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6075702 |
Heat transfer device for a retention assembly
A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly...
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6075288 |
Semiconductor package having interlocking heat sinks and method of fabrication
A semiconductor package includes a semiconductor die, a lead frame wire bonded to the die, and a plastic body encapsulating the die. The package also includes a first heat sink attached to a face...
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6067231 |
Heat-dissipating structure for an electrical device
A heat-dissipating structure for an electrical device comprises a PC board with a dissipating opening, and an electrical device. The PC board has an upper surface thereof and a lower surface...
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6064573 |
Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits
A plurality of heat-conducting compressible button contacts (10) between a heatsink (28) and an electronic part, e.g., a printed wiring board (22) or integrated circuit (24), to be cooled. A thin...
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6064570 |
Computer processor/heat sink assembly having a dual direction air flow path
A computer processor/heat sink assembly in which a heat sink is provided extending adjacent a processor or electrical component to be cooled. The heat sink has a plurality of spaced fins having...
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6058013 |
Molded housing with integral heatsink
A plastic housing assembly is constructed with a non-plateable plastic wall portion (101), and a plateable plastic wall portion (107) positioned abutting (109) the non-plateable plastic wall...
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6057223 |
Passivated copper conductive layers for microelectronic applications
A copper conductor is formed which is included as a component in microelectronic devices. The conductor is formed by forming a metal layer on the surface of a microelectronic substrate, forming a...
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6055154 |
In-board chip cooling system
An integrated circuit chip cooling system includes a thermally conductive block on which the chip is directly mounted. The block is secured to a printed circuit board and is suspended into flowing...
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6049467 |
Stackable high density RAM modules
A stacked circuit assembly is provided for mounting memory modules in close proximity to an integrated circuit. The assembly includes an integrated circuit mounted on a printed circuit board and at...
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6049456 |
Electronic module adjustment design and process using shims
A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the...
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6046907 |
Heat conductor
A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel...
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6034430 |
Integrated thermal coupling for a heat generating device
In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side...
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6031279 |
Power semiconductor component
A power semiconductor component includes a first chip having a vertical first transistor. A second chip with a second vertical transistor is mounted on the first chip in such a way that load paths...
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6031723 |
Insulated surface mount circuit board construction
A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board...
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6028358 |
Package for a semiconductor device and a semiconductor device
A semiconductor package and semiconductor device are provided which enable manufacturing of same with ease of inspection, good reliability, and good thermal characteristics. An insulator made of an...
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6021046 |
Thermal protection of electrical elements systems
A thermal protection system that comprises an assembly of at least one electrical component and a heat shield surrounding the electrical component, wherein the heat shield forms a pocket between...
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6018460 |
Flexible thermal conductor with electromagnetic interference shielding capability for electronic components
A thermal conductor having electromagnetic interference shielding capabilities for electronic components. The conductor comprises a conductive strip and a support surface connected to the...
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6011696 |
Cartridge and an enclosure for a semiconductor package
An electronic cartridge comprising a cartridge substrate, a package substrate, an integrated circuit, and an enclosure. The package substrate is mounted to the cartridge substrate. The integrated...
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6011299 |
Apparatus to minimize integrated circuit heatsink E.M.I. radiation
A set of conductive plates are positioned adjacent to and in close proximity with a unidirectional heatsink on a high frequency integrated circuit. The set of plates is generally electrically...
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6008988 |
Integrated circuit package with a heat spreader coupled to a pair of electrical devices
A multi-chip module which contains a heat spreader that maintains a relatively uniform temperature profile between the devices of the module. The module includes a first electronic device and a...
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6008536 |
Grid array device package including advanced heat transfer mechanisms
A system and method are presented for forming a grid array device package around an integrated circuit (i.e., chip). The device package includes a substrate and a heat spreader. The chip includes...
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6002181 |
Structure of resin molded type semiconductor device with embedded thermal dissipator
A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly...
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5990418 |
Hermetic CBGA/CCGA structure with thermal paste cooling
A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The...
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5991156 |
Ball grid array integrated circuit package with high thermal conductivity
An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a...
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5990550 |
Integrated circuit device cooling structure
An integrated circuit device cooling structure includes a wiring substrate, an integrated circuit device, a heat sink, and heat radiation vias. The integrated circuit device is mounted on the first...
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5990551 |
Bonding of silicon carbide chip with a semiconductor
A module and a method of making the module is disclosed. The module is fod from a semiconductor and a silicon carbide chip for high temperature applications. The module is designed to be compatible...
