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6784539 |
Thermally enhanced semiconductor chip having integrated bonds over active circuits
An integrated circuit (IC) chip has a metal network of electrical power distribution lines which have a thermal conductance at least an order of magnitude greater than underlying thin film...
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6784536 |
Symmetric stack up structure for organic BGA chip carriers
An improved structure for an organic ball-grid array chip carrier having an organic substrate attached to a metal heat sink plate to prevent the chip carrier from warping. A supplemental organic...
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6783692 |
Heat softening thermally conductive compositions and methods for their preparation
A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in...
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6780678 |
Cooling of optoelectronic elements
Optical systems for cooling optoelectronic elements are provided. A representative optical system includes a substrate and a first optoelectronic element supported by the substrate. Additionally, a...
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6777792 |
Semiconductor device and package with high heat radiation effect
A conductive mounting board provided in a package has a recessed portion and a projecting portion, and an insulating mounting board is disposed on the recessed portion. The insulating mounting...
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6774306 |
Microelectronic connections with liquid conductive elements
A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible...
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6774482 |
Chip cooling
In an integrated circuit structure, such as in an MCM or in an SCM, a particulate thermally conductive conformable material, such as a thermal paste, is applied between a heat-generating chip and a...
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6775140 |
Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices
A method for fabricating a semiconductor device heat spreader from a unitary piece of metallic material. The metallic material is stamped to form a unitary heat spreader having an upper heat...
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6773963 |
Apparatus and method for containing excess thermal interface material
A semiconductor package is provided. The semiconductor package includes a semiconductor device supported by a substrate. The package also includes a heat spreader having a surface divided into a...
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6770967 |
Remote thermal vias for densely packed electrical assemblage
A densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating...
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6765286 |
Semiconductor integrated circuit device
A semiconductor integrated circuit card is disclosed in which such a semiconductor integrated circuit chip device comprising a substrate having a circuit pattern formed thereon, a semiconductor...
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6764773 |
Heat-dissipating substrate, method for making the same, and semiconductor device including the same
A heat-dissipating substrate is made of a composite material comprising a first composition primarily composed of aluminum and a second composition primarily composed of silicon carbide and/or...
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6765285 |
Power semiconductor device with high radiating efficiency
A discrete semiconductor device is vertically sandwiched between an upper wall of a case body and a case bottom plate to be fixed inside a case. The discrete semiconductor device is fitted in the...
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6765290 |
Arrangement for back-biasing multiple integrated circuit substrates at maximum supply voltage among all circuits
A diode coupling-based arrangement back-biases each of the semiconductor substrates of a plurality of integrated circuits at the maximum (e.g., most negative) DC voltage applied to any individual...
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6762491 |
Power semiconductor device
The present invention is to provide a power semiconductor device including a heat radiator having a principal surface and an insulating substrate bonded on the principal surface of the heat...
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6756665 |
Integrated circuit package structure with heat dissipating design
An integrated circuit (IC) package structure with heat dissipation design. The IC chip is disposed on a package substrate and a power ring structure surrounds the chip. Due to the relatively large...
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6756684 |
Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same
A FCBGA (flip-chip ball grid array) semiconductor package with a heat-dissipating device and a method for fabricating the same are provided. At least a chip is mounted on a substrate in a flip-chip...
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6756669 |
Heat spreader with down set leg attachment feature
Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are...
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6753602 |
Semiconductor package with heat-dissipating structure and method of making the same
A semiconductor package with a heat-dissipating structure and a method for making the same are proposed. The heat-dissipating structure includes a heat sink and a plurality of solder columns,...
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6750488 |
Focal plane plate for a high-resolution camera with light-sensitive semiconductor sensors
A focal plane plate for a high-resolution camera with light-sensitive semiconductor sensors, includes an electrically nonconductive material for accommodating housed light-sensitive semiconductor...
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6750551 |
Direct BGA attachment without solder reflow
A surface mount-type microelectronic component assembly which does not physically attach the microelectronic component to its carrier substrate. Electrical contact is achieved between the...
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6737754 |
COF packaged semiconductor
A semiconductor device having a multilayer laminate that includes a thermally stable, flexible polymer film, a semiconductor die, a molding compound, and a heat dissipation member. The die has an...
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6735083 |
Porous CPU cooler
The invention is to provide a porous CPU cooler, which comprises a heat sink having a plurality of pores formed therein and therearound being in fluid communication with one another, and at least...
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6735084 |
Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink
A heat sink for electronic devices, and circuit board and plasma display panel assembly, each equipped with the heat sink. The heat sink for electronic devices, and circuit board and PDP assembly...
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6731001 |
Semiconductor device including bonded wire based to electronic part and method for manufacturing the same
Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts...
