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7549773 |
LED housing
A high power LED Housing consisting of one or more LED to form a LED assembly fitted into a metal body having an upper portion with a gripping means and a lower portion with a fitting means and a...
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7550840 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die...
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7550777 |
Light emitting device including adhesion layer
A light emitting device has a light emitting element and an adhesion layer to bond the light emitting element to a mounting member. The adhesion layer is of inorganic material particles and a...
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7546943 |
Apparatus, system, and method for positioning a printed circuit board component
An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The...
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7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7541644 |
Semiconductor device with effective heat-radiation
The semiconductor device has a silicon layer (SOI layer) ( 12 ) formed through a silicon oxide film ( 11 ) on a support substrate ( 10 ). A transistor (T 1 ) is formed in the SOI layer ( 12 ). The...
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7538424 |
System and method for dissipating heat from a semiconductor module
The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The...
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7538426 |
Cooling system of power semiconductor module
A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor...
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7538423 |
Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device
A heat sink includes a base portion formed of insulating diamond, and a plurality of pressure contacting members formed of the insulating diamond and arranged on the base portion
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7535099 |
Sintered metallic thermal interface materials for microelectronic cooling assemblies
A microelectronic cooling assembly and method for fabricating the same are described. In one example, a microelectronic cooling assembly includes a microelectronic device, a heat spreader, and a...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7535708 |
Fan integrated thermal management device
A fan integrated thermal management device, such as a heat sink, may include an integrated fan to facilitate air flow through the device. One embodiment of the thermal management device may include...
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7535714 |
Apparatus and method providing metallic thermal interface between metal capped module and heat sink
An apparatus and method for creating a metallic thermal interface is shown for connecting an electronic module to a heat sink. Using an interface metal such as indium or malleable indium alloys,...
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7535098 |
Structure of substrate
A substrate having a metallic panel and an insulator is provided. The metallic panel comprises two patterned metallic layers. The two patterned metallic layers are disposed on the respective sides...
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7532479 |
Spread illuminating apparatus
In a spread illuminating apparatus including: an LED at a side surface of a light conductor plate; and an FPC having a land formed on a side thereof for mounting the LED, throughholes are formed at...
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7532480 |
Power delivery for electronic assemblies
Embodiments of methods, apparatuses, devices, and/or systems for power delivery for electronic assemblies are disclosed.
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7528489 |
Semiconductor apparatus and manufacturing method
Pb free solder is used in die bonding. A thermal stress reduction plate is disposed between a semiconductor chip and a die pad made of a Cu alloy. The semiconductor chip and the thermal stress...
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7528482 |
Embedded chip package with improved heat dissipation performance and method of making the same
A Chip-in Substrate Package (CiSP) includes a double-sided metal clad laminate including a dielectric interposer, a first metal foil laminated on a first side of the dielectric interposer, and a...
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7528413 |
Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly...
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7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die...
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7521789 |
Electrical assembly having heat sink protrusions
An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its...
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7521799 |
Semiconductor device and method of manufacturing the same
Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a...
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7521793 |
Integrated circuit mounting for thermal stress relief useable in a multi-chip module
Disclosed is a mounting structure for mounting an IC on a substrate, and particularly useful in a Multi-Chip Module (MCM). The mounting structure intervenes between the IC and the MCM substrate,...
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7521792 |
Semiconductor package with heat spreader
A semiconductor package is disclosed. In one embodiment the package includes a semiconductor chip including an active surface with a plurality of chip contact areas and a package substrate...
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7514784 |
Electronic circuit device and production method of the same
An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered...
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7514781 |
Circuit substrate and manufacturing method thereof
A circuit substrate includes a plurality of dielectric members and a plurality of wiring patterns. The plurality of wiring patterns are stacked on one another through the plurality of dielectric...
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7508671 |
Computer system having controlled cooling
A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber...
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7508066 |
Heat dissipating semiconductor package and fabrication method thereof
A heat dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted on a chip carrier. A heat sink is mounted on the chip, and includes an...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7504720 |
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is...
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7501699 |
Method and apparatus for electrical isolation of semiconductor device
A package includes a thermal solution to thermal couple to a semiconductor device to remove heat generated by the semiconductor device, and a device to electrically isolate at least a portion of...
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7501700 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected...
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7501702 |
Integrated transistor module and method of fabricating same
An integrated transistor module includes a lead frame that defines at least one low-side land and at least one high-side land. A stepped portion of the lead frame mechanically and electrically...
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7501314 |
Heat sink and method for fabricating the same
A heat sink and method for fabricating the same are disclosed. The heat sink includes a lower substrate having a concave portion, a supporting column formed on the concave portion of the lower...
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7498672 |
Micropin heat exchanger
An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate.
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7495324 |
Power semiconductor module
A power semiconductor module having an electrically insulating substrate, to be arranged with a circuit board. The circuit board is spaced apart from the substrate by a housing. First conductor...
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7495924 |
Electronic device
An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat...
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7482685 |
Ceramic circuit board, method for making the same, and power module
In a ceramic circuit board 1 prepared by integrally joining a circuit layer 4 composed of a clad member including a circuit plate 2 made of an Al plate and an Al—Si brazing material layer ...
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7482687 |
Etch stop in a damascene interconnect structure
An interconnect structure with a plurality of low dielectric constant insulating layers acting as etch stops is disclosed. The low dielectric constant materials act as insulating layers through...
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7479986 |
Imaging apparatus including a cooled imaging element which is shifted to perform high-definition imaging
A highly thermal conductive member is filled in a gap between a base portion and a movable portion of a spring stage in an image shift type imaging apparatus. Heat from a heat generating surface of...
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7477518 |
Sub-assembly
According to an embodiment, a power semiconductor module comprises a heat-dissipation contact area configured to thermally connect the power semiconductor module to a cooling element. The power...
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7476976 |
Flip chip package with advanced electrical and thermal properties for high current designs
A QFN package and method of making same is provided comprising a substrate having a metal line extending from a connection element on a perimeter region of the substrate to a high current contact...
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7473011 |
Method and apparatus for mounting an LED module to a heat sink assembly
A heat sink assembly for mounting an LED module to a surrounding main heat sink member is disclosed. The heat sink assembly has a first plate with inner and outer faces and a peripheral edge. The...
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7471514 |
Auxiliary cooling device for memory chips
An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the...
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7472215 |
Portable computer system with thermal enhancements and multiple power modes of operation
A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least...
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7470983 |
Semiconductor device reducing warping due to heat production
A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between...
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7468555 |
Heat dissipation structure of an electronic device
Disclosed is a heat dissipation structure, which includes a housing that houses a circuit board having active components, a heat sink formed integral with one side of the housing for supporting the...
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7466016 |
Bent lead transistor
A metal backing tab supports the semiconductor device and has an extending portion extending from an edge. A top leg, a middle leg and a bottom leg are all coupled to the semiconductor device and...
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7462934 |
Integrated heat sink
An integrated heat sink comprises a plurality of heat sink portions. The integrated heat sink provides efficient transfer of heat from a non-planar surface. In an example configuration two heat...
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