Matches 601 - 650 out of 779 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
Match Document Document Title
5596171 Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit  
A package for a semiconductor die, particularly field effect transistors, operating at very high frequencies includes a base having integrally formed conductor supports. The base and the supports...
5583373 Apparatus for achieving mechanical and thermal isolation of portions of integrated monolithic circuits  
A preferred embodiment of an integrated semiconductor device includes a semiconductor die having a hole therethrough. A paddle member includes a handle member connected between the paddle member...
5579212 Protective cover for a silicon chip device and method relating thereto  
There is disclosed a cover for protecting the leads extending between a silicon chip device and an associated printed circuit board and their electrical connections with the board. The cover is...
5574314 Packaged semiconductor device including shielded inner walls  
A semiconductor device including a metal base; a first ceramic frame bonded to the metal base; a metallization layer for I/O terminals disposed on the first ceramic frame; a second ceramic frame...
5572070 Integrated circuit packages with heat dissipation for high current load  
An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a...
5557142 Shielded semiconductor device package  
A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor...
5554824 IC package and packaging method for the same  
Plural kinds of metal wiring patterns on which a lid is to be put are formed on a package body. The wiring patterns connected to an IC chip are changed depending upon the size of the lid which is...
5543663 Semiconductor device and BGA package  
A first thermal conductive member and a plurality of second thermal conductive members are formed on one major surface of an insulating board. A TCP is mounted on the first thermal conductive...
5541451 Packaged semiconductor device with external leads having anchor holes provided at polyamide/glass sealed regions  
A semiconductor device has a semiconductor chip and a ceramic envelope consisting of a base portion and a sealing portion sealing the chip, and has good high-speed operability, radiation properties...
5539253 Resin-sealed semiconductor device  
A resin-sealed semiconductor device includes a heat sink on which a semiconductor chip is provided. An output terminal is connected to the semiconductor chip. A casing surrounds the chip and part...
5532513 Metal-ceramic composite lid  
A lightweight composite lid for a package containing a semiconductor device formed of a porous ceramic body filled with a material having a thermal conductivity greater than air.
5532514 High frequency semiconductor device  
The semiconductor device of the present invention includes a semiconductor substrate on which an integrated circuit equipped with a connection electrode is formed on its main surface. At the center...
5527992 Cavity down mounting seam-welding ceramic package for semiconductor device  
A metal cap involved in a cavity down mounting package to be subjected to a seam welding with at least a roller electrode, wherein the metal cap has a square like external shape with four corners...
5523621 Semiconductor device having a multilayer ceramic wiring substrate  
In order to set the potential of corner leads formed from a lead frame equal to that of power source leads such as ground, a multilayer wiring substrate is mounted on a mounting substrate of a...
5523586 Burn-in socket used in a burn-in test for semiconductor chips  
A burn-in socket for carrying out a burn-in test for semiconductor bare chips according to the present invention includes a chip container, a cover member, and clamp jigs for fixing the cover...
5523622 Semiconductor integrated device having parallel signal lines  
For taking a characteristic impedance matching of signal transmission lines in a package which carries thereon a semiconductor chip with a very high-speed LSI formed thereon, there is provided a...
5521436 Semiconductor device with a foil-sealed lid  
A semiconductor device includes a semiconductor substrate forming the bottom portion of a package of the device and a ceramic plate forming the upper or lid portion of the device. The substrate...
5506448 Semiconductor integrated circuit device having an improved packaging structure  
Semiconductor IC device comprises an IC chip fixed to a top surface of a carrier board having top electrodes located on a periphery of the top surface. The carrier board further includes bottom...
5504371 Semiconductor ceramic device having a ceramic element with negative temperature coefficient of resistance  
A ceramic element is formed by a rare earth and transition element oxide such as LaCoO 3 . The ceramic element is substantially isolated from the atmosphere by a case base, a case, etc.
5498900 Semiconductor package with weldable ceramic lid  
An integrated circuit package for use in radiation environments includes a base and a lid of insulative materials. The base has a recess for receiving a die and a seal ring located on the...
5497013 Semi-conductor chip having interdigitated gate runners with gate bonding pads  
A semiconductor chip having a cellular topography and a method of packaging a cellular semiconductor chip, includes plural interdigitated metal gate runners that overlie and contact selected gate...
5477009 Resealable multichip module and method therefore  
A multichip electronic module comprising a base for holding various components and a lid for sealing the module, is temporarily closed by a reworkable seal made from a thermoplastic material. The...
5477081 Semiconductor device package  
A semiconductor device package includes a semiconductor package element for containing a semiconductor chip, a lid bonded to the semiconductor package using an adhesive agent, and a cooler bonded...
5477083 Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon  
A chip carrier for a semiconductor chip, the chip having a specified thickness and lateral configuration and size. A conductive holder of the carrier has a main surface including a chip mounting...
