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6475327 |
Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier
A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is...
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6477054 |
Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via
A low temperature co-fired ceramic substrate structure has first and second conductive patterns respectively disposed on first and second dielectric layers with the conductive patterns being...
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6476508 |
Temperature control structure for integrated circuit
Application of a potential difference across a doped region formed on an integrated circuit allows management of thermal energy directly on the chip surface. Individual temperature control cells...
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6476484 |
Heat sink dissipator for adapting to thickness change of a combination of a CPU and a CPU carrier
A heat sink dissipater includes a retaining device and a heat dissipater. A plurality of fins and a plurality of pads or recesses are integrally formed on the top surface of the heat dissipater. A...
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6477047 |
Temperature sensor mounting for accurate measurement and durability
A temperature sensor for an integrated circuit is attached to a heat sink using a compliant member such as a spring. The spring attaches to the heat sink and extends across a slot in the thermal...
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6472762 |
Enhanced laminate flipchip package using a high CTE heatspreader
A flipchip packaged integrated circuit comprising a substrate, a die and a heatspreader. The die may be configured to electrically attach to the substrate. The heat spreader may be rigidly attached...
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6469380 |
Resin sealed semiconductor device utilizing a clad material heat sink
A resin sealed semiconductor device includes a heat radiation member fixed to a saling resin. The heat radiation member is formed of a clad material including a first metal having a coefficient of...
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6469897 |
Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same
A TBGA (Tape Ball Grid Array) package assembly with grounded heat sink and method of fabricating the same is provided, which is constructed of a tape, a heat sink, and at least one semiconductor...
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6469375 |
High bandwidth 3D memory packaging technique
A three-dimensional memory module in a repetitively used pedestal connector provides signal paths unique and common to the module at its level and signal paths from the level below unique to and...
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6469895 |
Integrated circuit mounting structure including a switching power supply
A semiconductor packaging structure comprising a hybrid IC package having at least one IC chip mounted therein is disclosed. The semiconductor packaging structure includes a DC-DC switching power...
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6465883 |
Capsule for at least one high power transistor chip for high frequencies
The present invention relates to a capsule ( 1 ) for at least one high power transistor chip ( 17 ) for high frequencies, comprising an electrically and thermally conductive flange ( 10 ), at least...
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6462410 |
Integrated circuit component temperature gradient reducer
An integrated circuit device including an integrated circuit die having at least a first and a second heat-generating components formed thereon, and a heat dissipation structure thermally coupled...
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6462950 |
Stacked power amplifier module
Stacked substrates using passive integration components formed in silicon or stainless steel substrates interconnect with active elements mounted on the surface of the substrate to form a...
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6455930 |
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic...
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6452261 |
Flat semiconductor device and power converter employing the same
Control electrode wirings which are led out from control electrodes over a number of chips built in a flat package and insulating members which are provided in order to insulate the control...
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6441484 |
Semiconductor device having switching elements around a central control circuit
A semiconductor device comprises: a first semiconductor chip having a control circuit; a plurality of second semiconductor chips whose operation is controlled by the control circuit; and a resin...
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6437427 |
Lead frame used for the fabrication of semiconductor packages and semiconductor package fabricated using the same
A lead frame for a semiconductor package including a rectangular lead frame body having a central opening, a plurality of leads arranged at and along each of two or four facing sides of the lead...
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6432497 |
Double-side thermally conductive adhesive tape for plastic-packaged electronic components
A thermally conductive interface, which may be in the form of a double-sided, pressure sensitive adhesive tape, disposable intermediate a heat-generating source having a first heat transfer surface...
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6433420 |
Semiconductor package with heat sink having air vent
A BGA semiconductor package having an embedded heat sink is proposed. The heat sink mounted on a substrate includes a flat portion and supporting members for supporting the flat portion to be...
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6414847 |
Integral dielectric heatspreader
Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the...
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6410982 |
Heatpipesink having integrated heat pipe and heat sink
Embodiments of the present invention can dissipate heat and include a top wall including a plurality of hollow fins, a bottom wall, and a plurality of side walls that define an inner cavity. A...
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6411507 |
Removing heat from integrated circuit devices mounted on a support structure
A cover, acting as a heat sink for integrated circuit devices, encloses one or more devices mounted on a support structure. The thermally conductive cover is formed of a thermally conductive...
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6411513 |
Compliant thermal interface devices and method of making the devices
A compliant, thermally conductive interface device for use between two surfaces, such as a component and a heat sink surface, that can accommodate a range of gap distances and angular misalignment...
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6410978 |
Semiconductor device
A semiconductor device in which fatigue failure of a solder layer underneath a semiconductor chip mounted on a base can be prevented from occurring due to repetitions of turn-on and -off of power...
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6407334 |
I/C chip assembly
A chip mounting assembly includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips...
