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7622803 |
Heat sink assembly and related methods for semiconductor vacuum processing systems
An assembly for supporting a substrate during vacuum processing operations includes a thermally conductive heat sink tray including at least one wafer pocket recessed therein, and a thermally...
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7622802 |
Electronic device with semiconductor chip including a radiofrequency power module
An electronic device, including a radiofrequency power module, includes a cavity housing including a housing frame with plastic walls and with a metal frame including a top side and a rear side, a...
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7619259 |
Semiconductor device integrated with heat sink and method of fabricating the same
The present invention is to provide a semiconductor device which includes a mounting base and a light-emitting device. The mounting base includes a substrate of a first semiconductor material and a...
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7615862 |
Heat dissipating package structure and method for fabricating the same
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second...
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7615861 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the...
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7608923 |
Electronic device with flexible heat spreader
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat...
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7608917 |
Power semiconductor module
A power semiconductor module and an inverter apparatus in which a device or a joining part is not mechanically damaged even when the temperature in use becomes a high temperature in the range of...
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7608915 |
Heat dissipation semiconductor package
A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is...
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7608315 |
Insulator with high thermal conductivity and method for producing the same
A high thermal conduction insulator exhibiting thermal conductivity, insulating properties and heat radiating properties is produced by supplying a molding material composed of an insulating resin,...
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7606038 |
Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure
A first surface of a double-sided printed circuit board has a soldering land for heat radiation, which serves as a mounting surface for an electronic part. A land for solder absorption is formed on...
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7598535 |
Light-emitting diode assembly and method of fabrication
An LED assembly includes a packaged LED module ( 30 ) and a heat dissipation device ( 50 ). The LED module includes at least an LED die therein and a plurality of conductive pins ( 32, 34 )...
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7598119 |
System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die...
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7595993 |
Mounting structure with heat sink for electronic component and female securing member for same
A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each...
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7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
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7589402 |
Semiconductor module and manufacturing method thereof
A center of a substrate having peripheral circuit components mounted thereon is hollowed in a size maintaining a distance for establishing a connection with a semiconductor chip through a conductor...
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7586964 |
Laser package and laser module
A laser package has at least one laser device and a hermetically sealed package including a package base and a cap having a light transmissive window for emitting light. The at least one laser...
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7586191 |
Integrated circuit apparatus with heat spreader
An integrated circuit apparatus with heat removal has an electrical interconnection network. The electrical interconnection network has a plurality of electrically and thermally conductive vias in...
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7586189 |
Heat dissipation structure accommodated in electronic control device
A circuit board mounting electronic components including a heat generating element is accommodated in a casing. A heat dissipation member is disposed between the heat generating element and an...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7586125 |
Light emitting diode package structure and fabricating method thereof
A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface...
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7585702 |
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of...
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7579697 |
Arrangement for high frequency application
A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on...
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7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof
The invention of the present application provides a heat radiation structure of a semiconductor device, and includes a substrate having, on a surface thereof, a first area on which the...
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7579686 |
Thermal interface material with hotspot heat remover
The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material is described. In one embodiment, the heat spreader includes a surface having a...
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7579675 |
Semiconductor device having surface mountable external contact areas and method for producing the same
A semiconductor device having surface-mountable external contact areas and a method for producing the same is disclosed. The surface-mountable external contacts are arranged as flat external...
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7579672 |
Semiconductor package with electromagnetic shielding capabilities
A semiconductor package with electromagnetic shielding capabilities is disclosed. The semiconductor package includes a substrate ( 101 ), a plurality of semiconductor dies ( 102 ), a plurality of...
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7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid...
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7574793 |
Process of forming a laminate ceramic circuit board
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions...
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7569929 |
Semiconductor device
A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal...
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7569928 |
Assembly structure of electronic element and heat sink
An assembly structure of an electronic element and a heat sink is disclosed. An assembly structure of an electronic element and a heat sink comprises a fastening element, an electronic element...
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7569927 |
RF power transistor package
An RF power transistor package with a rectangular ceramic base can house one or more dies affixed to an upper surface of the ceramic base. Source leads attached to the ceramic base extend from at...
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7564690 |
Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material...
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7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein
A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each...
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7564124 |
Semiconductor die package including stacked dice and heat sink structures
A semiconductor package including stacked packages is disclosed. The semiconductor die package includes a first heat sink structure, a first semiconductor die attached to the first heat sink...
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7564123 |
Semiconductor package with fastened leads
A semiconductor package primarily comprises a plurality of leadframe's leads, a chip, a paddle, an adhesive and an encapsulant encapsulating the components mentioned above. The paddle has a...
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7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
A stacked die package includes a substrate ( 210, 310 ), a first die ( 220, 320 ) above the substrate, a spacer ( 230, 330 ) above the first die, a second die ( 240, 340 ) above the spacer, and a...
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7554806 |
Interface module-mounted LSI package
An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and...
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7554191 |
Semiconductor device having a heatsink plate with bored portions
A heatsink plate is to be fixed to a substrate with sufficient strength, so as to prevent the heatsink plate from being stripped off, to thereby secure reliability on the performance of the...
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7554190 |
Liquid metal thermal interface material system
A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic...
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7550839 |
Integrated circuit package and system interface
An apparatus for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low...
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7547966 |
Power semiconductor module
A power semiconductor module with its thermal resistance and overall size reduced. Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power...
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7547964 |
Device packages having a III-nitride based power semiconductor device
A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include a...
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7547922 |
Light-emitting diode assembly
A light emitting diode (LED) assembly includes at least an LED ( 102 ), a substrate ( 20 ), a heat dissipation apparatus ( 40 ) and at least one securing frame ( 30 ). The substrate forms a set of...
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7547583 |
Light emitting diode package with direct leadframe heat dissipation
A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has...
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7546943 |
Apparatus, system, and method for positioning a printed circuit board component
An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The...
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7545033 |
Low cost power semiconductor module without substrate
A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame...
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7545032 |
Integrated circuit package system with stiffener
An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle;...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7541220 |
Integrated circuit device having flexible leadframe
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an...
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7538427 |
Microchannel structure and manufacturing method therefor, light source device, and projector
A microchannel structure that has plural microchannels through which fluid flows, including: a housing section formed in a block; and a pipe array arranged in the housing section and formed by...
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