|
Match
|
Document |
Document Title |
|
|
6982877 |
Heat sink having compliant interface to span multiple components
A system, comprising a circuit board having a heat sink spanning multiple components on the circuit board and at least one compliant pad flexibly interfacing the heat sink with the multiple...
|
|
|
6975512 |
Thermally enhanced heat sink BGA package
Provided are heat sink BGA packages with thermally enhanced mold compounds to further facilitate heat transfer from the die out of the package. Packages in accordance with the present invention...
|
|
|
6969907 |
Cooling structure for multichip module
A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically...
|
|
|
6970358 |
Stack up assembly
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed...
|
|
|
6963132 |
Integrated semiconductor device having co-planar device surfaces
The present invention provides a method of forming an integrated semiconductor device, and the device so formed. An active surface of at least two semiconductor devices, such as semiconductor...
|
|
|
6963130 |
Heatsinking and packaging of integrated circuit chips
A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit...
|
|
|
6963133 |
Semiconductor device and method for manufacturing semiconductor device
A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating...
|
|
|
6963131 |
Integrated circuit system with a latent heat storage module
The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat...
|
|
|
6961245 |
High frequency module
There is presented a high frequency module, in which a recess 2 a for mounting power amplifier device is formed on a lower surface of a dielectric substrate 2 , and a recess 2 b for mounting...
|
|
|
6958517 |
Compact, all-layers-programmable integrated circuit arrangements
A programmable integrated circuit (IC) arrangement includes at least one input/output terminal, at least two receiver/source terminals for selectable electrical connection to the at least one...
|
|
|
6958536 |
Microelectronic packages having rail along portion of lid periphery
The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention,...
|
|
|
6956741 |
Semiconductor package with heat sink
A semiconductor package with a heat sink is provided, having a substrate formed with at least one opening penetrating therethrough. A heat sink is mounted on a surface of the substrate same as for...
|
|
|
6956285 |
EMI grounding pins for CPU/ASIC chips
An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a...
|
|
|
6954360 |
Thermally enhanced component substrate: thermal bar
An IC package dissipates thermal energy using thermal bars. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of...
|
|
|
6953227 |
High-power multi-device liquid cooling
A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in thermal contact with...
|
|
|
6950305 |
Overmolded device with contoured surface
An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional...
|
|
|
6946729 |
Wafer level package structure with a heat slug
A wafer level package structure and a method for packaging said wafer level package structure are described. The wafer level package structure at least comprises a die, a heat slug covering said...
|
|
|
6946730 |
Semiconductor device having heat conducting plate
A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating...
|
|
|
6947286 |
Stack up assembly
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed...
|
|
|
6944025 |
EMI shielding apparatus
An electromagnetic shielding structure is provided for a microprocessor or other electronic device that emits electromagnetic radiation. The structure includes a heat sink with an integrally formed...
|
|
|
6943436 |
EMI heatspreader/lid for integrated circuit packages
An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.
|
|
|
6943443 |
Electronic circuit device including metallic member having installation members
Bumps are formed on electrodes of semiconductor elements, and moreover, the semiconductor elements with the bumps are electrically connected to metallic members having installation members, whereby...
|
|
|
6940162 |
Semiconductor module and mounting method for same
In a multi chip module of a structure wherein a plurality of bare or packaged semiconductor chips are mounted on a single wiring board and upper surfaces of the semiconductor chips are covered with...
|
|
|
6940164 |
Power module
A power module incorporates a switching semiconductor element and a smoothing capacitor and includes a metallic base plate dissipating heat produced by the switching semiconductor element and the...
|
|
|
6940720 |
Integrated circuit having a thermally shielded electric resistor trace
An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the...
|
|
|
6936501 |
Semiconductor component and method of manufacture
A semiconductor component having a lid for protecting a semiconductor chip and a method for manufacturing the semiconductor component. The semiconductor chip has an active surface and a mounting...
|
|
|
6933443 |
Method for bonding ceramic to copper, without creating a bow in the copper
An electronic device and method of forming said device are presented, in which the device comprises a base having a pair of elongate flanges and a channel portion defined therebetween, wherein the...
|
|
|
6933602 |
Semiconductor package having a thermally and electrically connected heatspreader
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The substrate includes at least one...
|
|
|
6933619 |
Electronic package and method of forming
An electronic package and method of making same in which a thermally conductive member is in thermally conductive communication with a semiconductor chip encapsulated within a dielectric material...
|
|
|
6933603 |
Multi-substrate layer semiconductor packages and method for making same
A device, comprising a first substrate having a transmission line formed on a surface thereof and a second substrate connected to the first substrate and the transmission line such that the...
|
|
|
6924559 |
Electronic device with heat conductive encasing device
The invention relates to the field of electronic devices with a thermally conducting encapsulant for draining away some of the energy dissipated by the electronic components contained in the...
|
|
|
6921975 |
Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
A circuit device ( 15 ) is placed within an opening of a conductive layer ( 10 ) which is then partially encapsulated with an encapsulant ( 24 ) so that the active surface of the circuit device (...
|
|
|
6921973 |
Electronic module having compliant spacer
The present invention provides for an electronic control module including a support board, an electronic package, and a compliant spacer disposed between the electronic package and the support...
|
|
|
6921974 |
Packaged device with thermal enhancement and method of packaging
A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially...
|
|
|
6920052 |
Dynamic isolating mount for processor packages
The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation...
|
|
|
6919630 |
Semiconductor package with heat spreader
A semiconductor package with an embedded heat spreader (EHS) is proposed, which can be used for the fabrication of a semiconductor package, such as a FCBGA (Flip-Chip Ball Grid Array) package with...
|
|
|
6920047 |
Electrically isolated module
An electronic control module provides dual insulation layers between an internal line voltage and a separate tool housing that serves as a heat sink, thereby allowing versatility in mounting the...
|
|
|
6919624 |
Semiconductor device with exposed electrodes
It is difficult to check the mounted state of solder by means of visual inspection after the mounting of a semiconductor device according to a conventional art, in particular, a CSP-semiconductor...
|
|
|
6917099 |
Die carrier with fluid chamber
A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically...
|
|
|
6914325 |
Power semiconductor module
A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed...
|
|
|
6906414 |
Ball grid array package with patterned stiffener layer
Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. An IC die is mounted in a centrally located cavity of a substantially planar first surface of a...
|
|
|
6906259 |
High frequency module
An object of the present invention is to provide a high frequency module which can efficiently radiate heat generated from a semiconductor chip. A high frequency module according to the present...
|
|
|
6903271 |
Electronic assembly with thermally separated support
According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support...
|
|
|
6900534 |
Direct attach chip scale package
A reliable, chip scale or flip chip semiconductor device which can be directly attached to a PC board without the use of an underfill material to absorb stress on the solder joints interconnecting...
|
|
|
6897566 |
Encapsulated semiconductor package free of chip carrier
A semiconductor package and a method for fabricating the same are proposed. A chip has an active surface, and an opposing non-active surface. A plurality of conductive elements are mounted on the...
|
|
|
6894397 |
Plural semiconductor devices in monolithic flip chip
A flip chip structure contains laterally spaced semiconductor devices such as MOSFETs in a common chip. A deep trench isolates the devices. Contacts are connected to the source drain and gate...
|
|
|
6891266 |
RF transition for an area array package
A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board...
|
|
|
6890618 |
Method and apparatus for retaining a thermally conductive pin in a thermal spreader plate
An apparatus and method are provided for retaining thermal transfer pins in a spreader plate adapted to transfer thermal energy from an electronic component. The spreader plate includes pin holes...
|
|
|
6888722 |
Thermal design for minimizing interface in a multi-site thermal contact condition
An electronic assembly that may include an integrated circuit package that is mounted to a substrate. The assembly may have a thermally conductive phase change material that couples the integrated...
|
|
|
6882043 |
Electronic assembly having an indium thermal couple
According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package...
|