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6828680 |
Integrated circuit configuration using spacers as a diffusion barrier and method of producing such an integrated circuit configuration
In an integrated circuit configuration, above a first conductive structure which is embedded in a first insulating layer there are arranged a first barrier layer and a second insulating layer, in...
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6825066 |
Stiffener design
A stiffener for reinforcing a package integrated circuit. The stiffener includes a rigid planar element having a first surface for bonding to a package substrate. The rigid planar element forms a...
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6826053 |
Electronic device
An electronic device includes a wiring substrate, an electronic component mounted on the wiring substrate by soldering, and a case fixed to the wiring substrate so as to cover the electronic...
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6821812 |
Structure and method for mounting a small sample in an opening in a larger substrate
A process and structure for mounting a small sample in an opening in a larger substrate by using an intermediate size structure, wherein the small sample is mounted in a small opening in the...
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6822162 |
Microcircuit housing with sloped gasket
A contiguous gasket provides an electromagnetic and environmental seal between the base and lid of a microcircuit housing. The base has a flat surface that allows easy access of tools for...
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6809413 |
Microelectronic device package with an integral window mounted in a recessed lip
A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a...
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6794958 |
Method of fabricating a semiconductor device and an apparatus embodying the method
A method for fabricating an apparatus, and an apparatus embodying the same is disclosed. First a device chip having circuit elements is fabricated. Next, a cap with a cap circuit is fabricated....
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6784534 |
Thin integrated circuit package having an optically transparent window
A thin integrated circuit package having an optically transparent window provides a small profile optical integrated circuit assembly for use in digital cameras, video cellular telephones and other...
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6781248 |
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged
A method for packaging semiconductor device assemblies. An assembly is formed which includes a semiconductor die, a tape positioned over the active surface of the die, and a substrate element...
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6781231 |
Microelectromechanical system package with environmental and interference shield
A microelectromechanical system package has a microelectromechanical system microphone, a substrate, and a cover. The substrate has a surface for supporting the microelectromechanical microphone....
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6777819 |
Semiconductor package with flash-proof device
A semiconductor package with a flash-proof device is proposed, in which at least one chip and at least one passive device mounted on a substrate are covered by a flash-proof device dimensionally...
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6777263 |
Film deposition to enhance sealing yield of microcap wafer-level package with vias
A method for forming a wafer package includes forming a die structure, wherein the die structure includes a first wafer, a device mounted on the first wafer, a second wafer mounted atop the first...
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6777621 |
Flat panel display module and method of manufacturing the same
A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a...
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6774472 |
Panel structure with plurality of chip compartments for providing high volume of chip modules
A method of forming a plurality of individual semiconductor chip modules wherein a plurality of chips are placed in a plurality of chip compartments formed by adhering a support panel to the first...
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6774481 |
Solid-state image pickup device
A solid-state image pickup device in which no warp occurs in a solid-state image pickup element chip is provided. A solid-state image pickup device, including a solid-state image pickup element...
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6774465 |
Semiconductor power package module
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, is provided. The semiconductor power module includes a case; a terminal inserted...
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6765286 |
Semiconductor integrated circuit device
A semiconductor integrated circuit card is disclosed in which such a semiconductor integrated circuit chip device comprising a substrate having a circuit pattern formed thereon, a semiconductor...
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6756668 |
Semiconductor package having thermal interface material (TIM)
A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further...
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6756650 |
Lens cap for transistor outline package
A lens cap ( 40 ) for a transistor outline package includes a lens part ( 3 ) and a hollow main part ( 2 ) adapted for receiving optoelectronic components. The lens part includes a ball lens ( 30 )...
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6750397 |
Thermally enhanced semiconductor build-up package
A semiconductor build-up package includes a die, a metal carrier, and a plurality of dielectric layers. The metal carrier has a surface with a cavity for supporting the die. The surface of metal...
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6747346 |
Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device
A container for a semiconductor sensor includes a housing body and a cover. On the upper surface of the housing body outer than the pressure detection room, a groove is provided to trap the gel...
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6747350 |
Flip chip package structure
A flip chip package structure. The structure includes a substrate, an IC chip electrically connected to the substrate through a plurality of conductive bumps, encapsulant between the substrate and...
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6744131 |
Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity
An IC package provides structural rigidity to a flexible substrate, but still allows access to mounted capacitors after package assembly. In a flip chip package, the IC die is mounted face down on...
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6740972 |
Electronic device having fibrous interface
Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in...
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6740967 |
Image sensor having an improved package structure
An image sensor includes a substrate, a coating layer, a frame layer, a photosensitive chip, multiple wires, and a transparent layer. The substrate has an upper surface formed with first terminals...
