|
Match
|
Document |
Document Title |
|
|
5977631 |
Semiconductor device including a semiconductor package with electromagnetic coupling slots
A semiconductor device includes a high-frequency semiconductor chip having first and second surfaces, and including a first high-frequency transmission line on the first surface and a first...
|
|
|
5978216 |
Semiconductor package, leadframe, and manufacturing method therefor
A semiconductor package comprises a semiconductor chip having bonding pads in the center area of surface thereof; a plurality of leads disposed on and attached to the upper surface of the chip by...
|
|
|
5965937 |
Thermal interface attach mechanism for electrical packages
An electrical cartridge of the present invention includes a spring that pushes an integrated circuit package into a thermal plate. The integrated circuit package and substrate are attached to a...
|
|
|
5963428 |
Cooling cap method and apparatus for tab packaged integrated circuit
The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little...
|
|
|
5959350 |
Fixing device for securing a heat sink to a CPU module
A fixing device for securing a heat sink to a CPU module includes a base plate, two elastic side plates respectively extending from two distal ends of the base plate, two curved portions formed...
|
|
|
5959349 |
Transfer molding encapsulation of a semiconductor die with attached heat sink
A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First,...
|
|
|
5955782 |
Apparatus and process for improved die adhesion to organic chip carriers
A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and...
|
|
|
5952728 |
Thermoelectric conversion module having channels filled with semiconducting material and insulating fillers
A thermoelectric conversion module having a large capacity and a curved surface which can be secured to a corresponding curved surface of a base member is manufactured by inserting N type and P...
|
|
|
5953593 |
Method and mold for manufacturing a plastic package for an electronic device having a heat sink
A method for forming a plastic package for a power semiconductor electronic device to be encapsulated within a plastic case and to be coupled thermally to a heat sink element having a major surface...
|
|
|
5952719 |
Metal ball grid electronic package having improved solder joint
The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and...
|
|
|
5945708 |
Field-effect-controllable, vertical semiconductor component and method for producing the same
A field-effect-controllable, vertical semiconductor component, and a method for producing the semiconductor component include a semiconductor body having at least one drain zone of a first...
|
|
|
5945741 |
Semiconductor chip housing having a reinforcing plate
A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive...
|
|
|
5940269 |
Heat sink assembly for an electronic device
A heat sink assembly including a heat sink having a plurality of equi-distantly spaced cooling fins. The heat sink body has a depression on one side for receiving a cooling and is fixedly provided...
|
|
|
5939206 |
Stabilized porous, electrically conductive substrates
Disclosed is an apparatus which comprises at least one semiconductor chip mounted on a substrate, said substrate comprising a porous, electrically conductive member having electrophoretically...
|
|
|
5933326 |
Clipping device for heat sink
A clipping device for attaching a heat sink to an electrical device comprises an elongate biasing strip and a pivotal grasp pivotally connected to an end of the biasing strip. Interconnecting...
|
|
|
5933709 |
Semiconductor package and method for fabricating same
A semiconductor package including a first heat slug having a substantially flat shape and a second heat slug coupled to the first heat slug. A semiconductor chip is mounted on an inner surface of...
|
|
|
5925901 |
Field effect transistor with plated heat sink on a fet chip
A GaAs substrate is divided at boundary regions of unit cells of FET chips. With such construction, magnitude of curling of the GaAs substrate due to a difference of thermal expansion coefficients...
|
|
|
5926371 |
Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device
A heat transfer apparatus is presented accommodating elevational disparity of an upper surface of a semiconductor device with respect to the component side of a PCB without adversely affecting...
|
|
|
5923086 |
Apparatus for cooling a semiconductor die
A method and an apparatus for cooling a semiconductor die. In one embodiment, a C4 packaged semiconductor die is thermally coupled to a cooling plate having an opening. The opening of the cooling...
|
|
|
5920458 |
Enhanced cooling of a heat dissipating circuit element
An arrangement for cooling a heat dissipating circuit element mounted to a first side of a printed circuit board. A heat dissipation member is mounted to the other side of the circuit board and a...
|
|
|
5917702 |
Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package
An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and a plurality of corners. A plurality of solder balls may be soldered to the...
|
|
|
5915757 |
Electrostatic protective device and method for fabricating same
Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating...
|
|
|
5914857 |
Air flow devices for electronic boards
A cooling system for electronic boards and cards is described. The cooling system is designed to provide streamlined air flow about heated components disposed upon the boards. The cooling system...
|
|
|
5912803 |
Heat dissipating box
The present invention relates to a heat dissipating box for a printed board assembly (PBA) using natural convection for cooling. The PBA 64 is fastened between a first part 62 and a second part 61...
|
|
|
5912805 |
Thermal interface with adhesive
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises first and second generally...
|
|
|
5910683 |
Power semiconductor module
The invention relates to a power semiconductor module having at least one power semiconductor switch, a cooling system, control electronics and a relieving network. According to this invention,...
|
|
|
5902959 |
Lead frame with waffled front and rear surfaces
A surface mount semiconductor package includes a semiconductor device, a metal pad on which the semiconductor device is mounted, and a housing formed of a flowable material which bonds to the metal...
|
|
|
5902120 |
Process for producing spatially patterned components
A process is disclosed for producing spatially patterned components from a body. On the backside of the body, a retardation layer with openings is provided for retarding a removal of the material...
|
|
|
5903052 |
Structure for semiconductor package for improving the efficiency of spreading heat
The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench...
|
|
|
5901042 |
Package and semiconductor device
A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the...
|
|
|
5901043 |
Device and method for reducing thermal cycling in a semiconductor package
In semiconductor packaging, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die. A thermally-conductive member is positioned in a cooperating manner...
|
|
|
5901041 |
Flexible integrated circuit package
A flexible integrated circuit package for mounting on a substrate is disclosed. The package consists of a tape film having layers of dielectric and conductive material, a semiconductor die and an...
|
|
|
5900675 |
Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
An integrated circuit chip package with an integrated chip carrier having differing coefficients of thermal expansion (CTE) in the x-y plane. The chip carrier is comprised of two main regions. The...
|
|
|
5898211 |
Laser diode package with heat sink
A laser diode package includes a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and first and second surfaces...
|
|
|
5898219 |
Custom corner attach heat sink design for a plastic ball grid array integrated circuit package
An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and four corners. Each corner has a conductive plane and at least one via. The...
|
|
|
5896271 |
Integrated circuit with a chip on dot and a heat sink
Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal...
|
|
|
5895973 |
Electronic component assembly for maintaining component alignment during soldering
An aligned electronic circuit component assembly for attaching components onto larger mounting members at predetermined positions thereon are provided. The mounting or heat spreader members include...
|
|
|
5894108 |
Plastic package with exposed die
A molded plastic package incorporates a lead frame which includes a plurality of leads radially aligned around a central opening. A die is mounted in the central opening and is electrically...
|
|
|
5886393 |
Bonding wire inductor for use in an integrated circuit package and method
An integrated circuit package assembly is disclosed herein and includes at least one integrated circuit chip having a plurality of chip input/output terminals, an arrangement for providing...
|
|
|
5883426 |
Stack module
A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto...
|
|
|
5880403 |
Radiation shielding of three dimensional multi-chip modules
The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the...
|
|
|
5880524 |
Heat pipe lid for electronic packages
An apparatus for spreading the heat generated by a semiconductor device. In one embodiment, a semiconductor device, such as a CPU, is mounted to a package substrate. A cover is attached to the...
|
|
|
5880933 |
Heat sinking module cover
A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical...
|
|
|
5872396 |
Semiconductor device with plated heat sink
A method of fabricating a semiconductor device includes forming a first chip separating in a wafer having a groove depth is less than the thickness of the wafer, forming a first metallization layer...
|
|
|
5870823 |
Method of forming a multilayer electronic packaging substrate with integral cooling channels
Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the...
|
|
|
5869892 |
Noise eliminating element and electrical circuit having the same
Disclosed are a noise eliminating element having a junction of components of two kinds of electroconductive materials, characterized in that the absolute values of the thermoelectric power of the...
|
|
|
5869889 |
Thin power tape ball grid array package
An integrated circuit package includes a heatspreader which is formed to have a centrally disposed recessed portion between planar surfaces, and flex tape extending from the planar surfaces into...
|
|
|
5869890 |
Insulation substrate for a semiconductor device
A Ceramic Bonding Copper (CBC) substrate used in semiconductor modules includes a ceramic plate having foil-shaped copper plates bonded to the ceramic plate by the direct copper bonding method. A...
|
|
|
5869891 |
Powdered metal heat sink with increased surface area
A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct...
|
|
|
5866943 |
System and method for forming a grid array device package employing electomagnetic shielding
A system and method are presented for forming a grid array device package around an integrated circuit (i.e., chip), the packaged device incorporating electromagnetic shielding. Embodiments of the...
|