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6404048 |
Heat dissipating microelectronic package
A novel package comprising a die and metal housing arrangement is provided that improves conduction of heat away from the die during use. The housing is a heat block and is abutted against the die...
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6400010 |
Substrate including a metal portion and a resin portion
A semiconductor device comprising a substrate including a metal portion and a resin portion and having a plurality of through holes formed in the resin portion, conductive members formed within the...
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6400011 |
Semiconductor laser module
A semiconductor laser module includes a metal casing and a Peltier effect element mounted on the inner surface of the bottom wall of the metal casing by soldering. A Peltier effect element mounting...
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6400569 |
Heat dissipation in lead frames
A lead frame apparatus that includes: an arrangement for dissipating heat generated at the lead frame, wherein the heat dissipating arrangement is uninterruptedly connected to the lead frame. Also...
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6395999 |
Electronic power module and a method of manufacturing such a module
The module including an aluminum-based metal substrate ( 10 ) and at least one copper-based bar ( 12 ) constituting an equipotential connection which is fixed to the substrate via an insulating...
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6396698 |
Retention module adapter
A module retention adapter for attaching enabled heat sinks to the user target system while validating a processor with an LAI tool. In a preferred embodiment, the invention comprises an adapter...
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6395998 |
Electronic package having an adhesive retaining cavity
An electronic package and method of making the electronic package is provided. An opening in a thermally conductive member of the electronic package is formed to substantially prevent adhesive...
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6396696 |
Clip for heat sink
A clip ( 40 ) for securing a heat sink ( 20 ) to an electronic device ( 35 ) includes a body ( 42 ) and a fastener ( 44 ) slidably attached to the body. The body has a central pressing portion ( 46...
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6396143 |
Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board
A printed wiring board for a ball grid array type semiconductor plastic package which has excellent heat diffusibility and causes no popcorn phenomenon, and a metal-plate-inserted printed wiring...
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6396700 |
Thermal spreader and interface assembly for heat generating component of an electronic device
A thermal dissipation assembly is provided for an electronic device. The assembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the...
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6389582 |
Thermal driven placement
A method for thermal driven placement begins by first computing thermal response functions for individual components for several locations on a placement surface as a preprocessing step to...
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6388317 |
Solid-state chip cooling by use of microchannel coolant flow
A cooling arrangement useful for semiconductors or solid-state assemblages mounts the semiconductor or other solid-state device directly onto a first surface of a thermally conductive “heat...
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6381137 |
Semiconductor module
The present invention is to provide a semiconductor module, which can effectively dissipate heat generated by the semiconductor components disposed on the circuit board, with a simple structure to...
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6380620 |
Tape ball grid array semiconductor
An inner lead and an outer lead are formed only on an insulating tape. A semiconductor chip and the inner lead are connected by the flip chip method by providing an anisotropic conductive material...
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6376907 |
Ball grid array type package for semiconductor device
A semiconductor device with a BGA package includes a substrate made of a resin and having one side on which a number of solder ball terminals are formed and the other side on which a chip mounting...
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6373703 |
Integral design features for heatsink attach for electronic packages
An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant...
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6373702 |
Cooling structure and display apparatus containing the cooling structure
A cooling structure for cooling an exothermic panel such as a plasma display panel by releasing heat therefrom, comprising: a chassis structure for holding the exothermic panel; a plurality of...
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6373133 |
Multi-chip module and heat-sink cap combination
A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over...
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6369331 |
Printed circuit board for semiconductor package and method of making same
A printed circuit board comprises an insulator film extending over the front surface of a substrate. The insulator film is designed to bend around the outer periphery of the substrate so as to...
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6365964 |
Heat-dissipating assembly for removing heat from a flip chip semiconductor device
A method and assembly ( 10 ) for conducting heat from a semiconductor device, such as a power flip chip ( 12 ). The assembly ( 10 ) is generally constructed to dissipate heat from the chip ( 12 )...
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6362522 |
Cool frame for protecting packaged electronic devices
An integrated circuit arrangement having an integrated circuit package contains an integrated circuit device mounted to a surface of the package. A flat frame is placed on the package surface and...
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6363315 |
Apparatus and method for protecting engine electronic circuitry from thermal damage
A control system and method for protecting engine electronic circuitry from thermal damage including an electronic controller coupled to the engine, and one or more sensors coupled to the...
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6359785 |
Power diode and heat sink arrangement
A power diode and heat sink arrangement includes two power diodes fastened to a heat sink, a copper plate soldered to the power diodes at the top to hold a terminal holder, and a ceramic pad...
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6355978 |
Package for accommodating electronic parts, semiconductor device and method for manufacturing package
A package for accommodating electronic parts intended for inhibiting the variation of the characteristic impedance of signal lines, electrical coupling between signal lines, crosstalk noise, and...
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6356448 |
Inter-circuit encapsulated packaging for power delivery
An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed...
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