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6737720 |
Packaging structure of image sensor and method for packaging the same
A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for...
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6734546 |
Micro grid array semiconductor die package
A micro grid array semiconductor die package includes a housing defining a cavity for holding at least one semiconductor die, said housing including a plurality of insulative side walls, each of...
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6734550 |
In-situ cap and method of fabricating same for an integrated circuit device
An in-situ cap for an integrated circuit device such as a micromachined device and a method of making such a cap by fabricating an integrated circuit element on a substrate; forming a support layer...
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6730991 |
Integrated circuit chip package
A package for an integrated circuit chip adapted to operate at microwave frequencies. The package includes an electrically conductive lead frame having electrical leads extending outwardly from an...
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6724080 |
Heat sink with elevated heat spreader lid
Provided is a heat sink designed to constrain warpage during thermal cycling. The heat sink is composed of a picture frame stiffener and a heat spreader lid. The stiffener has a thickness greater...
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6724078 |
Electronic assembly comprising solderable thermal interface
To accommodate high power densities associated with high performance integrated circuits, heat is dissipated from a surface of a die through a solderable thermal interface to a lid or integrated...
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6724079 |
Wire bond-less electronic component for use with an external circuit and method of manufacture
A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate ( 110, 410...
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6724061 |
Optical device and method of manufacture thereof, and electronic instrument
The invention provides an optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed so as to be spaced from the substrate, a...
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6720648 |
Electronic device
An electronic device includes a ceramic chip carrier having an opening, a SAW element chip housed in the opening, a Kovar sealing ring, which is bonded to the ceramic chip carrier by using an Ag...
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6720647 |
Semiconductor device and method of manufacturing the same
In a semiconductor device, an insulating substrate has a plurality of through holes. A plurality of conductive posts are buried in the through-holes. The conductive posts are classified to at least...
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6717258 |
Power semiconductor device
In order to provide semiconductor device modules which are capable of solving problems caused by the presence of the control board, and facilitating electric connection between power semiconductor...
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6717711 |
Structure and method for forming a high efficiency electro-optics device
A forming method and a structure of a high efficiency electro-optics device are disclosed. In the present invention, the cell-fixing surface between the die carrier and the electro-optics cell is...
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6713857 |
Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package
A stacked multi-chip semiconductor package and a fabrication method thereof are provided. A chip carrier is formed with an opening for receiving a first chip therein, and a second chip is stacked...
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6713867 |
Package for microwave components
A package for a printed circuit and a method for packaging a circuit including exposed components placed on a printed circuit, the circuit including microwave components. At least part of the...
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6706624 |
Method for making multichip module substrates by encapsulating electrical conductors
A method for making a multichip “HDI” module includes the step of making a substrate for supporting the semiconductor or solid-state chips by applying electrical conductor in a pattern to a...
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6707168 |
Shielded semiconductor package with single-sided substrate and method for making the same
A semiconductor chip package is disclosed. The package includes a substrate, a metallization layer formed on one side of the substrate and a semiconductor die mounted on the substrate. The...
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6707069 |
Light emission diode package
An LED package, made of ceramic substrates and having a reflective metal plate, has a first ceramic substrate, which has a chip mounting area on its top surface, and is provided with a...
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6707148 |
Bumped integrated circuits for optical applications
An optical integrated circuit application where the integrated circuit is packaged in a clear molding material and is attached to a printed circuit board having an aperture is described. The...
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6703704 |
Stress reducing stiffener ring
An electronic structure and associated method of formation. A laminate is solderably coupled to an electronic carrier. A stiffener is adhesively attached to a portion of a surface of the laminate...
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6700068 |
Adhesive-less cover on area array bonding site of circuit board
An apparatus, program product and method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly....
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6700138 |
Modular semiconductor die package and method of manufacturing thereof
A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the...
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6696645 |
On-wafer packaging for RF-MEMS
An RF micro-electro-mechanical system including a first silicon wafer having a top surface and a bottom surface. The top surface being opposite the bottom surface. A bore extends through the first...
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6696752 |
Encapsulated semiconductor device with flash-proof structure
An encapsulated semiconductor device includes a lead frame formed with a flash-proof body. The flash-proof body includes a dam bar formed on atop surface of the lead frame and a tape adhered to a...
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6693336 |
Intergrated circuit chip package with reduced parameter offsets
A semiconductor encapsulated package is provided with buffer chambers established through external openings aligned with stress sensitive circuitry sites, wherein the viscosity of the encapsulating...
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6693349 |
Semiconductor chip package having a leadframe with a footprint of about the same size as the chip
Methods for forming substantially chip scale packages and the resulting structures are disclosed. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a...
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