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7615861 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the...
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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength
Disclosed is a structure and method for forming a structure including a SiCOH layer having increased mechanical strength. The structure includes a substrate having a layer of dielectric or...
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7615404 |
High-contrast laser mark on substrate surfaces
As part of a first configured laser operation, a smooth, more reflective marking area is formed at a surface of a substrate (e.g., integral heat spreader, or IHS). In a second configured laser...
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7607355 |
Semiconductor device
A semiconductor device is equipped with a semiconductor sensor chip for detecting pressure variations that is arranged inside of a hollow cavity of a housing, wherein an opening is formed in a...
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7598580 |
Image sensor module package structure with supporting element
An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a...
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7598125 |
Method for wafer level packaging and fabricating cap structures
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the...
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7596850 |
Method for temporarily inactivating a wireless communication device
A wireless communication device such as a cell phone is rendered temporarily inoperable by enclosing the device in a container such as a heat sealable bag ( 1 ) which has been metallized so that...
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7595540 |
Semiconductor device and method of manufacturing the same
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
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7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a...
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7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof
The invention of the present application provides a heat radiation structure of a semiconductor device, and includes a substrate having, on a surface thereof, a first area on which the...
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7579685 |
Wafer level packaging cap and fabrication method thereof
A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on...
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7576427 |
Cold weld hermetic MEMS package and method of manufacture
A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap 410 coated with precursor weld...
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7576425 |
Conducting layer in chip package module
A conducting layer in a chip package module includes one or a plurality of through hole penetrating the top of a base being disposed at the bottom of an insulating layer in the chip package module,...
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7569926 |
Wafer level hermetic bond using metal alloy with raised feature
Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is...
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7564123 |
Semiconductor package with fastened leads
A semiconductor package primarily comprises a plurality of leadframe's leads, a chip, a paddle, an adhesive and an encapsulant encapsulating the components mentioned above. The paddle has a...
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7564111 |
Imaging apparatus
In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible...
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7560811 |
Semiconductor device
A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a...
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7557441 |
Package of MEMS device and method for fabricating the same
A package of a micro-electro-mechanical systems (MEMS) device includes a cap wafer, a plurality of bonding bumps formed over the cap wafer, a plurality of array bumps arrayed on an outer side of...
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7554189 |
Wireless communication module
A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic...
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7554136 |
Micro-switch device and method for manufacturing the same
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
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7550831 |
Electronic device and semiconductor device
An electronic device has a substrate, a conductive layer and a substrate mounted portion. The substrate has a circuit portion used from 60 GHz to 80 GHz. The conductive layer is provided directly...
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7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7541662 |
Packaging chip having inductor therein
A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a...
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7538421 |
Flip-chip package structure with stiffener
A flip-chip package structure with stiffener includes a substrate, a first stiffener positioned on a surface of the substrate, a chip having a plurality of bumps adopted to electrically connect the...
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7535097 |
Semiconductor device and method of manufacturing the same
A semiconductor device includes a semiconductor chip having at least an electrode pad and a device formed on a semiconductor layer on its surface, a seal cap having a recess portion facing the...
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7535096 |
Glass substrate and capacitance-type pressure sensor using the same
A glass substrate has a pair of main surfaces opposite to each other. Two island-shaped portions made of silicon are buried in the glass substrate. The two island-shaped portions are exposed from...
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7534653 |
Chip packaging process
A chip packaging process includes providing a wafer, having an active surface and a backside. The wafer has a first chip area and a second chip area adjacent to the first chip area. The wafer has...
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7534636 |
Lids for wafer-scale optoelectronic packages
A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the...
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7531229 |
Microstructured component and method for its manufacture
A microstructured component having a layered construction may allow implementation of component structures having a layer thickness of more than 50 μm, e.g., more than 100 μm. Capping of the...
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7528481 |
Wafer level packaging cap and fabrication method thereof
A fabrication method of a wafer level packaging cap for covering a device wafer provided with a device thereon, includes forming an insulating layer on a wafer; removing a predetermined part of the...
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7521790 |
Semiconductor device module and manufacturing method of semiconductor device module
In a module for an optical device as a semiconductor device module of the present invention, a bonding wire that electrically connects a substrate on which a conductor wiring is formed and an image...
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7521789 |
Electrical assembly having heat sink protrusions
An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its...
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7518233 |
Sealing structure for multi-chip module
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in...
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7518205 |
Semiconductor package and method for manufacturing the same
A semiconductor package has a substrate made of WCu, WAg, MoCu or MoAg. A plurality of leads are fixed to the substrate by hermetic sealing without an intervening nickel plating layer. A cover is...
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7518157 |
Optoelectronic component assembly
Optoelectronic component assemblies include a carrier element having a recess, the recess having at least one stepped supporting surface in the region of its periphery at a defined height between...
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7514718 |
LED package, manufacturing method thereof, and LED array module using the same
An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and...
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7511373 |
Cap package for micro electro-mechanical system
A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding...
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7510108 |
Method of making an electronic assembly
A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic...
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7508065 |
Device package and methods for the fabrication and testing thereof
Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b)...
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7508064 |
Package for sealing an integrated circuit die
A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or...
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7508063 |
Low cost hermetically sealed package
Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the...
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7508056 |
Surface mount hermetic package for power semiconductor die
A hermetically sealed AlN housing for power semiconductor die has a rectangular bottom surrounded by a peripheral wall. Spaced conductive plating sections on the top of the bottom section are...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7498673 |
Heatplates for heatsink attachment for semiconductor chips
An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid...
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7495333 |
Seal cover structure comprising a nickel-tin (Ni—Sn) alloy barrier layer formed between a nickel (Ni) plating layer and a gold-tin (Au—Sn) brazing layer having Sn content of 20.65 to 25 WT % formed on the seal cover main body
A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises:...
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7492040 |
Glass lid, and package provided with such a lid, for the encapsulation of electronic components
The encapsulation lid comprises at least two glass layers of different compositions, a first layer called the bottom layer, which is continuous, and at least a second layer, which is discontinuous...
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7489033 |
Electronic assembly with hot spot cooling
A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs...
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7485956 |
Microelectronic package optionally having differing cover and device thermal expansivities
A microelectronic package is provided that includes a microelectronic device and a cover. The device and the cover are typically substantially immobilized relative to each other. The cover...
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