5473191 Hybrid integrated circuit device with apertured cover  
A hybrid integrated circuit device is constructed by injecting a protective resin 10 into a ring 9 enclosing functional elements 802-804 mounted on an integrated circuit board 8, and by providing a...
5471011 Homogeneous thermoplastic semi-conductor chip carrier package  
A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid...
5468910 Semiconductor device package and method of making  
A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the...
5468999 Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding  
A ball grid array semiconductor device (10) includes a package substrate (14 or 16) having a plurality of conductive traces (18), bond posts (20), and conductive vias (22). A semiconductor die (12)...
5455457 Package for semiconductor elements having thermal dissipation means  
A package for one or a plurality of semiconductor elements comprises a package substrate, at least one semiconductor element mounted on the package substrate having an active layer in a surface...
5455456 Integrated circuit package lid  
A novel lid for sealing an encapsulant within a cavity of an integrated circuit package is disclosed herein. A ring is formed around a cavity opening, where a semiconductor die is located in an...
5451818 Millimeter wave ceramic package  
An improved millimeter wave device package design in which the package includes a dielectric substrate disposed upon a supporting base such that the substrate extends substantially along the...
5451165 Temporary package for bare die test and burn-in  
A temporary package used to test and burn-in a bare die that will fit in a board mounted socket. The package comprises a base having contacts to engage the die and provide contact to the outer...
5446316 Hermetic package for a high power semiconductor device  
A compact package and a method of hermetically packaging a high power semiconductor device includes a metal lid bonded to a ceramic base with the semiconductor device therebetween. The lid is...
5438216 Light erasable multichip module  
A multichip circuit package is formed for use with an EPROM chip. The active circuitry on the EPROM die surface is revealed. An EPROM die (14) is mounted on an insulating substrate (10). The active...
5434357 Reduced semiconductor size package  
A sealed semiconductor unit includes an electrical component within a defined area on a semiconductor material. A cover with the dimensions of the semiconductor defined area is placed over the...
5430250 Wire support and guide  
Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support...
5424920 Non-conductive end layer for integrated stack of IC chips  
An integrated stack of layers incorporating a plurality of IC chip layers has an end layer which is formed of dielectric material (or covered with such material). The outer surface of the end layer...
5422615 High frequency circuit device  
In a high frequency circuit device, inductive circuit elements constituting a matching circuit are constructed of so-called helical coils having fine metal wires wound in a hollow solenoid form,...
5416358 IC card including frame with lateral hole for injecting encapsulating resin  
An IC card includes: a circuit board on which functional components are mounted; and a frame covered with a thin plate, the circuit board being disposed in the frame, the inside of the frame being...
5414300 Lid for semiconductor package and package having the lid  
In a ceramic lid for sealing a semiconductor device mount portion of a ceramic package substrate having a semiconductor device mounted thereon, a seal layer disposed in an outer peripheral edge...
5412247 Protection and packaging system for semiconductor devices  
A protection and packaging system for a semiconductor circuit having a first planar surface and an active region on at least a portion of the planar surface. An adhesive securely bonds a protective...
5407865 Method of manufacturing a flexible metallized polymer film cover for environmental protection of electronic assemblies  
A process of manufacturing a flexible metallized polymer film cover which provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to...
5406120 Hermetically sealed semiconductor ceramic package  
A ceramic hermetic package is provided having conductive material bonded into apertures in the ceramic housing that connect with a die mounted on a thin substrate through wire and pad connections....
5387815 Semiconductor chip module  
The semiconductor chip module comprises a substrate on which a wiring portion is formed, a semiconductor chip mounted so as to face a circuit side down to the wiring portion, a heat sink with one...
5386142 Semiconductor structures having environmentally isolated elements and method for making the same  
A first semiconductor wafer having a semiconductor element such as a piezoresistive element or any integrated circuit located on a top surface thereof is bonded to a second semiconductor wafer so...
5381039 Hermetic semiconductor device having jumper leads  
A fine-pitch hermetic device (10) can be manufactured wherein two sets of wire bonds (18 & 20) are used to electrically connect a semiconductor die (12) to a leadframe (16). Jumper leads or...
5373189 Three-dimensional multichip module  
Three-dimensional multichip module. The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each...
5371408 Integrated circuit package with removable shield  
An integrated circuit package with a removable shield is disclosed. An integrated circuit having a plurality of interface leads is mounted on a TAB carrier. A removable shield fabricated from a...
5369299 Tamper resistant integrated circuit structure  
A tamper resistant structure has a pattern which covers portions of an IC but exposes other portions of the IC so that etching away the tamper resistant structure destroys the exposed portions. The...
5349234 Package and method for assembly of infra-red imaging devices  
Apparatus and a method for the packaging of semiconductor chips to simplify assembly while improving thermal dissipation from the chip and reducing stress in the chip due to differential thermal...
Matches 601 - 650 out of 779 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >