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7166913 |
Heat dissipation for heat generating element of semiconductor device and related method
A structure and method are disclosed for heat dissipation relative to a heat generating element in a semiconductor device. The structure includes a plurality of heat transmitting lines partially...
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7166912 |
Isolated thermal interface
An isolated thermal interface is presented. The inventive interface includes a flexible graphite sheet having two major surfaces, at least one of the major surfaces coated with a protective coating...
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7161240 |
Insitu-cooled electrical assemblage
An electrical assemblage reduces heat generated by components during operation. The assemblage has at least one heat-generating component, typically a resistor, and at least one heat-removing...
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7157801 |
Device and a method for thermal sensing
A device for thermal sensing is disclosed based on one thermopile. The cold junctions of the thermopile are coupled thermally to a first channel comprising a first substance while the hot junctions...
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7148554 |
Discrete electronic component arrangement including anchoring, thermally conductive pad
An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically...
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7148573 |
Semiconductor integrated circuit
A semiconductor integrated circuit comprises a semiconductor substrate, a heat-producing circuit element formed in a multi-layer structure on the semiconductor substrate and performing a...
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7149088 |
Half-bridge power module with insert molded heatsinks
A power module which includes heatsinks made of AlSiC and power semiconductor devices directly mounted thereon.
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7145225 |
Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
An interposer includes a substrate, first and second sets of contact pads carried by the substrate, and receptacles formed in a surface of the substrate and exposing contact pads of the second set....
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7145224 |
Semiconductor device
In the semiconductor device, a control power MOSFET chip 2 is disposed on the input-side plate-like lead 5 , and the drain terminal DT 1 is formed on the rear surface of the chip 2 , and the...
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7142422 |
Heat dissipation device
A heat dissipation device includes a mounting plate ( 21 ) for mounting the heat dissipation device to a circuit board ( 3 ) on which a CPU ( 4 ) and a plurality of capacitors ( 31 ) are mounted, a...
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7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality
A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the...
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7135769 |
Semiconductor packages and methods of manufacturing thereof
Described are semiconductor package devices with improved reliability and methods of manufacturing thereof. In one embodiment, a package device is disclosed that includes a chip having an active...
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7136287 |
Clip for mounting heat sink to circuit board
A clip ( 10 ) includes a body ( 12 ) including spaced first and second end portions, a first locking part ( 20 ) extending from the first end portion for attaching to a heat sink ( 80 ), and a...
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7133287 |
ATCA integrated heatsink and core power distribution mechanism
An integrated heatsink and core power distribution mechanism. First and second power rails are disposed on opposite sides of one of more integrated circuits on a printed circuit board (PCB). The...
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7132746 |
Electronic assembly with solder-bonded heat sink
A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive...
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7129640 |
Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
An integrated circuit (IC) device for driving a light emitting device, such as a laser diode, includes a heat-absorbing structure fabricated on a substrate over an electrical component, such as an...
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7126824 |
Heat dissipation device assembly incorporating retention member
A heat dissipation device assembly includes a heat sink ( 20 ) placed on an electronic component ( 52 ) which is mounted on a printed circuit board (PCB) ( 50 ) and including a pair of shoulders (...
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7122243 |
Metal/ceramic bonding substrate and method for producing same
There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substrate 10 wherein a circuit...
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7123484 |
Multi-layer and multi-direction fan device
A multi-layer and multi-direction radial fan device is disclosed, comprising an upper cover, a tower fan body, a cavity partition and a lower cover. The tower fan body is located in the upper...
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7119422 |
Solid-state semiconductor light emitting device
A solid-state semiconductor light emitting device is disclosed. A heat sink that comprises a receiving cup for receiving a chip is provided. A leadframe that comprises a connection base is mounted...
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7120025 |
Imaging apparatus
An imaging apparatus comprises an imaging device which images an image, an exterior member which contains the imaging device, an interior member which is arranged inside of the exterior member and...
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7116557 |
Imbedded component integrated circuit assembly and method of making same
Integrated circuit components are imbedded within a laminate substrate disposed on a thermally conductive core, which provides a thermal sink. The circuit components are electrically connected to...