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5986340 |
Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same
A ball grid array (BGA) package incorporating a heat dissipating member which includes a thin die attach portion mounted between an integrated circuit chip (die) and a package substrate, a heat...
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5982629 |
Silicon semiconductor device,electrode structure therefor, and circuit board mounted therewith
A circuit board mounted with a semiconductor device is fabricated by forming on a silicon substrate at least one first metal layer, overlaying a second metal layer to completely cover the first...
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5982635 |
Signal adaptor board for a pin grid array
An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided...
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5978227 |
Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends
The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each...
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5977631 |
Semiconductor device including a semiconductor package with electromagnetic coupling slots
A semiconductor device includes a high-frequency semiconductor chip having first and second surfaces, and including a first high-frequency transmission line on the first surface and a first...
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5978216 |
Semiconductor package, leadframe, and manufacturing method therefor
A semiconductor package comprises a semiconductor chip having bonding pads in the center area of surface thereof; a plurality of leads disposed on and attached to the upper surface of the chip by...
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5965937 |
Thermal interface attach mechanism for electrical packages
An electrical cartridge of the present invention includes a spring that pushes an integrated circuit package into a thermal plate. The integrated circuit package and substrate are attached to a...
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5963428 |
Cooling cap method and apparatus for tab packaged integrated circuit
The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little...
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5959350 |
Fixing device for securing a heat sink to a CPU module
A fixing device for securing a heat sink to a CPU module includes a base plate, two elastic side plates respectively extending from two distal ends of the base plate, two curved portions formed...
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5959349 |
Transfer molding encapsulation of a semiconductor die with attached heat sink
A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First,...
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5955782 |
Apparatus and process for improved die adhesion to organic chip carriers
A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and...
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5952728 |
Thermoelectric conversion module having channels filled with semiconducting material and insulating fillers
A thermoelectric conversion module having a large capacity and a curved surface which can be secured to a corresponding curved surface of a base member is manufactured by inserting N type and P...
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5953593 |
Method and mold for manufacturing a plastic package for an electronic device having a heat sink
A method for forming a plastic package for a power semiconductor electronic device to be encapsulated within a plastic case and to be coupled thermally to a heat sink element having a major surface...
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5952719 |
Metal ball grid electronic package having improved solder joint
The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and...
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5945708 |
Field-effect-controllable, vertical semiconductor component and method for producing the same
A field-effect-controllable, vertical semiconductor component, and a method for producing the semiconductor component include a semiconductor body having at least one drain zone of a first...
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5945741 |
Semiconductor chip housing having a reinforcing plate
A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive...
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5940269 |
Heat sink assembly for an electronic device
A heat sink assembly including a heat sink having a plurality of equi-distantly spaced cooling fins. The heat sink body has a depression on one side for receiving a cooling and is fixedly provided...
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5939206 |
Stabilized porous, electrically conductive substrates
Disclosed is an apparatus which comprises at least one semiconductor chip mounted on a substrate, said substrate comprising a porous, electrically conductive member having electrophoretically...
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5933326 |
Clipping device for heat sink
A clipping device for attaching a heat sink to an electrical device comprises an elongate biasing strip and a pivotal grasp pivotally connected to an end of the biasing strip. Interconnecting...
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5933709 |
Semiconductor package and method for fabricating same
A semiconductor package including a first heat slug having a substantially flat shape and a second heat slug coupled to the first heat slug. A semiconductor chip is mounted on an inner surface of...
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5925901 |
Field effect transistor with plated heat sink on a fet chip
A GaAs substrate is divided at boundary regions of unit cells of FET chips. With such construction, magnitude of curling of the GaAs substrate due to a difference of thermal expansion coefficients...
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5926371 |
Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device
A heat transfer apparatus is presented accommodating elevational disparity of an upper surface of a semiconductor device with respect to the component side of a PCB without adversely affecting...
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5923086 |
Apparatus for cooling a semiconductor die
A method and an apparatus for cooling a semiconductor die. In one embodiment, a C4 packaged semiconductor die is thermally coupled to a cooling plate having an opening. The opening of the cooling...
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5920458 |
Enhanced cooling of a heat dissipating circuit element
An arrangement for cooling a heat dissipating circuit element mounted to a first side of a printed circuit board. A heat dissipation member is mounted to the other side of the circuit board and a...
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