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6724081 |
Electronic assembly
A replaceable integrated circuit device which replaces the connecting socket, the interposer and the pins in prior art with plural solder balls on the bottom of the integrated circuit package...
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6723926 |
Mounting configuration of electric and/or electronic components on a printed circuit board
A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least...
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6720581 |
Mounting plate for a laser chip in a semiconductor laser device
A method of manufacturing a semiconductor laser device includes the steps of: providing a laser chip, in which a semiconductor layer is formed on a substrate, a supporting plate which supports the...
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6720651 |
Semiconductor plastic package and process for the production thereof
A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a...
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6717253 |
Assembly package with stacked dies and signal transmission plate
An assembly package includes a substrate, a first die, at least one signal transmission plate, at least one second die, a plurality of conductive wires, and a molding compound. The first die is...
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6713864 |
Semiconductor package for enhancing heat dissipation
The present invention discloses a semiconductor package for enhancing heat dissipation. Only the structures of the semiconductor package that conventionally located in one of the two parts of the...
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6713865 |
Semiconductor device having semiconductor element housed in packed with heat sink
A high power semiconductor device comprising a heat sink on which a semiconductor element is mounted, and a sidewall which is attached onto the heat sink and which surrounds the semiconductor...
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6713793 |
Field effect transistor structure with bent gate
An inexpensive and small-sized semiconductor device with high power output performance includes a semiconductor substrate; an active region on the semiconductor substrate; first and second channel...
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6713862 |
Low temperature co-fired ceramic-metal packaging technology
Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic...
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6713792 |
Integrated circuit heat sink device including through hole to facilitate communication
A method of manufacturing a printed circuit board through-hole connection includes forming a through-hole by removing material from the first side of the printed circuit board until the backing and...
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6710443 |
INTEGRATED CIRCUIT PROVIDING THERMALLY CONDUCTIVE STRUCTURES SUBSTANTIALLY HORIZONTALLY COUPLED TO ONE ANOTHER WITHIN ONE OR MORE HEAT DISSIPATION LAYERS TO DISSIPATE HEAT FROM A HEAT GENERATING STRUCTURE
In one embodiment, an integrated circuit includes a heat generating structure within a dielectric region and one or more substantially horizontally arranged heat dissipation layers within the...
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6707138 |
Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe
A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first...
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6707168 |
Shielded semiconductor package with single-sided substrate and method for making the same
A semiconductor chip package is disclosed. The package includes a substrate, a metallization layer formed on one side of the substrate and a semiconductor die mounted on the substrate. The...
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6704201 |
Power feed and heat dissipating device for power semiconductor devices
In an electric circuit using a plurality of power semiconductor devices 1 , the power semiconductor devices have heat radiation metallic parts 5 to which the electrodes in the power...
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6700188 |
Low-pin-count chip package having concave die pad and/or connections pads
A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip wherein the die pad and the...
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6699571 |
Devices and methods for mounting components of electronic circuitry
Devices and methods for mounting components of electronic circuitry and these mounting devices are capable of surviving repeated thermal cycling. The devices comprise two metal laminate members...
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6696643 |
Electronic apparatus
An electronic apparatus, which is inexpensive, has high packaging density, and has superior heat dissipating characteristics and reliability is provided. The electronic apparatus is provided with...
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6693350 |
Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
A semiconductor device includes a first conductive member, a second conductive member, a semiconductor chip, which is located between the conductive members, a bonding member, which is located...
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6690087 |
Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base
A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed...
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6683639 |
Printhead for an image-forming apparatus and an image-forming apparatus containing the same
A printhead for an image-forming apparatus, including a substrate, a row of light-emitting elements disposed on a first side of the substrate, and a cooling element disposed on a second side of the...
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6677669 |
Semiconductor package including two semiconductor die disposed within a common clip
A co-package semiconductor device including an outer clip in the form of a metal can includes also two semiconductor dies, at least one of which uses the outer clip as an electrical connector. An...
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6677673 |
Clamping assembly for high-voltage solid state devices
A clamping assembly for use in conjunction with high voltage solid state devices. The clamping assembly includes a clamp frame having upper and lower clamping plates substantially composed of...
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6673655 |
Method of making semiconductor device having improved heat radiation plate arrangement
In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the...
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6674160 |
Multi-chip semiconductor device
There is provided a semiconductor device including (a) a package comprised of a base, a sidewall standing on the base at a periphery of the base, and a cover mounted over the sidewall, the base,...
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6667191 |
Chip scale integrated circuit package
An integrated circuit package including a silicon wafer, a plate of intermetallic compound fixed to the back surface of the silicon wafer and a plurality of solder ball contacts. The solder ball...
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