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6890618 |
Method and apparatus for retaining a thermally conductive pin in a thermal spreader plate
An apparatus and method are provided for retaining thermal transfer pins in a spreader plate adapted to transfer thermal energy from an electronic component. The spreader plate includes pin holes...
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6888722 |
Thermal design for minimizing interface in a multi-site thermal contact condition
An electronic assembly that may include an integrated circuit package that is mounted to a substrate. The assembly may have a thermally conductive phase change material that couples the integrated...
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6882043 |
Electronic assembly having an indium thermal couple
According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package...
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6882057 |
Quad flat no-lead chip carrier
A quad flat no-lead chip carrier for a wire-bonded chip package is provided. The chip carrier comprises a conductive plate, a plurality of conductive columns and a plurality of dielectric walls. A...
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6882042 |
Thermally and electrically enhanced ball grid array packaging
Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the...
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6870246 |
Method and apparatus for providing an integrated circuit cover
An integrated circuit cover incorporating a spring portion is described. The spring portion may include any structure that allows displacement between a plate portion of the integrated circuit...
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6867978 |
Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In...
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6865084 |
Thermally enhanced semiconductor package with EMI shielding
A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip is mounted on and electrically connected to a surface of a substrate,...
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6861743 |
Integrated circuit carrier socket
According to one embodiment, an apparatus is disclosed. The apparatus comprises an integrated circuit (IC) having a plurality of connection pins, a carrier socket configured to carry the IC. The...
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6860621 |
LED module and methods for producing and using the module
An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the...
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6858932 |
Packaged semiconductor device and method of formation
A packaged semiconductor device ( 20 ) has a first integrated circuit die ( 28 ) having a top surface with active electrical circuitry implemented thereon. The first die ( 28 ) is mounted in a...
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6858930 |
Multi chip module
A multi chip package, which includes a package substrate having a first side and an opposing second side. The first side is for receiving package electrical connections. Integrated circuits are...
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6853069 |
Packaged die on PCB with heat sink encapsulant and methods
An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus...
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6849942 |
Semiconductor package with heat sink attached to substrate
A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a flange in contact with the...
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6849940 |
Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same
An integrated circuit package includes a first or active substrate and a second or passive substrate. The active substrate includes at least one circuit that generates heat during circuit...
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6849930 |
Semiconductor device with uneven metal plate to improve adhesion to molding compound
The present invention provides a semiconductor device whose reliability is improved by improving the adhesion strength of a metal plate or connecting chip, said plurality of electrodes and a lead...
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6849943 |
Power module package for high frequency switching system
A heat sink with fins has a flat, planar surface soldered to a metallic layer at one surface of a flat, planar ceramic layer. The opposite surface of the ceramic layer has a metallic pattern...
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6847115 |
Packaged semiconductor device for radio frequency shielding
A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are...
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6847113 |
Electronic apparatus with plate-like member having plural recesses containing heat accumulating material
An electronic apparatus, including a plate-like member, enclosing a heat-accumulating material of latent heat type within an inside thereof; a semiconductor element, being connected with the...
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6841418 |
Multi-substrate microelectronic packages and methods for manufacture
A microelectronic package and method for manufacture. The package can include first and second microelectronic substrates, each having a first surface with a connection site, and a second surface...
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6835991 |
Method and apparatus for improving resolution of objects in a semiconductor wafer
A method and apparatus for creating objects on a semiconductor wafer includes a mask/reticle having a substantially uniform pattern of features. The wafer is illuminated through the mask/reticle to...
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6831358 |
Heat-dissipative coating
A heat-dissipative coating is composed of a plurality of granules having a predetermined thickness and disposed on an object, and is insulated and highly thermal-conductive. The total surface area...
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6828671 |
Enhanced BGA grounded heatsink
A new method is provided for the establishment of a low resistivity connection between a wire bonded IC chip that is mounted on a heatsink and the heatsink of the package. A copper trace connection...
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6828672 |
Thermally conductive silk-screenable interface material
A novel visible light curable composition for forming a thermally conductive interface and a method of using the same is provided. The composition is used to promote the transfer of heat from a...
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6825557 |
Localized backside chip cooling with integrated smart valves
An integrated circuit device is disclosed. The device comprises a die that has functional units on a first surface and a cooling system arranged adjacent a second surface opposite the first...
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6825569 |
BGA package having substrate with patterned solder mask defining open die attach area
A BGA package and a method of fabricating the BGA package is provided. The package includes a substrate having a first surface with a pattern of conductors thereon, and an opposing second surface...
