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6683795 |
Shield cap and semiconductor package including shield cap
A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for...
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6680528 |
Electronic component and electronic equipment using the same
An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the...
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6674159 |
Bi-level microelectronic device package with an integral window
A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed...
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6674160 |
Multi-chip semiconductor device
There is provided a semiconductor device including (a) a package comprised of a base, a sidewall standing on the base at a periphery of the base, and a cover mounted over the sidewall, the base,...
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6664624 |
Semiconductor device and manufacturing method thereof
A source electrode, a gate electrode, and a drain electrode formed on a front face active region of a semiconductor substrate in a shape of teeth of a comb are covered with an insulating film such...
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6661089 |
Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same
Disclosed is a semiconductor package which has no resinous flash formed on a lead frame and its manufacturing method. The method includes the steps of preparing a lead frame having a first surface...
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6661084 |
Single level microelectronic device package with an integral window
A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed...
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6661090 |
Metal adhesion layer in an integrated circuit package
In one embodiment, an integrated circuit packaging structure includes a first metal adhesion layer formed under a lid and a second metal adhesion layer formed over a substrate. The lid includes a...
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6657303 |
Integrated circuit with low solubility metal-conductor interconnect cap
An integrated circuit and manufacturing method therefor is provided having a semiconductor substrate with a semiconductor device. A device dielectric layer formed on the semiconductor substrate. A...
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6657246 |
MRAM with an effective noise countermeasure
In a magnetic random access memory having a memory device portion ( 33,34,35 ) using magnetic material, a high-frequency current suppressor ( 26 ) is arranged in the vicinity of the magnetic...
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6653730 |
Electronic assembly with high capacity thermal interface
To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a...
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6639150 |
Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the same
A hermetic package for an electronic device, such as a surface acoustic wave (SAW) device and a method of manufacturing the same. In one embodiment, the package includes: (1) a device substrate...
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6639305 |
Single layer surface mount package
A single layer surface mount package suitable for use with a high frequency microelectronic device includes a lead frame partially embedded in a dielectric material and a lid. The dielectric...
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6639313 |
Hermetic seals for large optical packages and the like
A MEMS product, particularly an optical MEMS product, and seal therefor. A housing member forms a cavity; a MEMS device is disposed in the cavity; a cap member (which may be an optical window) is...
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6632997 |
Personalized circuit module package and method for packaging circuit modules
A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a...
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6630727 |
Modularly expandable multi-layered semiconductor component
A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and...
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6627966 |
Method and device for sealing ceramic package of saw filter
In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer...
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6627987 |
Ceramic semiconductor package and method for fabricating the package
A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a...
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6624921 |
Micromirror device package fabrication method
A window is mounted directly to an upper surface of a micromirror device chip. More particularly, the window is mounted above a micromirror device area on the upper surface of the micromirror...
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6621163 |
Electronic device having an electronic component with a multi-layer cover, and method
An electronic device includes an electronic component 2, 3, such as a SAW (=Surface Acoustic Wave) filter 2, 3 having connection areas 4, 5. The filter 2, 3 is sealed off from the...
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6621161 |
Semiconductor device having a package structure
A semiconductor device comprises a first plate-like base substrate having a substantially rectangular extrapolated outer shape in a plane parallel to the primary surface thereof, and the first...
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6614108 |
Electronic package and method therefor
An electronic package and a method for packaging an electronic component, particularly a shock-sensitive component such as a yaw rate sensor or an accelerometer mounted to a circuit board. The...
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6611054 |
IC package lid for dose enhancement protection
An integrated circuit package for use in radiation environments includes a base for receiving an integrated circuit die and has a peripheral surface for receiving a lid. The lid has an inner...
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6596117 |
Method for fabricating a sealed-cavity microstructure
The present invention provides a sealed-cavity miscrostructure and an associated method for manufacturing the microstructure. Specifically, the microstructure of the present invention includes...
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6593651 |
Terminals for multi-layer devices
A multi-layer device with a lid, a core, and a base. The lid has a first terminal and a second terminal, and an inner surface with a first insulator. The core has a first surface bonded to the...
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6590269 |
Package structure for a photosensitive chip
A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is...
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6586845 |
Semiconductor device module and a part thereof
A semiconductor device module includes one or a plurality of semiconductor devices, each including a semiconductor element having first and second surfaces, pads formed on the first surface on...
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6586279 |
Method of integrating a heat spreader and a semiconductor, and package formed thereby
A method of integrating a heat spreader into a semiconductor package includes depositing an adhesion metal layer on the back of a wafer at low temperature. A heat transfer metal layer is...
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6586831 |
Vacuum package fabrication of integrated circuit components
A vacuum package for integrated circuit devices includes a sealing ring having multiple control spacers of uniform thickness distributed around the sealing ring. The sealing ring is in a designated...
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6576993 |
Packages formed by attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned...
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6570250 |
Power conditioning substrate stiffener
Utilization of the “dead space” previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as de-coupling...
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6566745 |
Image sensor ball grid array package and the fabrication thereof
The present invention is related to an image sensor packaging technique based on a Ball Grid Array (BGA) IC packaging technique, further referred to as image sensor ball grid array (ISBGA). A...
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6566748 |
Flip-chip semiconductor device having an improved reliability
A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein...
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6566742 |
Structure for mounting components
An acceleration sensor is disclosed which includes a capacitance-type acceleration detection element mounted on a ceramic base plate. The element comprises a movable electrode mounted between a...
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6559535 |
Lead structure for sealing package
A sealing package for an integrated circuit chip including a lead structure with first lead members and second lead members. The first lead members are located proximate the corners of the sealing...
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6555904 |
Electrically shielded glass lid for a packaged device
A packaged device includes a package substrate and a plurality of optical structures formed on a semiconductive substrate and positioned on the package substrate, forming an active area. The...
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6552428 |
Semiconductor package having an exposed heat spreader
A semiconductor package with an exposed heat spreader includes a substrate having a semiconductor chip adhered to a first surface of the substrate. The heat spreader includes an upper portion, a...
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6548889 |
Hydrogen getter for integrated microelectronic assembly
Disclosed are a packaging component for packaging a microelectronic (e.g., III-V semiconductor) device, the packaged microelectronic device, and methods for manufacture thereof. The component has...
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6548893 |
Apparatus and method for hermetically sealing and EMI shielding integrated circuits for high speed electronic packages
An apparatus and method for hermetically sealing, EMI shielding integrated circuits for high-speed electronic devices using a combination of microstrip to buried stripline interface for signal...
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6538319 |
Semiconductor device
A semiconductor device including a substrate having a surface on which interconnections are formed, a semiconductor element connected to the interconnections and mounted on the substrate, and a...
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6538312 |
Multilayered microelectronic device package with an integral window
An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip,...
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6535388 |
Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof
A wirebonded microelectronic package including a microelectronic die attached by a back surface to a mounting surface of a recess formed in a substrate and a heat dissipation device thermally...
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6534860 |
Thermal transfer plate
A thermal transfer plate (TTP) includes a thermally conductive plate, at least one footpad and at least one reference protrusion. The footpad includes a spring zone and a standoff member. In an...
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6531770 |
Electronic part unit attached to a circuit board and including a cover member covering the electronic part
An electronic part unit comprises an electronic part body which has a semiconductor chip and a plurality of external connection electrodes electrically connected to the semiconductor chip and in...
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6528875 |
Vacuum sealed package for semiconductor chip
A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package...
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6525416 |
Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them
An electronic device is described that has a sheet strip for packaging bonding wire connections of the electronic device and a method for producing it. To that end, the sheet strip, has at least...
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6523362 |
Support for components used in microsystems technology
A support element is described which can combine components used in Microsystems technology to form a single unit. Because of the very small dimensions of the support element, it is difficult to...
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6518660 |
Semiconductor package with ground projections
A semiconductor package includes: a substrate having an upper surface and a lower surface; an integrated circuit chip having bond pads; a lid attached on the upper surface of the substrate so as to...
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6518501 |
Electronic part and method of assembling the same
An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a...
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6518659 |
Stackable package having a cavity and a lid for an electronic device
Package embodiments for housing an electronic device are disclosed, along with methods of making and interconnecting the packages. The package body may be formed of an injection molded plastic...
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