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7676915 |
Process for manufacturing an LED lamp with integrated heat sink
A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so...
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7679918 |
LED element and printed circuit board with the same
Disclosed is a printed circuit board (PCB) comprising at least one light emitting diode (LED) element and a PCB body. The LED comprises a heat sink, a light emitting body and two base feet, each...
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7679913 |
Memory module assembly and heat sink thereof
A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat...
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7671466 |
Semiconductor package having heat dissipating device with cooling fluid
A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted...
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7663212 |
Electronic component having exposed surfaces
An electronic component includes at least one vertical MOSFET device, a leadframe and a contact clip. A source electrode and gate electrode are provided on a lower surface of the MOSFET device and...
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7663227 |
Liquid metal thermal interface material system
A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic...
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7663230 |
Methods of forming channels on an integrated circuit die and die cooling systems including such channels
A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.
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7656016 |
Power semiconductor device
One of the aspects of the present invention is to provide a power semiconductor device, which includes at least one pair of power modules, each of which has a molding surface covered with molding...
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7656028 |
System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic device
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing...
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7656024 |
Chip module for complete power train
A chip module is disclosed. It includes a circuit substrate, a semiconductor die comprising a power transistor mounted on the circuit substrate, and a passive electronic component. The passive...
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7652358 |
Semiconductor device including main substrate and sub substrates
A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device...
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7652371 |
Semiconductor package
A semiconductor package is provided with a package main body including a base portion configured by joining thin plates integrally, and a semiconductor device accommodating portion provided on one...
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7652372 |
Microfluidic cooling of integrated circuits
A microchannel cooling system used to cool integrated circuits may include a number of microchannels which may be subject to bubble blockage. When bubble formation or nucleation occurs due to...
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7649253 |
Semiconductor device
A semiconductor device 1 includes a substrate 10, a semiconductor chip 20 (first semiconductor chip), semiconductor chips 30 (second semiconductor chips) and a heat sink 40. Semiconductor...
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7642638 |
Inverted lead frame in substrate
A semiconductor package, and method of making a semiconductor package, with a plurality of dies, wherein one die is attached to an inverted lead frame and another die is attached to a substrate....
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7642644 |
Packaging for high power integrated circuits
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing...
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7636241 |
Heat dissipating device
A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block...
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7635916 |
Integrated circuit package with top-side conduction cooling
An IC package that employs top-side conduction cooling. The IC package has a low thermal resistance between a substrate housed within the package and the lid of the package. Thermal resistance is...
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RE41039 |
Stackable chip package with flex carrier
A stackable integrated circuit chip package comprising a flex circuit. The flex circuit itself comprises a flexible substrate having opposed, generally planar top and bottom surfaces. Disposed on...
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7633152 |
Heat dissipation in integrated circuits
The present invention provides an integrated circuit and method of manufacture therefore. The integrated circuit, in one embodiment, includes heat conducting elements located proximate a plurality...
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7632717 |
Plastic overmolded packages with mechancially decoupled lid attach attachment
The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.
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7629684 |
Adjustable thickness thermal interposer and electronic package utilizing same
An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively...
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7629682 |
Wafer level package configured to compensate size difference in different types of packages
A wafer level package including a semiconductor chip having a plurality of bonding pads on a front surface thereof; a lower insulation layer formed on the semiconductor chip to expose the bonding...
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7629203 |
Thermal interface material for combined reflow
A combined thermal interface material and second layer interconnect reflow material and method are disclosed.
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7626251 |
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
A microelectronic die assembly. The die assembly includes a microelectronic die, and a thermally conductive element attached to the backside of the die with a thermal interface material. The...
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7626259 |
Heat sink for a high capacity thin module system
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
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7623349 |
Thermal management apparatus and method for a circuit substrate
The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a...
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7618575 |
Method for wafer scale molding of protective caps
A method of molding provides two molds ( 102, 104 ) formed of semiconductor material. The molds ( 102, 104 ) have substantially planar working faces ( 108, 110 ) into which recesses ( 106, 112 )...
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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength
Disclosed is a structure and method for forming a structure including a SiCOH layer having increased mechanical strength. The structure includes a substrate having a layer of dielectric or...
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7615862 |
Heat dissipating package structure and method for fabricating the same
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second...
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7615861 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the...
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7612446 |
Structures to enhance cooling of computer memory modules
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at...
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7609523 |
Memory module assembly including heat sink attached to integrated circuits by adhesive and clips
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either...
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7608923 |
Electronic device with flexible heat spreader
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat...
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7608485 |
Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
In a circuit, an integrated circuit package and methods for attaching integrated circuit dies or discrete power components to flanges of integrated circuit packages, each of the integrated circuit...
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7608917 |
Power semiconductor module
A power semiconductor module and an inverter apparatus in which a device or a joining part is not mechanically damaged even when the temperature in use becomes a high temperature in the range of...
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7608915 |
Heat dissipation semiconductor package
A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is...
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7605465 |
Semiconductor device for high frequency power amplification
A semiconductor device includes, a metal base plate, a semiconductor element mounted on the base plate, first and second dielectric plates are mounted on the base plate in the vicinity of the...
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7606038 |
Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure
A first surface of a double-sided printed circuit board has a soldering land for heat radiation, which serves as a mounting surface for an electronic part. A land for solder absorption is formed on...
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7598535 |
Light-emitting diode assembly and method of fabrication
An LED assembly includes a packaged LED module ( 30 ) and a heat dissipation device ( 50 ). The LED module includes at least an LED die therein and a plurality of conductive pins ( 32, 34 )...
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7596477 |
Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method
The present invention provides a peel strength simulating apparatus which simulates peel strength between a semiconductor integrated circuit chip and a resin package bonded to each other. The...
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7593228 |
Technique for forming a thermally conductive interface with patterned metal foil
A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive...
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7589969 |
Folding protective cover for heat-conductive medium
A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7586191 |
Integrated circuit apparatus with heat spreader
An integrated circuit apparatus with heat removal has an electrical interconnection network. The electrical interconnection network has a plurality of electrically and thermally conductive vias in...
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7586179 |
Wireless semiconductor package for efficient heat dissipation
Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides...
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7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof
The invention of the present application provides a heat radiation structure of a semiconductor device, and includes a substrate having, on a surface thereof, a first area on which the...
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7579675 |
Semiconductor device having surface mountable external contact areas and method for producing the same
A semiconductor device having surface-mountable external contact areas and a method for producing the same is disclosed. The surface-mountable external contacts are arranged as flat external...
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7579687 |
Circuit module turbulence enhancement systems and methods
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
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