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6825556 |
Integrated circuit package design with non-orthogonal die cut out
A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical...
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6818817 |
Heat dissipating silicon-on-insulator structures
Heat dissipating Silicon-on-Insulator (SOI) structures which utilize thermoelectric effects to more effectively dissipate thermal energy from SOI-based electronic circuits.
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6819565 |
Cavity-down ball grid array semiconductor package with heat spreader
A cavity-down ball grid array (CDBGA) semiconductor package with a heat spreader is provided, in which a substrate is formed with at least a ground ring, a plurality of ground vias, a ground layer,...
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6817405 |
Apparatus having forced fluid cooling and pin-fin heat sink
A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well...
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6812562 |
Method and apparatus for surface mounted power transistor with heat sink
A surface mounted power transistor is provided with a heat sink by positioning a mounting plate of a heat sink between the power transistor and a solder pad on the circuit board. The mounting plate...
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6813153 |
Polymer solder hybrid
A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the...
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6813154 |
Reversible heat sink packaging assembly for an integrated circuit
A reversible heat sink packaging assembly ( 400 ) for integrated circuits is provided. The packaging assembly ( 400 ) includes a chip carrier ( 102 ) having an opening ( 104 ) formed therein and a...
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6809261 |
Physically compact device package
A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting...
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6809411 |
Low-inductance semiconductor components
In order to obtain a minimal leakage inductance in a semiconductor component, it is necessary to provide at least two adjacent switching elements whose load current connection elements which are...
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6809931 |
Heat sink apparatus that provides electrical isolation for integrally shielded circuit
In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole...
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6803667 |
Semiconductor device having a protective film
A semiconductor device comprises a semiconductor element, a heat sink soldered to one surface of the semiconductor element, and a heat sink soldered to an opposite surface of the semiconductor...
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6803514 |
MOUNTING STRUCTURE AND MOUNTING METHOD OF A PHOTOVOLTAIC ELEMENT, MOUNTING SUBSTRATE FOR MOUNTING A SEMICONDUCTOR ELEMENT THEREON AND METHOD FOR MOUNTING A SEMICONDUCTOR ELEMENT ON SAID MOUNTING SUBSTRATE
A mounting structure for mounting a photovoltaic element onto a metal body, which outputs a power generated by the photovoltaic element to the outside surface, and a method for mounting the...
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6800932 |
Package for semiconductor die containing symmetrical lead and heat sink
A semiconductor package contains a plurality of sheet metal leads that are attached to one or more terminals on a top side of a semiconductor die. A heat sink is attached to a terminal on a bottom...
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6800949 |
Embedded chip enclosure with solder-free interconnect
A fused silica substrate is processed to a thickness that allows it to be easily flexed. An opening is etched in the substrate. A die having a patterned topside is processed to the thickness of the...
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6801431 |
Integrated power delivery and cooling system for high power microprocessors
The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device...
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6791183 |
Power semiconductor module and cooling element for holding the power semiconductor module
A power semiconductor module and a cooling element for holding the power semiconductor module are described. The power semiconductor module has a housing that has an underside and an upper side. At...
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6787870 |
Semiconductor component with integrated circuit, cooling body, and temperature sensor
A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The...
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6788541 |
LED matrix moldule
An LED matrix module of the invention has a circuit board, a thermally conductive plate and a plurality of LED chips. A plurality of slots is formed through a circuit surface and a bonding surface...
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6787895 |
Leadless chip carrier for reduced thermal resistance
According to one embodiment, a semiconductor die is situated in a cutout section of a substrate. In one embodiment, the substrate is situated on a printed circuit board such that the semiconductor...
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6785139 |
Electric connection box
In an electric connection box containing a bus bar board in a case, heat radiation member-side bus bars are connected to a heat radiation member, and switching devices, such as FETs, are mounted on...
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6785137 |
Method and system for removing heat from an active area of an integrated circuit device
A method for removing heat from an active area of an integrated circuit device is provided. The method includes applying a separator to the active area of the integrated circuit device. A thermally...
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6784366 |
Thermal dissipation package for an electrical surface mount component
An electronic component ( 202 ), such as a power transistor, is formed of a molded plastic package having top ( 206 ), bottom ( 204 ) and side ( 208 ) surfaces and electrical contacts. A lead frame...
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6784540 |
Semiconductor device package with improved cooling
A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose...
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6784538 |
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer
The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said...
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