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7115988 |
Bypass capacitor embedded flip chip package lid and stiffener
The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also...
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7112883 |
Semiconductor device with temperature control mechanism
A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal...
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7109573 |
Thermally enhanced component substrate
An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an...
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7105922 |
Electrode-type heat sink
The invention relates to a method of manufacturing a semiconductor device ( 10 ), wherein a semiconductor element ( 1 ) provided with a number of connection regions ( 2 ) is fitted between a first,...
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7102226 |
Device and method for package warp compensation in an integrated heat spreader
A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled...
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7095110 |
Light emitting diode apparatuses with heat pipes for thermal management
A light emitting apparatus ( 10, 110, 210, 310, 410 ) includes one or more light emitting diode chips ( 12, 112, 212, 312, 412 ) disposed on a chip support wall ( 16, 116, 216 ) including printed...
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7091603 |
Semiconductor device
In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the...
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7091604 |
Three dimensional integrated circuits
A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit...
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7087987 |
Tape circuit substrate and semiconductor chip package using the same
A tape circuit substrate and semiconductor chip package using the same. The tape circuit substrate may comprise a base film which may be made of an insulating material and may be formed with...
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7088586 |
Techniques for cooling a circuit board component within an environment with little or no forced convection airflow
A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the...
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7084495 |
Electroosmotic pumps using porous frits for cooling integrated circuit stacks
A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of...
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7084494 |
Semiconductor package having integrated metal parts for thermal enhancement
A semiconductor device comprising a metallic leadframe ( 103 ) with a first surface ( 103 a ) and a second surface ( 103 b ). The leadframe includes a chip pad ( 104 ) and a plurality of segments (...
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7078801 |
Thermoelectric module package
A thermoelectric module package stores a thermoelectric module for controlling temperature of a semiconductor element (e.g., a semiconductor laser) having high output power, wherein it is...
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7078802 |
Method for bonding heat sinks to overmold material and resulting structure
A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive...
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7075174 |
Semiconductor packaging techniques for use with non-ceramic packages
A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching...
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7071552 |
IC die with directly bonded liquid cooling device
An apparatus includes an integrated circuit (IC) die having a substrate formed of a first semiconductor material and a cooling device form of a second semiconductor material. The cooling device is...
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7068511 |
High-density architecture for a microelectronic complex on a planar body
A microelectronic complex including a first body, a discrete functional module and an interconnection module. The first body is characterized by a planar main surface that defines an attachment...
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7064429 |
Electronic package having integrated cooling element with clearance for engaging package
An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect...
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7060747 |
Chain extension for thermal materials
A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen...
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7061090 |
Semiconductor device
A semiconductor device comprises a semi-conductor chip bonded on a top surface inside a case electrode by a bonding material and a lead electrode bonded on a top surface of the semiconductor chip...
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7061101 |
Carrier module
Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is...
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7057896 |
Power module and production method thereof
A power module of the present invention mounts electronic components and comprises a circuit board that constitutes an electric power conversion circuit along with the above-mentioned electronic...
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7056566 |
Preappliable phase change thermal interface pad
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that...
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7053482 |
Ceramic package with radiating lid
A ceramic package with a lid attached thereon, which has radiating grooves at its upper surface and/or lower surface to radiate heat generated from a chip-type device is disclosed. The ceramic...
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7053493 |
Semiconductor device having stiffener
A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on...
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7049697 |
Process for making fine pitch connections between devices and structure made by the process
A semiconductor device structure including fine-pitch connections between chips is fabricated using stud/via matching structures. The stud and via are aligned and connected, thereby permitting...
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7049695 |
Method and device for heat dissipation in semiconductor modules
A structure and method are provided for dissipating heat from a semiconductor device chip. A first layer of a dielectric material (e.g. polyimide) is formed on a front side of a heat spreader...
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7049688 |
Semiconductor device having a pair of heat sinks and method for manufacturing the same
A semiconductor device includes a heater element; a first heat sink disposed on one side of the heater element; a second heat sink disposed on the other side of the heater element; and a resin mold...
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