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9082743 3DIC packages with heat dissipation structures  
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a...
9041178 Semiconductor device  
A semiconductor device including a chip stack structure having a plurality of semiconductor chips, the semiconductor chips being stacked such that they are electrically connected using...
9041192 Hybrid thermal interface material for IC packages with integrated heat spreader  
Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first...
9041196 Semiconductor module arrangement and method for producing and operating a semiconductor module arrangement  
A semiconductor module arrangement includes a semiconductor module having a top side, an underside opposite the top side, and a plurality of electrical connection contacts formed at the top side....
9035438 Semiconductor device and method for manufacturing same  
The present specification relates to a semiconductor device in which a metal plate is attached onto a surface of a resin package, and provides a structure in which the metal plate is not easy to...
9034695 Integrated thermal solutions for packaging integrated circuits  
A method includes attaching a wafer on a carrier through an adhesive, and forming trenches in the carrier to convert the carrier into a heat sink. The heat sink, the carrier, and the adhesive are...
9033515 Heat dissipation device of light engine with fan module and heat sink  
A heat dissipation device of a light engine for a projector has a housing, a fan module, a light engine and a heat sink. The light engine is positioned in the housing and connected to the heat...
9030003 Encapsulated semiconductor device and method for manufacturing the same  
An encapsulated semiconductor device includes: a first conduction path formative plate (1); a second conduction path formative plate (5) joined to the first conduction path formative plate; a...
9024433 Power semiconductor module system with undercut connection  
A semiconductor module system includes a first semiconductor module and a second semiconductor module. The first semiconductor module has a first housing and a first base plate. The second...
9013035 Thermal improvement for hotspots on dies in integrated circuit packages  
Methods and apparatuses for improved integrated circuit (IC) packages are described herein. In an aspect, an IC device package includes an IC die having a contact pad, where the contact pad is...
9001512 Heat spreader for electrical components  
A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the...
8994166 System for clamping heat sink  
A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The...
8987912 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a substrate having a conductor; a semiconductor chip disposed on the substrate and electrically connected to the conductor; a tubular electrode having one end...
8981555 Ridged integrated heat spreader  
An integrated circuit package is presented. In an embodiment, the integrated circuit package has a package substrate, an integrated circuit die attached to the package substrate, and a package...
8981554 Semiconductor package having heat spreader and method of forming the same  
A lower package includes a semiconductor chip. A first upper package and a second upper package are disposed on the lower package. A heat spreader is disposed on the lower package. The heat...
8981553 Power semiconductor module with integrated thick-film printed circuit board  
A power semiconductor module includes a first printed circuit board having a first insulation carrier, and a first upper metallization and a first lower metallization applied to the first...
8976529 Lid design for reliability enhancement in flip chip package  
In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package...
8971044 Semiconductor device  
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output...
8970029 Thermally enhanced heat spreader for flip chip packaging  
A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first...
8963317 Thermal dissipation through seal rings in 3DIC structure  
A package includes a die, which includes a semiconductor substrate, a plurality of through-vias penetrating through the semiconductor substrate, a seal ring overlapping and connected to the...
8963320 Integrated circuit packaging system with thermal structures and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a thermal attach cluster includes: forming a heat collector having a heat dissipation surface, forming a cluster...
8963313 Heterogeneous chip integration with low loss interconnection through adaptive patterning  
Integrating a semiconductor component with a substrate through a low loss interconnection formed through adaptive patterning includes forming a cavity in the substrate, placing the semiconductor...
8963315 Semiconductor device with surface electrodes  
A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a...
8962393 Integrated circuit packaging system with heat shield and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a...
8952523 Integrated circuit package lid configured for package coplanarity  
An integrated circuit package apparatus includes a packaging substrate, an integrated circuit coupled to an upper side of the packaging substrate, an array of contacts coupled to an underside of...
8952524 Re-workable heat sink attachment assembly  
A re-workable heat dissipation assembly may include a non-removable adhesive layer. A first interposer layer may be adhered to a device via the non-removable adhesive layer. A removable adhesive...
8952525 Semiconductor module and method for manufacturing semiconductor module  
A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween....
8946888 Package on packaging structure and methods of making same  
A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first...
8946871 Thermal improvement of integrated circuit packages  
An integrated circuit package comprising an active semiconductor device layer and at least one heat-transfer semiconductor layer on the active semiconductor device layer. The heat-transfer...
8946886 Shielded electronic component package and method  
An electronic component package includes a substrate having a first surface, an electronic component mounted to the substrate, traces on the first surface, a terminal on the first surface, and a...
8946887 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
3DIC packages with heat dissipation structures
 
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a...
8941996 Circuit board and heat dissipation device thereof  
A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a...
8941233 Integrated circuit package with inter-die thermal spreader layers  
Integrated circuit (IC) packages with an inter-die thermal spreader are disclosed. A disclosed IC package includes a plurality of stacked dies disposed on a package substrate. A heat spreader is...
8941230 Semiconductor package and manufacturing method  
A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the...
8932886 Power light emitting die package with reflecting lens and the method of making the same  
A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens....
8933557 Semiconductor module and cooling unit  
A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant...
8933558 Semiconductor package, wiring board unit, and electronic apparatus  
A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package...
8933560 Semiconductor device  
A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, a heat radiating plate disposed on the substrate and covering the semiconductor element, and a...
8921998 Semiconductor module  
A semiconductor module has a pair of semiconductor devices, a heat sink, a first electrode, an output electrode and a second electrode. The semiconductor devices are connected in series with each...
8922999 Heat dissipating assembly and elastic fastening member thereof  
A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly...
8921999 Semiconductor device, semiconductor device manufacturing method, semiconductor device mounting structure and power semiconductor device  
A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having...
8916966 Integrated circuit including a heat dissipation structure  
One embodiment of an integrated circuit includes a discrete device that defines a top surface, an integrated circuit substrate, and a heat dissipation structure fully covering the top surface of...
8912644 Semiconductor device and method for manufacturing same  
A semiconductor device includes an IGBT as a vertical semiconductor element provided between first, and second lead frames, in pairs, the first, and second lead frames being opposed to each other,...
8907461 Heat dissipation device embedded within a microelectronic die  
The subject matter of the present application relates to a heat dissipation device that is embedded within a microelectronic die. The heat dissipation device may be fabricated by forming at least...
8907472 3DIC package comprising perforated foil sheet  
A structure includes a thermal interface material, and a Perforated Foil Sheet (PFS) including through-openings therein, with a first portion of the PFS embedded in the thermal interface material....
8901732 Semiconductor device package and method  
Various packages and methods are disclosed. A package according to an embodiment includes a substrate, a chip attached to a surface of the substrate with electrical connectors, a molding compound...
8902589 Semiconductor module and cooler  
A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a...
8896023 Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly  
The invention concerns a silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly. Said silicon devices/heatsinks stack assembly comprises...
8897016 Heat removal in compact computing systems  
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
8896110 Paste thermal interface materials  
Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an...