|
Match
|
Document |
Document Title |
|
|
7071541 |
Plastic integrated circuit package and method and leadframe for making the package
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
|
|
|
7067905 |
Packaged microelectronic devices including first and second casings
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
|
|
|
7068511 |
High-density architecture for a microelectronic complex on a planar body
A microelectronic complex including a first body, a discrete functional module and an interconnection module. The first body is characterized by a planar main surface that defines an attachment...
|
|
|
7064428 |
Wafer-level package structure
A wafer-level package structure, applicable to a flip-chip arrangement on a carrier, which comprises a plurality of contact points, is described. This wafer-level package structure is mainly formed...
|
|
|
7064429 |
Electronic package having integrated cooling element with clearance for engaging package
An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect...
|
|
|
7061103 |
Chip package structure
A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is...
|
|
|
7061102 |
High performance flipchip package that incorporates heat removal with minimal thermal mismatch
A semiconductor flipchip package includes a central cavity area on the first major side for receiving a flipchip die therein. The package substrate is substantially made from a single material that...
|
|
|
7060747 |
Chain extension for thermal materials
A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen...
|
|
|
7057894 |
Computer system with a liquid-cooling thermal module having a plurality of pumps
A computer system includes a processor for processing data, a storage unit for storing data, and a liquid cooling thermal module for dissipating heat generated by the processor. The thermal module...
|
|
|
7057897 |
Means for securing a cooling device
Means for securing a cooling device includes a main body attached to the cooling device and at least a secure unit. The main body provides at least an axial hole corresponding to the secure unit....
|
|
|
7053493 |
Semiconductor device having stiffener
A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on...
|
|
|
7049697 |
Process for making fine pitch connections between devices and structure made by the process
A semiconductor device structure including fine-pitch connections between chips is fabricated using stud/via matching structures. The stud and via are aligned and connected, thereby permitting...
|
|
|
7049695 |
Method and device for heat dissipation in semiconductor modules
A structure and method are provided for dissipating heat from a semiconductor device chip. A first layer of a dielectric material (e.g. polyimide) is formed on a front side of a heat spreader...
|
|
|
7049688 |
Semiconductor device having a pair of heat sinks and method for manufacturing the same
A semiconductor device includes a heater element; a first heat sink disposed on one side of the heater element; a second heat sink disposed on the other side of the heater element; and a resin mold...
|
|
|
7049696 |
IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device
A connection structure including an IC chip, a substrate disposed with a conductive layer, and a heat-radiating mechanism that is mounted on the substrate, disposed between the IC chip and the...
|
|
|
7045890 |
Heat spreader and stiffener having a stiffener extension
A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate.
|
|
|
7038305 |
Package for integrated circuit die
An integrated circuit device package and method of assembling same is disclosed. The device package includes an interposer ring substrate having a hollowed out center mounted on a die attach pad, a...
|
|
|
7038312 |
Die-up ball grid array package with attached stiffener ring
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second...
|
|
|
7038313 |
Semiconductor device and method of manufacturing the same
A semiconductor device includes a circuit board formed of an insulator substrate and having conductor patterns on both surfaces thereof, a semiconductor chip bonded to the circuit board with one of...
|
|
|
7038311 |
Thermally enhanced semiconductor package
A thermally enhanced BGA semiconductor device 10 having a heat sink 12 formed from a single piece of material with an expanded base and a pedestal in contact with a semiconductor chip 11. The...
|
|
|
7034390 |
Semiconductor package having multi-signal bus bars
A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die...
|
|
|
7030474 |
Plastic integrated circuit package and method and leadframe for making the package
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
|
|
|
7030482 |
Method and apparatus for protecting a die ESD events
A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy...
|
|
|
7031162 |
Method and structure for cooling a dual chip module with one high power chip
Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to...
|
|
|
7031160 |
Magnetically enhanced convection heat sink
A magnetically enhanced convection heat sink comprises a heat sink member for dissipating heat from a heat source. A magnetic source creates a magnetic field concentrated at a first location, the...
|
|
|
7030317 |
Electronic assembly with stacked integrated circuit die
An electronic assembly with a plurality of stacked integrated circuit (IC) die includes a base substrate, a first IC die, a second IC die, a signal routing first interconnect and a signal routing...
|
|
|
7030483 |
Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application
One embodiment of the invention includes a thermal interface material. The thermal interface material includes a polymer matrix; a plurality of fusible particles dispersed within the polymer...
|
|
|
7031163 |
Mechanical cooling fin for interconnects
In one embodiment, an integrated circuit includes an electrically active interconnect line within a dielectric layer having a top and bottom surface, the bottom surface of the dielectric layer...
|
|
|
7028753 |
Apparatus to enhance cooling of electronic device
An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is...
|
|
|
7030496 |
Semiconductor device having aluminum and metal electrodes and method for manufacturing the same
A semiconductor device includes a semiconductor substrate; an aluminum electrode disposed on the substrate; a protection film disposed on the aluminum electrode; an opening disposed on the...
|
|
|
7030487 |
Chip scale packaging with improved heat dissipation capability
A chip scale packaging with improved heat dissipation capability is disclosed. A chip or die is adhered to the first surface of a packaging substrate having a plurality of metalized through holes...
|
|
|
7026719 |
Semiconductor package with a heat spreader
A semiconductor package with a heat spreader is described, including a first chip, a second chip, a heat spreader and a substrate. The first chip has an active surface over which the second chip is...
|
|
|
7026711 |
Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA)
A microelectronic package comprising a device substrate having first and second opposing surfaces and comprising a plurality of microelectronic devices. The microelectronic package also includes a...
|
|
|
7015072 |
Method of manufacturing an enhanced thermal dissipation integrated circuit package
In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to...
|
|
|
7015578 |
Semiconductor unit with cooling system
A semiconductor unit has semiconductor modules and cooling members. The semiconductor module includes power devices with a flat shape, the first electrode bonded to the first device surface, the...
|
|
|
7009295 |
Semiconductor device
A semiconductor device includes a semiconductor chip having a main surface provided with an integrated circuit including a photoelectric converter and a first wiring for electrically connecting the...
|
|
|
7005738 |
Semiconductor package with lid heat spreader
The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the...
|
|
|
7002795 |
Low noise heatsink
A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally...
|
|
|
7002247 |
Thermal interposer for thermal management of semiconductor devices
A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has...
|
|
|
6998707 |
Semiconductor device having radiation structure
A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the...
|
|
|
6995409 |
Module for high voltage power for converting a base of IGBT components
This power switching cell comprises:
at least two power components ( 4–6 ) forming a chain ( 2 ) of components electrically linked in series by way of at least one intermediate bond ( 52,...
|
|
|
6995463 |
Integrated chip package having intermediate substrate and multiple semiconductor chips
The present integrated chip package provides a low cost package that is suitable for high density semiconductors that have high power dissipation. The integrated chip package includes at least one...
|
|
|
6992891 |
Metal ball attachment of heat dissipation devices
An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device...
|
|
|
6992887 |
Liquid cooled semiconductor device
A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a...
|
|
|
6992381 |
Using external radiators with electroosmotic pumps for cooling integrated circuits
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid...
|
|
|
6992383 |
Semiconductor device having radiation structure
A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the...
|
|
|
6989592 |
Integrated power module with reduced thermal impedance
A dual-side thermal interface and cooling design of an integrated power module is disclosed which effectively reduces the equivalent thermal impedance on the power module by 20%. This in turn...
|
|
|
6987671 |
Composite thermal interface devices and methods for integrated circuit heat transfer
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved...
|
|
|
6984888 |
Carbonaceous composite heat spreader and associated methods
A heat spreader including a plurality of carbonaceous particles present in an amount of at least about 50% by volume of the heat spreader. A non-carbonaceous infiltrant is also present in an amount...
|
|
|
6982481 |
System for dissipating heat and shielding electromagnetic radiation produced by an electronic device
Described is an apparatus for dissipating heat and shielding electromagnetic radiation from at least one electronic device on a printed circuit board. The apparatus includes a printed circuit board...
|