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Match Document Document Title
8174112 Integrated circuit device with low capacitance and high thermal conductivity interface  
An integrated circuit device includes an integrated circuit formed in a semiconductor die and an integrated circuit package containing the semiconductor die. The integrated circuit package includes...
8174832 Structure of heat dissipation substrate for power light emitting diode (LED) and a device using same  
A structure of a heat dissipation substrate of power LEDs and a device made by using the same overcomes drawbacks such as complex structure of power LEDs, strict manufacturing process, low...
8174027 Semiconductor light emitting device and method for manufacturing same  
A semiconductor light emitting device, includes: a substrate including a first major surface and a second major surface, the first major surface including a recess and a protrusion, the second...
8174113 Methods of fabricating robust integrated heat spreader designs and structures formed thereby  
Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed...
8168997 Light emitting diode package  
Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum...
8164182 Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip  
A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor...
8159000 LED package having an array of light emitting cells coupled in series  
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body....
8154873 Heat dissipation device for memory module  
A heat dissipation device removing heat from a memory module includes two conducting plate clipping the memory module and an elastic member. Each conducting plate includes a lower part and an upper...
8154116 Layered chip package with heat sink  
A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top...
8154871 Cooling structure of electronic device  
According to one embodiment, a cooling structure includes a first heat radiating member receiving heat generated by a first heat generating body, and including a plurality of first heat radiating...
8148805 Forming compliant contact pads for semiconductor packages  
In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes...
8148747 Semiconductor chip assembly with post/base/cap heat spreader  
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and...
8148812 Thermal resistor, semiconductor device using the same, and electric device  
A thermal resistor is a metal body having a contact surface to be partially in contact to form a void and is electrically conductive as a whole. The thermal body may be a layered body having a...
8138597 Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer  
A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first...
8134231 Semiconductor chip and semiconductor device  
A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating...
8134077 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Heat dissipating circuit board and method of manufacturing the same  
Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including...
8129742 Semiconductor chip assembly with post/base heat spreader and plated through-hole  
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a...
8125076 Semiconductor package system with substrate heat sink  
A semiconductor package system is provided including: providing a substrate having substrate wiring and a cavity provided therein with a heat sink foil closing off the cavity; attaching a...
8125077 Package with heat transfer  
A semiconductor package includes an encapsulant, a semiconductor device within the encapsulant, and one or more terminals for electrically coupling the semiconductor device to a node exterior to...
8125075 Carbon nanotube micro-chimney and thermo siphon die-level cooling  
A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die.
8120170 Integrated package circuit with stiffener  
An integrated circuit package employs a stiffener layer that houses a passive electronic component to maintain mechanical properties when a thinner substrate is used. The use of either a retention...
8115303 Semiconductor package structures having liquid coolers integrated with first level chip package modules  
Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid...
8115301 Methods for manufacturing thermally enhanced flip-chip ball grid arrays  
Methods for fabricating flip-chips are disclosed. In an exemplary method, a flip-chip is mounted, active-surface downward, onto a substrate such that a back-side of the flip-chip is facing upward...
8115291 Semiconductor package  
Provided is a semiconductor package including a first substrate including a first substrate pad and a second substrate pad spaced apart from each other, first semiconductor chips stacked on the...
8106501 Semiconductor die package including low stress configuration  
A semiconductor die package. The semiconductor die package comprises a semiconductor die and a molded clip structure comprising a clip structure and a first molding material covering at least a...
8102047 Load driving device  
A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power...
8097814 Printed circuit board and method of manufacturing the same  
A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover...
8089146 Semiconductor device and heat radiation member  
A semiconductor device includes a semiconductor element mounted on a substrate; at least one electronic part arranged around the semiconductor element; and a heat radiation member bonded to a...
8089085 Heat sink base for LEDS  
An LED assembly can include a heat sink base, at least one LED die attached to the heat sink base, and a lens. One or more layers of phosphor can be formed upon the lens. A heat sink, such as a...
8084856 Thermal spacer for stacked die package thermal management  
In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated...
8081460 Liquid-cooled heat radiator  
A liquid-cooled heat radiator 1 includes a heat radiation base 2 having a cooling-liquid channel 5, and an expansion tank 7 provided on the heat radiation base 2. The expansion tank 7 has a tank...
8080870 Die-warpage compensation structures for thinned-die devices, and methods of assembling same  
A back-side lamination (BSL) is applied after thinning a microelectronic die. The BSL is configured to be a thermal-expansion complementary structure to a metal wiring interconnect layout that is...
8080866 3-D integrated semiconductor device comprising intermediate heat spreading capabilities  
In a three-dimensional chip configuration, a heat spreading material may be positioned between adjacent chips and also between a chip and a carrier substrate, thereby significantly enhancing heat...
8076772 Printed circuit board, memory module having the same and fabrication method thereof  
A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are...
8076771 Semiconductor device having metal cap divided by slit  
In order to reduce a thermal stress applied by a metal cap to a semiconductor chip: a semiconductor chip (2) is bonded to a flat portion (11) of a metal cap (1); side wall portions of the metal cap...
8077466 Heat sink, semiconductor device, and method of manufacturing heat sink  
A heat sink 109 is configured by a plate component having a combined structure composed of a recess and a projection formed thereon, wherein the recess is formed by allowing a part of the plate...
8071997 LED with light transmissive heat sink  
An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second...
8064202 Sandwich structure with double-sided cooling and EMI shielding  
A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a...
8062933 Method for fabricating heat dissipating package structure  
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; an encapsulant formed on the chip carrier and for...
8058724 Holistic thermal management system for a semiconductor chip  
Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and...
8053872 Integrated shield for a no-lead semiconductor device package  
The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one...
8053814 On-chip embedded thermal antenna for chip cooling  
An apparatus comprises a first layer within a semiconductor chip having active structures electrically connected to other active structures and having electrically isolated first inactive...
8050054 Electronic device with a base plate  
A base plate for a heat sink comprises a cooling plate and spacer elements, which are arranged on the surface of the cooling plate. The spacer elements and the cooling plate are made as one piece...
8044427 Light emitting diode submount with high thermal conductivity for high power operation  
This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described,...
8030758 Semiconductor module and method for fabricating semiconductor module  
A semiconductor module (10) includes a heat sink (1), an electronic component (2), a semiconductor device (3), and a thermally-conductive sheet member (4). The thermally-conductive sheet member (4)...
8030759 Heat conductive plate structure  
A heat conductive plate structure includes a base metal plate having a seating portion; a coupling layer disposed above the base metal plate around the seating portion; an electric conduction layer...
8030756 Plastic ball grid array package with integral heatsink  
A plastic ball grid array semiconductor package employs a metal heat spreader having supporting arms embedded in the molding cap, in which the embedded supporting arms are not directly affixed to...
8022531 Integrated circuit package system using heat slug  
An integrated circuit package system includes a substrate having an integrated circuit die thereon; a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent...
8022532 Interposer and semiconductor device  
An interposer and a semiconductor device including the interposer, which can prevent thermal warpage of an insulative substrate. The interposer is provided with a semiconductor chip in a...
8018072 Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate  
A semiconductor device has a substrate. A die is attached to a first surface of the substrate. A heat sink is provided having an approximately planer member and support members extending from the...
Matches 1 - 50 out of 1135 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >