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9040360 Methods of manufacture of bottom port multi-part surface mount MEMS microphones  
Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone...
9041192 Hybrid thermal interface material for IC packages with integrated heat spreader  
Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first...
9041191 Power semiconductor package  
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device...
9041182 Semiconductor package and method of manufacturing the same  
A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side...
9024432 Bottom port multi-part surface mount MEMS microphone  
A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to...
9023689 Top port multi-part surface mount MEMS microphone  
A top-port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the...
9018755 Joint structure and semiconductor device storage package  
A joint structure includes: a ceramic member; a metallized layer formed on a surface of the ceramic member; and a metal member joined to the metallized layer via a brazing material. The metal...
9018747 Optical semiconductor apparatus  
An optical semiconductor apparatus includes a lid body bonded to an upper surface of a frame body, the lid body having an opening at a position vertically overlapping with an optical semiconductor...
9013036 Sealing member and electronic device using the same  
A sealing member is disclosed, which includes a first structure and a second structure. The first structure includes a groove with an opening towards the outside of the sealing member, wherein the...
9006868 Encapsulation of an MEMS component and a method for producing said component  
The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on...
9006880 Top port multi-part surface mount silicon condenser microphone  
The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount...
8946886 Shielded electronic component package and method  
An electronic component package includes a substrate having a first surface, an electronic component mounted to the substrate, traces on the first surface, a terminal on the first surface, and a...
8872331 Semiconductor device and method for manufacturing the same  
A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge...
8866289 Bonding process and bonded structures  
A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops....
8853547 Flexible printed board  
A flexible printed circuit board, in particular for the spatial connection of electronic components, includes a carrier foil (1), several bonding surfaces (10) arranged on a solder side (4) of the...
8847383 Integrated circuit package strip with stiffener  
An integrated circuit package strip employs a stiffener layer that houses a passive electronic component to maintain mechanical properties when a thinner substrate is used. The use of either a...
8829667 Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same  
An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad....
8829668 Electronic device  
There is provided an electronic device in which the deterioration of the device is prevented and an aperture ratio is improved without using a black mask and without increasing the number of...
8816485 Methods and materials useful for chip stacking, chip and wafer bonding  
Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds...
8816493 Semiconductor device  
A semiconductor device includes: a substrate; a semiconductor element on the substrate; an interconnection on the substrate and electrically connected to the semiconductor element; a window frame...
8796697 Semiconductor device including transistor chips having oblique gate electrode fingers  
A semiconductor device includes: a package; an input matching circuit and an output matching circuit in the package; and transistor chips between the input matching circuit and the output matching...
8786107 Semiconductor module  
A semiconductor module includes a semiconductor having a semiconductor substrate, a first electrode formed on one surface of the semiconductor substrate, and a second electrode formed on an...
8765530 Methods of manufacture of top port surface mount silicon condenser microphone packages  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8754519 Package for housing semiconductor element and semiconductor device using the same  
According to one embodiment, a package for housing semiconductor element includes: a base plate including a top surface and a recessed portion formed as a downwardly-recessed portion of the top...
8742569 Semiconductor package configured to electrically couple to a printed circuit board and method of providing same  
In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first...
8729695 Wafer level package and a method of forming a wafer level package  
In an embodiment, a wafer level package may be provided. The wafer level package may include a device wafer including a MEMS device, a cap wafer disposed over the device wafer, at least one first...
8704361 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process  
A sealing glass, a sealing material, and a sealing material paste, which suppress metal deposition by reducing glass components (metal oxides) without decreasing the reactivity with and the...
8704360 Top port surface mount silicon condenser microphone package  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8698287 Semiconductor device  
A semiconductor device, in which a control circuit board is mountable outside a sheath case and a power semiconductor element is placeable inside the sheath case, includes a metal step support, a...
8697490 Flip chip interconnection structure  
A flip chip interconnection structure is formed by mechanically interlocking joining surfaces of a first and second element. The first element, which may be a bump on an integrated circuit chip,...
8674498 MEMS package and method for the production thereof  
An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich...
8652883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8629552 Top port multi-part surface mount silicon condenser microphone package  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8629005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8624386 Bottom port multi-part surface mount silicon condenser microphone package  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8623709 Methods of manufacture of top port surface mount silicon condenser microphone packages  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8624387 Top port multi-part surface mount silicon condenser microphone package  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8624384 Bottom port surface mount silicon condenser microphone package  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8624385 Top port surface mount silicon condenser microphone package  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8623710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8617934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages  
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number...
8598701 Semiconductor device  
A semiconductor device has high reliability which suppresses a temperature rise of a set housing within an allowable range, and avoids an effect on a wiring on a package substrate due to thermal...
8592959 Semiconductor device mounted on a wiring board having a cap  
A semiconductor device includes a semiconductor element, a wiring board including a conductor portion formed on a first surface thereof on which the semiconductor element is mounted, the conductor...
8581239 Package structure and semiconductor structure thereof  
A semiconductor structure comprises a carrier, a plurality of under bump metallurgy layers, a plurality of copper containing bumps and an organic barrier layer, wherein the carrier comprises a...
8575748 Wafer-level packaging with compression-controlled seal ring bonding  
A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a...
8564123 Chip package and fabrication method thereof  
A chip package and a fabrication method thereof are provided according to an embodiment of the invention. The chip package contains a semiconductor substrate having a chip. A packaging layer is...
8558371 Method for wafer level package and semiconductor device fabricated using the same  
Provided is a wafer level packaging method and a semiconductor device fabricated using the same. In the method, a substrate comprising a plurality of chips is provided. An adhesive layer is formed...
8546936 Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package  
A substrate surface of a semiconductor package, comprising: a plurality of product forming areas to provide mounting spaces of semiconductor chips. The substrate surface also comprises a plurality...
8541891 Semiconductor device  
A semiconductor device having a first rectangular chip on which wires, electrode pads and chip mounting area are provided, a first dame formed on the first rectangular chip around the electrode...

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