure with heat dissipating design
An integrated circuit (IC) package structure with heat dissipation design. The IC chip is disposed on a package substrate and a power ring structure surrounds the chip. Due to the relatively large...
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6750551 |
Direct BGA attachment without solder reflow
A surface mount-type microelectronic component assembly which does not physically attach the microelectronic component to its carrier substrate. Electrical contact is achieved between the...
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6747344 |
Lead frame assemblies with voltage reference plane and IC packages including same
A semiconductor die assembly employing a voltage reference plane structure electrically isolated from, but in immediate proximity to, leads of a lead frame to which the die is electrically...
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6743972 |
Heat dissipating IC devices
Heat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from...
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6737581 |
Configuration of a plurality of circuit modules
A circuit configuration for reliably and simply interconnecting circuit modules includes a connection carrier and circuit modules disposed essentially one above another approximately in a stack....
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6737754 |
COF packaged semiconductor
A semiconductor device having a multilayer laminate that includes a thermally stable, flexible polymer film, a semiconductor die, a molding compound, and a heat dissipation member. The die has an...
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6738258 |
Power semiconductor module
The power semiconductor module ( 1 ) comprises a housing ( 5 ), a covering panel ( 11 ) and at least two submodules ( 21, 22 ). The submodules ( 21, 22 ) each comprise at least one semiconductor...
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6734552 |
Enhanced thermal dissipation integrated circuit package
In one aspect, the present invention relates to an integrated circuit package includes a scmiconductor die electrically connected to a substrate, a heat sink having a top and a side portion, the...
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6730991 |
Integrated circuit chip package
A package for an integrated circuit chip adapted to operate at microwave frequencies. The package includes an electrically conductive lead frame having electrical leads extending outwardly from an...
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6727422 |
Heat sink/heat spreader structures and methods of manufacture
A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic...
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6717261 |
Integrated semiconductor circuit
An integrated semiconductor circuit including a substrate and at least one microwave circuit area supported by a substrate is provided, at least one cooling area supported by the substrate being...
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6717822 |
Lead-frame method and circuit module assembly including edge stiffener
An edge stiffener added to a lead-frame based circuit module provides protection of the peripheral flange of the circuit module during handling and manufacturing processes. The edge stiffener may...
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6713854 |
Electronic circuit module with a carrier having a mounting pad array
An improved multi-chip module includes a circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes...
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6713851 |
Lead over chip semiconductor device including a heat sink for heat dissipation
The invention relates to an LOC type semiconductor device having improved heat radiation. The semiconductor device related to the present invention has a preferably metal heat-radiating element 7 ...
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6713793 |
Field effect transistor structure with bent gate
An inexpensive and small-sized semiconductor device with high power output performance includes a semiconductor substrate; an active region on the semiconductor substrate; first and second channel...
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6711025 |
Combination device of the IC connection device and the main board
A combination device of the IC package connection device and the main board comprises a socket and a main board. The socket has a holding assembly which is placed on the top surface of the socket....
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6707676 |
Heat sink for automatic assembling
The heat-sink assembly of the invention is attached to the PC board with the use of surface mount technology. The assembly comprises a base part or a base member soldered to the PC board and a top...
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6700188 |
Low-pin-count chip package having concave die pad and/or connections pads
A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip wherein the die pad and the...
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6693348 |
Semiconductor device with power supplying unit between a semiconductor chip and a supporting substrate
A semiconductor device in which a breakage of contacting point by thermal expansion is prevented, an image scanning unit utilizing the same and an image forming apparatus utilizing the same, is...
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6690087 |
Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base
A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed...
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6683639 |
Printhead for an image-forming apparatus and an image-forming apparatus containing the same
A printhead for an image-forming apparatus, including a substrate, a row of light-emitting elements disposed on a first side of the substrate, and a cooling element disposed on a second side of the...
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6677669 |
Semiconductor package including two semiconductor die disposed within a common clip
A co-package semiconductor device including an outer clip in the form of a metal can includes also two semiconductor dies, at least one of which uses the outer clip as an electrical connector. An...
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6672380 |
Heat sink base pad
A heat sink base pad mainly has a heat sink base with a plurality of heat sink holes disposed on the face plate of the base and a heat tube pivotally disposed at the lower end of the face plate...
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6674163 |
Package structure for a semiconductor device
A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering...
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6674164 |
System for uniformly interconnecting and cooling
A means is discussed for electrically interconnecting, cooling and mechanically supporting a multiplicity of heat producing electronic and/or electrical components which is amenable to automated...
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6667548 |
Diamond heat spreading and cooling technique for integrated circuits
A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger...
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6667546 |
Ball grid array semiconductor package and substrate without power ring or ground ring
A ball grid array semiconductor package is proposed, wherein at least a chip is mounted on a substrate, and signal pads on the chip are electrically connected to signal fingers on the substrate by...
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6661661 |
Common heatsink for multiple chips and modules
A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by...
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6661082 |
Flip chip substrate design
A chip device that includes a leadframe that has a die attach cavity. The memory device further includes a die that is placed within the die attach cavity. The die attach cavity is substantially...
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6657289 |
Apparatus relating to block configurations and fluidic self-assembly processes
An apparatus and methods of making an electronic assembly. The electronic assembly comprises a functional block having at least one asymmetric feature. The functional block comprises an integrated...
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6656770 |
Thermal enhancement approach using solder compositions in the liquid state
Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC...
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6657311 |
Heat dissipating flip-chip ball grid array
A heat dissipating flip-chip Ball Grid Array (BGA) ( 10 ) including a substrate ( 12 ), a die ( 14 ), a first set of solder balls ( 16 ) coupling the die with the substrate, a thermal compound ( 20...
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6657295 |
Multilayer interconnect board and multilayer semiconductor device
A multilayer interconnect board comprised of a plurality of stacked cloth-reinforced resin layers with at least one layer of interconnect patterns formed at a stacking interface of the resin...
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6654248 |
Top gated heat dissipation
A heat spreader for use with an integrated circuit in a package, where the heat spreader is formed as a plate having a centrally disposed aperture with a diameter that is smaller than a minimum...
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6653730 |
Electronic assembly with high capacity thermal interface
To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a...
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6627997 |
Semiconductor module and method of mounting
In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the semiconductor chips are covered with a single heat spread plate, and the whole...
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6625026 |
Heat-activated self-aligning heat sink
A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be...
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6624524 |
Laser alignment target
A technique to form a structure with a rough topography ( 415 ) in a planarized semiconductor process. The rough topography ( 415 ) is formed by creating cored contacts ( 433 ). Subsequent process...
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