|
Match
|
Document |
Document Title |
|
|
5917702 |
Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package
An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and a plurality of corners. A plurality of solder balls may be soldered to the...
|
|
|
5915757 |
Electrostatic protective device and method for fabricating same
Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating...
|
|
|
5914857 |
Air flow devices for electronic boards
A cooling system for electronic boards and cards is described. The cooling system is designed to provide streamlined air flow about heated components disposed upon the boards. The cooling system...
|
|
|
5912803 |
Heat dissipating box
The present invention relates to a heat dissipating box for a printed board assembly (PBA) using natural convection for cooling. The PBA 64 is fastened between a first part 62 and a second part 61...
|
|
|
5912805 |
Thermal interface with adhesive
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises first and second generally...
|
|
|
5910683 |
Power semiconductor module
The invention relates to a power semiconductor module having at least one power semiconductor switch, a cooling system, control electronics and a relieving network. According to this invention,...
|
|
|
5902959 |
Lead frame with waffled front and rear surfaces
A surface mount semiconductor package includes a semiconductor device, a metal pad on which the semiconductor device is mounted, and a housing formed of a flowable material which bonds to the metal...
|
|
|
5902120 |
Process for producing spatially patterned components
A process is disclosed for producing spatially patterned components from a body. On the backside of the body, a retardation layer with openings is provided for retarding a removal of the material...
|
|
|
5903052 |
Structure for semiconductor package for improving the efficiency of spreading heat
The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench...
|
|
|
5901042 |
Package and semiconductor device
A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the...
|
|
|
5901043 |
Device and method for reducing thermal cycling in a semiconductor package
In semiconductor packaging, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die. A thermally-conductive member is positioned in a cooperating manner...
|
|
|
5901041 |
Flexible integrated circuit package
A flexible integrated circuit package for mounting on a substrate is disclosed. The package consists of a tape film having layers of dielectric and conductive material, a semiconductor die and an...
|
|
|
5900675 |
Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
An integrated circuit chip package with an integrated chip carrier having differing coefficients of thermal expansion (CTE) in the x-y plane. The chip carrier is comprised of two main regions. The...
|
|
|
5898211 |
Laser diode package with heat sink
A laser diode package includes a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and first and second surfaces...
|
|
|
5898219 |
Custom corner attach heat sink design for a plastic ball grid array integrated circuit package
An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and four corners. Each corner has a conductive plane and at least one via. The...
|
|
|
5896271 |
Integrated circuit with a chip on dot and a heat sink
Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal...
|
|
|
5895973 |
Electronic component assembly for maintaining component alignment during soldering
An aligned electronic circuit component assembly for attaching components onto larger mounting members at predetermined positions thereon are provided. The mounting or heat spreader members include...
|
|
|
5894108 |
Plastic package with exposed die
A molded plastic package incorporates a lead frame which includes a plurality of leads radially aligned around a central opening. A die is mounted in the central opening and is electrically...
|
|
|
5886393 |
Bonding wire inductor for use in an integrated circuit package and method
An integrated circuit package assembly is disclosed herein and includes at least one integrated circuit chip having a plurality of chip input/output terminals, an arrangement for providing...
|
|
|
5883426 |
Stack module
A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto...
|
|
|
5880403 |
Radiation shielding of three dimensional multi-chip modules
The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the...
|
|
|
5880524 |
Heat pipe lid for electronic packages
An apparatus for spreading the heat generated by a semiconductor device. In one embodiment, a semiconductor device, such as a CPU, is mounted to a package substrate. A cover is attached to the...
|
|
|
5880933 |
Heat sinking module cover
A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical...
|
|
|
5872396 |
Semiconductor device with plated heat sink
A method of fabricating a semiconductor device includes forming a first chip separating in a wafer having a groove depth is less than the thickness of the wafer, forming a first metallization layer...
|
|
|
5870823 |
Method of forming a multilayer electronic packaging substrate with integral cooling channels
Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the...
|
|
|
5869892 |
Noise eliminating element and electrical circuit having the same
Disclosed are a noise eliminating element having a junction of components of two kinds of electroconductive materials, characterized in that the absolute values of the thermoelectric power of the...
|
|
|
5869889 |
Thin power tape ball grid array package
An integrated circuit package includes a heatspreader which is formed to have a centrally disposed recessed portion between planar surfaces, and flex tape extending from the planar surfaces into...
|
|
|
5869890 |
Insulation substrate for a semiconductor device
A Ceramic Bonding Copper (CBC) substrate used in semiconductor modules includes a ceramic plate having foil-shaped copper plates bonded to the ceramic plate by the direct copper bonding method. A...
