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9041192 Hybrid thermal interface material for IC packages with integrated heat spreader  
Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first...
9029998 Semiconductor package device  
A semiconductor package device includes a lower package including a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package...
9018754 Heat dissipative electrical isolation/insulation structure for semiconductor devices and method of making  
An isolation structure can include a structure material with thermal conductivity greater than silicon dioxide, yet electrical conductivity such that the structure material can replace silicon...
9006891 Method of making a semiconductor device having a post-passivation interconnect structure  
A method of making a semiconductor device includes forming a passivation layer overlying a semiconductor substrate, the semiconductor substrate having a first region and a second region, wherein...
9006879 Semicondutor device package placed within fitting portion of wiring member and attached to heat sink  
The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the...
9006784 Semiconductor device and manufacturing method thereof  
A semiconductor device includes a link portion that connects a second heat sink to a third heat sink via a solder. The solder is arranged on a connecting surface of a base portion of the link...
9000580 Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with pressed baseplate  
A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the baseplate proceeding from the top side....
8994162 Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package  
A single metal layer tape substrate includes a patterned metal layer affixed to a patterned dielectric layer. The dielectric layer is patterned to provide openings exposing lands and bond sites on...
8994167 Semiconductor device  
A semiconductor device includes a plurality of semiconductor elements each having a front surface and a back surface; a front surface-side heatsink that is positioned on a front-surface side of...
8994168 Semiconductor package including radiation plate  
A semiconductor package includes a wiring board; a semiconductor chip mounted on the wiring board; and a radiation plate mounted on the semiconductor chip, including an insulating member including...
8981547 Stub minimization for multi-die wirebond assemblies with parallel windows  
A microelectronic assembly 5 can include first and second microelectronic packages 10a, 10b mounted to respective first and second opposed surfaces 61, 62 of a circuit panel 60. Each...
8981554 Semiconductor package having heat spreader and method of forming the same  
A lower package includes a semiconductor chip. A first upper package and a second upper package are disposed on the lower package. A heat spreader is disposed on the lower package. The heat...
8970028 Embedded heat spreader for package with multiple microelectronic elements and face-down connection  
A microelectronic package includes a substrate, first and second microelectronic elements, and a heat spreader. The substrate has terminals thereon configured for electrical connection with a...
8970029 Thermally enhanced heat spreader for flip chip packaging  
A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first...
8963317 Thermal dissipation through seal rings in 3DIC structure  
A package includes a die, which includes a semiconductor substrate, a plurality of through-vias penetrating through the semiconductor substrate, a seal ring overlapping and connected to the...
8963320 Integrated circuit packaging system with thermal structures and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a thermal attach cluster includes: forming a heat collector having a heat dissipation surface, forming a cluster...
8963303 Power electronic device  
A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control...
8953314 Passive heat sink for dynamic thermal management of hot spots  
A fully-passive, dynamically configurable directed cooling system for a microelectronic device is disclosed. In general, movable pins are suspended within a cooling plenum between an active layer...
8946888 Package on packaging structure and methods of making same  
A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first...
8946886 Shielded electronic component package and method  
An electronic component package includes a substrate having a first surface, an electronic component mounted to the substrate, traces on the first surface, a terminal on the first surface, and a...
8941234 Manufacturing process and heat dissipating device for forming interface for electronic component  
A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface...
8941225 Integrated circuit package and method for manufacturing the same  
A stacked integrated circuit package and a method for manufacturing the same are provided. The stacked integrated circuit package includes a first integrated circuit package comprising a first...
8937385 Electronic component and fabrication process of this electronic component  
An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on...
8937384 Thermal management of integrated circuits using phase change material and heat spreaders  
At least one feature pertains to an apparatus having passive thermal management that includes an integrated circuit die, a heat spreader thermally coupled to the integrated circuit die, a phase...
8933558 Semiconductor package, wiring board unit, and electronic apparatus  
A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package...
8921993 Semiconductor package having EMI shielding function and heat dissipation function  
A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow...
8916962 III-nitride transistor with source-connected heat spreading plate  
Disclosed are semiconductor devices and methods for manufacturing them. An example device may include a III-nitride stack having a front side surface and a back side surface. The III-nitride stack...
8912670 Bumpless build-up layer package including an integrated heat spreader  
An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die...
8907472 3DIC package comprising perforated foil sheet  
A structure includes a thermal interface material, and a Perforated Foil Sheet (PFS) including through-openings therein, with a first portion of the PFS embedded in the thermal interface material....
8896023 Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly  
The invention concerns a silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly. Said silicon devices/heatsinks stack assembly comprises...
8890309 Circuit module and method of producing circuit module  
A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the...
8877563 Microfabricated pillar fins for thermal management  
An electrical package with improved thermal management. The electrical package includes a die having an exposed back surface. The package further includes a plurality of fins extending outwardly...
8879264 Stacked heat dissipating module of an electronic device  
A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at...
8877566 Curvilinear heat spreader/lid with improved heat dissipation  
A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is...
8872333 System and method for integrated waveguide packaging  
A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the...
8872330 Thin-film semiconductor component and component assembly  
A thin-film semiconductor component having a carrier layer and a layer stack which is arranged on the carrier layer, the layer stack containing a semiconductor material and being provided for...
8872328 Integrated power module package  
An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the...
8866288 Semiconductor package  
Disclosed herein is a semiconductor package, including: a first heat radiating plate; a second heat radiating plate formed below the first heat radiating plate; a heat radiating lead formed above...
8859333 Integrated circuit package and a method for dissipating heat in an integrated circuit package  
An IC package that is suitable for surface mounting arrangements includes a heat spreader device that is coupled to a bottom portion of the package below the IC die. Coupling the heat spreader...
8860192 Power device having high switching speed  
An electronic device includes at least one electronic component chip having a first conduction terminal and a control terminal on a first surface of the chip and a second conduction terminal on a...
8847383 Integrated circuit package strip with stiffener  
An integrated circuit package strip employs a stiffener layer that houses a passive electronic component to maintain mechanical properties when a thinner substrate is used. The use of either a...
8837153 Power electronic device having high heat dissipation and stability  
An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink...
8836110 Heat spreader for use within a packaged semiconductor device  
A packaged semiconductor device includes a package substrate, an integrated circuit (IC) die mounted on the package substrate, and a heat spreader mounted on the package substrate. The heat...
8837150 Electronic device for switching currents and method for producing the same  
The present invention relates to an electronic device for switching currents and a method for producing such a device that is reliable and durable. Such an electronic device comprises a power...
8823170 Apparatus and method for three dimensional integrated circuits  
A structure comprises a substrate comprising a plurality of traces on top of the substrate, a plurality of connectors formed on a top surface of a semiconductor die, wherein the semiconductor die...
8815646 Semiconductor device adapted to improve heat dissipation  
A semiconductor device is formed by molding using a resin with a semiconductor element and one or two heat dissipating plates contained therein, said one or two heat dissipating plates being...
8806749 Two-phase, water-based immersion-cooling apparatus with passive deionization  
Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a...
8803313 Group III nitride based flip-chip integrated circuit and method for fabricating  
A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a...
8796843 RF and milimeter-wave high-power semiconductor device  
High-power and high-frequency semiconductor devices require high signal integrity and high thermal conductance assembly technologies and packages. In particular, wide-gap-semiconductor devices on...
8796840 Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers  
A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first...