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6480384 |
Clip for heat sink
A clip ( 40 ) adapted to attach a heat sink ( 30 ) to an electronic device ( 20 ) includes a body ( 50 ) and a lever ( 70 ). The lever is fastened to the body with a pivot ( 96 ). The lever...
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6475327 |
Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier
A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is...
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6476484 |
Heat sink dissipator for adapting to thickness change of a combination of a CPU and a CPU carrier
A heat sink dissipater includes a retaining device and a heat dissipater. A plurality of fins and a plurality of pads or recesses are integrally formed on the top surface of the heat dissipater. A...
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6477046 |
Ball grid array package and method using enhanced power and ground distribution circuitry
A structure ( 10 ) is provided that is fabricated as a ball grid array substrate that includes a substrate dielectric ( 14 ), a power ring ( 18 ), a ground ring ( 20 ), a plurality of traces, and a...
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6472762 |
Enhanced laminate flipchip package using a high CTE heatspreader
A flipchip packaged integrated circuit comprising a substrate, a die and a heatspreader. The die may be configured to electrically attach to the substrate. The heat spreader may be rigidly attached...
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6469375 |
High bandwidth 3D memory packaging technique
A three-dimensional memory module in a repetitively used pedestal connector provides signal paths unique and common to the module at its level and signal paths from the level below unique to and...
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6465890 |
Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages
Integrated circuit packages having offset segmentation, or splitting, of package power and/or ground layers and methods for preventing delamination in package substrates having segmented power...
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6465883 |
Capsule for at least one high power transistor chip for high frequencies
The present invention relates to a capsule ( 1 ) for at least one high power transistor chip ( 17 ) for high frequencies, comprising an electrically and thermally conductive flange ( 10 ), at least...
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6462410 |
Integrated circuit component temperature gradient reducer
An integrated circuit device including an integrated circuit die having at least a first and a second heat-generating components formed thereon, and a heat dissipation structure thermally coupled...
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6462950 |
Stacked power amplifier module
Stacked substrates using passive integration components formed in silicon or stainless steel substrates interconnect with active elements mounted on the surface of the substrate to form a...
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6455930 |
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic...
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6452261 |
Flat semiconductor device and power converter employing the same
Control electrode wirings which are led out from control electrodes over a number of chips built in a flat package and insulating members which are provided in order to insulate the control...
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6444496 |
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a...
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6442033 |
Low-cost 3D flip-chip packaging technology for integrated power electronics modules
Resistance and parasitic inductance resulting from interconnection of semiconductor chips in power modules are reduced to negligible levels by a robust structure which completely avoids use of wire...
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6440779 |
Semiconductor package based on window pad type of leadframe and method of fabricating the same
A new semiconductor packaging technology is proposed for the fabrication of a semiconductor package based on window pad type of leadframe. The proposed semiconductor packaging technology is...
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6442043 |
Chip assembly module of bump connection type using a multi-layer printed circuit substrate
A multi-layer structured printed circuit substrate having an upper conductive layer and a lower conductive layer with an inter-layer insulating layer is used. A chip assembly part of bump...
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6437427 |
Lead frame used for the fabrication of semiconductor packages and semiconductor package fabricated using the same
A lead frame for a semiconductor package including a rectangular lead frame body having a central opening, a plurality of leads arranged at and along each of two or four facing sides of the lead...
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6437438 |
Eddy current limiting thermal plate
The present invention is a method and apparatus to limit eddy current in a thermal plate. A plate is coupled to a die of an integrated circuit for thermal dissipation. The plate has first and...
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6432750 |
Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and...
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6432497 |
Double-side thermally conductive adhesive tape for plastic-packaged electronic components
A thermally conductive interface, which may be in the form of a double-sided, pressure sensitive adhesive tape, disposable intermediate a heat-generating source having a first heat transfer surface...
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6433420 |
Semiconductor package with heat sink having air vent
A BGA semiconductor package having an embedded heat sink is proposed. The heat sink mounted on a substrate includes a flat portion and supporting members for supporting the flat portion to be...
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6429512 |
Ball grid array integrated circuit package with palladium coated heat-dissipation device
A BGA (Ball-Grid Array) integrated circuit package is proposed, which is incorporated with a palladium-coated heat-dissipation device to help enhance the thermal conductivity of the integrated...
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6424031 |
Stackable package with heat sink
A stackable package for an integrated circuit (e.g., a flip chip) is disclosed. The package includes a molded plastic package body having a first side, an opposite second side, and side surfaces...
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6423576 |
Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package
A thermally enhanced package for an integrated circuit, the integrated circuit having a surface with bond pads formed thereon, includes a heat sink structure attached to a central region of the...
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6414385 |
Quad flat non-lead package of semiconductor
A Quad Flat Non-Lead package of semiconductor comprises a chip, a plurality of leads, and a molding compound. The chip has its active surface bonded to the die pad, and the area of the die pad is...
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6404049 |
Semiconductor device, manufacturing method thereof and mounting board
A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to the...
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6404638 |
Small gaps cooling technology
The present invention provides a thermal conduction module assembly kit comprising a base being substantially planar in shape and adapted to receive on a top surface a substrate adapted to receive...
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6403882 |
Protective cover plate for flip chip assembly backside
A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low...
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6404048 |
Heat dissipating microelectronic package
A novel package comprising a die and metal housing arrangement is provided that improves conduction of heat away from the die during use. The housing is a heat block and is abutted against the die...
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6404042 |
Subcarrier and semiconductor device
A chip mount structure called “subcarrier” and semiconductor device capable of efficiently retaining the temperature of a semiconductor element at a constant level by a Peltier cooler without...
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6400012 |
Heat sink for use in cooling an integrated circuit
An apparatus for removing heat from an electronic component. In one embodiment, a heat generating device is mounted to a top-side surface of a package substrate. A fluid flow channel that is...
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6400010 |
Substrate including a metal portion and a resin portion
A semiconductor device comprising a substrate including a metal portion and a resin portion and having a plurality of through holes formed in the resin portion, conductive members formed within the...
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6400011 |
Semiconductor laser module
A semiconductor laser module includes a metal casing and a Peltier effect element mounted on the inner surface of the bottom wall of the metal casing by soldering. A Peltier effect element mounting...
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6400013 |
Thermoelectric module with interarray bridges
A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a...
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6396136 |
Ball grid package with multiple power/ground planes
A package for a flip chip integrated circuit including an interposer with electrical interconnecting for signal, power, and ground contacts. Routing is accomplished on only two conductor layers...
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6396143 |
Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board
A printed wiring board for a ball grid array type semiconductor plastic package which has excellent heat diffusibility and causes no popcorn phenomenon, and a metal-plate-inserted printed wiring...
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6384474 |
Housing for receiving a planar power transistor
With a housing for accommodating a planar power transistor, a chip of the power transistor is arranged hermetically sealed inside the housing, and metallized areas on the chip lead out of the...
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6380620 |
Tape ball grid array semiconductor
An inner lead and an outer lead are formed only on an insulating tape. A semiconductor chip and the inner lead are connected by the flip chip method by providing an anisotropic conductive material...
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6380622 |
Electric apparatus having a contact intermediary member and method for manufacturing the same
A pressed-contact type semiconductor device in which a main electrode surface of a semiconductor element is contacted with an electrode plate by a pressed-contact, which can reduce both an electric...
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6377463 |
Retention module for processor and chipset thermal solutions
A heat sink apparatus includes a first heat sink thermally coupled with at least a first component of a substrate, and a second heat sink thermally coupled with at least a second component of the...
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6376907 |
Ball grid array type package for semiconductor device
A semiconductor device with a BGA package includes a substrate made of a resin and having one side on which a number of solder ball terminals are formed and the other side on which a chip mounting...
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6373702 |
Cooling structure and display apparatus containing the cooling structure
A cooling structure for cooling an exothermic panel such as a plasma display panel by releasing heat therefrom, comprising: a chassis structure for holding the exothermic panel; a plurality of...
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6373131 |
TBGA semiconductor package
Disclosed is a semiconductor package arrangement. The package arrangement includes a heat spreader for dissipating heat generated within the semiconductor package arrangement. The package further...
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6362522 |
Cool frame for protecting packaged electronic devices
An integrated circuit arrangement having an integrated circuit package contains an integrated circuit device mounted to a surface of the package. A flat frame is placed on the package surface and...
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6355985 |
Integrated circuit device and synchronous-link dynamic random access memory device
The present invention includes integrated circuit devices, synchronous-link dynamic random access memory devices, methods of forming an integrated circuit device and methods of forming a...
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6353256 |
IC package structure for achieving better heat dissipation
With increasing density and improving performance as well as growing function variety of the circuits integrated in a semiconductor chip, the heat dissipating capability of an IC package must be...
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6351194 |
Electronic component utilizing face-down mounting
An electronic component having a multi-layered printed circuit board made of an organic material, a plurality of electronic components mounted in a face-down position on the multi-layered printed...
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6351384 |
Device and method for cooling multi-chip modules
A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as...
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6344686 |
Power electronic component including cooling means
The power electric component comprises first and second heat transfer and electrical insulation composite structures and at least one power semiconductor circuit which has connecting terminals. The...
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6337512 |
Semiconductor module
A semiconductor module having a base element, at least one insulation element arranged on the base element, and at least one semiconductor element arranged on the insulation element. The insulation...
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