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7619308 |
Multi-lid semiconductor package
A multi-lid semiconductor package includes one or more die disposed on a substrate, an interconnect disposed on the substrate, one or more die lids, a die thermal interface between the one or more...
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7615862 |
Heat dissipating package structure and method for fabricating the same
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second...
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7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply...
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7612447 |
Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices
A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor...
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7612437 |
Thermally enhanced single inline package (SIP)
In a method and system for fabricating a thermally enhanced semiconductor device ( 200, 300 ) is packaged as a through hole single inline package (SIP). A leadframe ( 210, 310, 410 ) having a die...
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7612370 |
Thermal interface
An apparatus including an interface having a number of nanostructures is described. The apparatus comprises heat source, a thermal management device, and an interface disposed between the thermal...
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7609732 |
Method for controlling a temperature of a thermo-electric cooler and a temperature controller using the same
The present invention is to provide a control algorithm of a thermo-electric cooler (TEC) for a laser diode (LD) where a rush current accompanied with the stepwise change of the target temperature...
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7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
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7608923 |
Electronic device with flexible heat spreader
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat...
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7608918 |
Semiconductor device
A semiconductor device is provided which comprises a heat-radiative support plate 5 ; and first and second semiconductor elements 1 and 2 mounted and layered on support plate 5 for alternate...
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7608917 |
Power semiconductor module
A power semiconductor module and an inverter apparatus in which a device or a joining part is not mechanically damaged even when the temperature in use becomes a high temperature in the range of...
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7606038 |
Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure
A first surface of a double-sided printed circuit board has a soldering land for heat radiation, which serves as a mounting surface for an electronic part. A land for solder absorption is formed on...
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7606034 |
Thermally enhanced memory module
A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended...
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7602060 |
Heat spreader in a flip chip package
A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface...
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7599414 |
Laser device
A laser apparatus ( 100 ) has a semiconductor laser device ( 12 a to 12 c ), coolant jetting means ( 24 ), and a heatsink ( 18 a to 18 c ). The semiconductor laser device has a light output...
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7599187 |
Semiconductor module and heat radiating plate
A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed...
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7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a...
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7598535 |
Light-emitting diode assembly and method of fabrication
An LED assembly includes a packaged LED module ( 30 ) and a heat dissipation device ( 50 ). The LED module includes at least an LED die therein and a plurality of conductive pins ( 32, 34 )...
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7592697 |
Microelectronic package and method of cooling same
A microelectronic package comprises a chip stack ( 110 ) that includes a substrate ( 111 ), a first die ( 112 ) over the substrate and a second die ( 113 ) over the first die, a first underfill...
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7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
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7589971 |
Reconfigurable heat sink assembly
An electrical assembly including a housing having an inner surface. At least one mounting feature protrudes from the inner surface. At least one heat sink is inserted onto the at least one mounting...
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7589407 |
Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package
A single metal layer tape substrate includes a patterned metal layer affixed to a patterned dielectric layer. The dielectric layer is patterned to provide openings exposing lands and bond sites on...
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7589379 |
Power semiconductor and method of fabrication
This invention is generally concerned with power semiconductors such as power MOS transistors, insulated gate by bipolar transistors (IGBTs), high voltage diodes and the like, and methods for their...
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7589356 |
LED and attachment structure of LED
An LED that can effectively prevent heat accumulation while preventing short-circuiting, discharge, fire and the like, even in the case where LEDs are relatively densely placed, is provided. In a...
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7586191 |
Integrated circuit apparatus with heat spreader
An integrated circuit apparatus with heat removal has an electrical interconnection network. The electrical interconnection network has a plurality of electrically and thermally conductive vias in...
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7586125 |
Light emitting diode package structure and fabricating method thereof
A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface...
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7582964 |
Semiconductor package having non-ceramic based window frame
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
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7582959 |
Driver module structure with flexible circuit board
A driver module structure includes a flexible circuit board ( 2 ) provided with a wiring pattern ( 7 ), a semiconductor device mounted on the flexible circuit board ( 2 ), and an electrically...
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7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof
The invention of the present application provides a heat radiation structure of a semiconductor device, and includes a substrate having, on a surface thereof, a first area on which the...
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7579626 |
Silicon carbide layer on diamond substrate for supporting group III nitride heterostructure device
A high power, wide-bandgap device is disclosed that exhibits reduced junction temperature and higher power density during operation and improved reliability at a rated power density. The device...
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7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid...
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7576428 |
Melting temperature adjustable metal thermal interface materials and application thereof
A melting temperature adjustable metal thermal interface material (TIM) is provided. The metal TIM includes In, Bi, Sn, and Ga. A content of Ga ranges from 0.01 wt % to 3 wt %. The metal TIM has an...
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7569930 |
Semiconductor module and radiator plate
A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12 a , 12 b ...
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7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same
A semiconductor laser diode device comprises a semiconductor laser diode, a primary lead having a sub-mount for mounting the semiconductor laser diode, at least one secondary lead electrically...
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7566590 |
Low voltage drop and high thermal performance ball grid array package
An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first...
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7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein
A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each...
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7561436 |
Circuit assembly with surface-mount IC package and heat sink
A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of...
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7561429 |
Power converter unit
A power converter unit comprises: a metal casing; a power module mounted in the metal casing and equipped with two or more power semiconductor devices; a metal plate disposed on the power module...
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7557442 |
Power semiconductor arrangement
A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is...
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7554192 |
Semiconductor device having filler with thermal conductive particles
A semiconductor device that includes an insulating substrate having an upper conductor formed on an upper surface thereof and a lower conductor formed on a lower surface of the insulating...
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7554179 |
Multi-leadframe semiconductor package and method of manufacture
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached...
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7550840 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die...
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7550777 |
Light emitting device including adhesion layer
A light emitting device has a light emitting element and an adhesion layer to bond the light emitting element to a mounting member. The adhesion layer is of inorganic material particles and a...
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7549773 |
LED housing
A high power LED Housing consisting of one or more LED to form a LED assembly fitted into a metal body having an upper portion with a gripping means and a lower portion with a fitting means and a...
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7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the...
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7546943 |
Apparatus, system, and method for positioning a printed circuit board component
An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7541644 |
Semiconductor device with effective heat-radiation
The semiconductor device has a silicon layer (SOI layer) ( 12 ) formed through a silicon oxide film ( 11 ) on a support substrate ( 10 ). A transistor (T 1 ) is formed in the SOI layer ( 12 ). The...
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7538426 |
Cooling system of power semiconductor module
A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor...
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7538424 |
System and method for dissipating heat from a semiconductor module
The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The...
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