|
|
|
5869891 |
Powdered metal heat sink with increased surface area
A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct...
|
|
|
5866943 |
System and method for forming a grid array device package employing electomagnetic shielding
A system and method are presented for forming a grid array device package around an integrated circuit (i.e., chip), the packaged device incorporating electromagnetic shielding. Embodiments of the...
|
|
|
5864470 |
Flexible circuit board for ball grid array semiconductor package
A flexible circuit board for a ball grid array semiconductor package including a flexible resin film, a plurality of electrically conductive traces formed on an upper surface of the resin film, the...
|
|
|
5864175 |
Wrap-resistant ultra-thin integrated circuit package fabrication method
The present invention provides a method for fabricating modified integrated circuit packages that are ultra-thin and resist warping. The integrated circuit packages are made thinner by removing...
|
|
|
5864464 |
Heat sink for integrated circuit
A heat sink includes a plate for engaging on an integrated circuit device and having a number of fins. A fastener blade is engaged in the fins and includes two hooks for engaging with the device...
|
|
|
5856911 |
Attachment assembly for integrated circuits
An integrated circuit package has a top die attach area and a bottom heat spreader thermally coupled to the die for conducting heat generated by the die through a thermal interface in the main...
|
|
|
5854511 |
Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads
A semiconductor package provided with a heat sink adapted to discharge heat from the package. The package has an oxidation film formed on an upper surface portion of the heat sink to which a...
|
|
|
5854741 |
Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same
A unit printed circuit board (PCB) carrier frame used in the fabrication of a heat sink-attached ball grid array (BGA) semiconductor packages and a method for BGA semiconductor packages using the...
|
|
|
5852324 |
Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes
A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude...
|
|
|
5847935 |
Electronic circuit chip package
A package for an electronic component includes a metal base plate and a body of an insulating material, such as glass or ceramic, on and bonded to a surface of the base plate. The body is formed of...
|
|
|
5838066 |
Miniaturized cooling fan type heatsink for a semiconductior device
To provide a semiconductor device heatsink that is mounted to a semiconductor device and that improves the cooling efficiency, a semiconductor device heatsink has a configuration in that the...
|
|
|
5834840 |
Net-shape ceramic processing for electronic devices and packages
An electronic device package is provided, consisting of reaction bonded silicon nitride structural and dielectric components and conductor, resistor, and capacitor elements positioned with the...
|
|
|
5835352 |
Power amplifying module
A power amplifying module has a package formed by welding a package bottom plate being a package substrate of a generally flat plate shape with a cap being a metal package cap of a generally...
|
|
|
5831825 |
Integrated circuit IC package and a process for cooling an integrated circuit mounted in an IC package
The heat dissipated by the integrated circuit (11) is evacuated into a plate (13) having an extended surface in order to transmit the heat into the integrated circuit package (10) and into the...
|
|
|
5831831 |
Bonding material and phase change material system for heat burst dissipation
There is disclosed herein an electronic circuit assembly using a bonding material/phase change material system for electronic device heat burst dissipation. One embodiment of the assembly...
|
|
|
5831333 |
Integrated junction temperature sensor/package design and method of implementing same
A structure and method for controlling the junction temperature of a semiconductor chip in an electronic system. A temperature sensing device and the chip whose junction temperature is to be...
|
|
|
5828000 |
Semiconductor device with heat radiating plate and positioning dummy lead and lead frame therefor
A semiconductor device including an insulating package outer frame member, outer leads, positioning dummy leads, a heat radiating plate, and a semiconductor chip mounted to the heat radiating...
|
|
|
5821614 |
Card type semiconductor device
A card type semiconductor device includes a main circuit board and a first sub-circuit-board equipped with a main memory. The main circuit board is connected to the first sub-circuit-board through...
|
|
|
5822194 |
Electronic part mounting device
The present invention is to provide an electronic part mounting device including: a lamination body composed of a circuit board and a structural member; an electronic part attached in an opening...
|
|
|
5815921 |
Electronic package cooling system and heat sink with heat transfer assembly
A method for minimizing thermal overhead in an integrated circuit package is described. A heat sink having a base is integrally formed into the package. The base is connected to the die, and a...
|
|
|
5810608 |
Contact pad extender for integrated circuit packages
An integrated circuit package that contains a fan assembly which is mounted to the package. The package includes a printed circuit board substrate which has a top surface, an opposite bottom...
|
|
|
5804873 |
Heatsink for surface mount device for circuit board mounting
A surface mount package is provided with a U-shaped heatsink which is coupled to exposed portions of a bottom plate of the package. The bottom plate of the surface mount package is provided with...
|