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5880524 |
Heat pipe lid for electronic packages
An apparatus for spreading the heat generated by a semiconductor device. In one embodiment, a semiconductor device, such as a CPU, is mounted to a package substrate. A cover is attached to the...
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5869903 |
Sealed semiconductor device including opposed substrates and metal wall
A semiconductor device includes a circuit substrate having a first surface on which a high-frequency circuit is located; a first metal layer disposed on a second surface of the circuit substrate;...
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5861665 |
Structure for absorption of hydrogen in a package
Disclosed is an optical and/or microelectronics hermetic package which includes a member for absorbing hydrogen from the internal package ambient. The member includes a first layer which forms a...
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5850104 |
Integral lid/clamp for high power transistor
An integral semiconductor package and mounting structure in which a lid for sealing a semiconductor chip on a platform includes flanges extending beyond the platform with the flanges having holes...
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5841189 |
Semiconductor device and manufacturing method thereof
It is an object to enhance accuracy of intervals and parallelism between signal pins and guide pins. Guide pins (5) are integrally united to outsert cases (9) made of resin to which signal pins (3)...
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5838063 |
Method of increasing package reliability using package lids with plane CTE gradients
A lid for a chip/package system includes a body sized to fit over an integrated circuit chip and being connectable to a package. The body has at least two regions exhibiting different coefficients...
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5837935 |
Hermetic seal for an electronic component having a secondary chamber
A hermetic seal for an electronic component has a cap having a base portion with laterally extending walls. The laterally extending walls define a main chamber therebetween. A cavity is formed in...
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5834839 |
Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly
A semiconductor package for preserving clearance between encapsulant and a printed circuit board is provided including a package substrate having an upper surface and a lower surface, wherein the...
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5827999 |
Homogeneous chip carrier package
A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is...
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5825086 |
Ceramic lid assembly for semiconductor packages
A ceramic lid assembly includes an integral metallized layer provided around the periphery of a ceramic lid substrate to serve as a foundation for a solder layer. A portion of the metallized layer...
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5825092 |
Integrated circuit with an air bridge having a lid
An air bridge structure 102 is formed in a cavity of a glass lid substrate. The air bridge structure is bonded to an integrated circuit in a device substrate 82 to provide an air bridge structure...
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5825085 |
Power semiconductor device, armoring case thereof and method for manufacturing the same
The present invention implements an armoring case of a power semiconductor device which can prevent cracks from occurring by inserting the terminal portion of an electrode plate in the inserting...
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5821161 |
Cast metal seal for semiconductor substrates and process thereof
The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method...
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5819402 |
Method for cooling of chips using blind holes with customized depth
The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides...
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5818699 |
Multi-chip module and production method thereof
An approximately lead-free mounting pad is formed on a first surface of a substrate having wiring circuits, and an electronic element having an approximately lead-free electrode is face-down...
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5818106 |
Semiconductor device having a capacitor formed on a surface of a closure
A semiconductor device which includes a ceramic package main body, a semiconductor element and a closure for sealing the semiconductor element in the package. A capacitor is formed on an upper or...
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5814883 |
Packaged semiconductor chip
A semiconductor device includes a substrate having a recess; a semiconductor chip disposed in the recess; a plurality of external electrodes disposed on the substrate; a lid covering the recess;...
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5814882 |
Seal structure for tape carrier package
An organic insulation film has inner leads electrically connecting a conductor thereof with an LSI chip. The inner leads are connected to pads on the periphery of the LSI chip. The connecting...
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5804870 |
Hermetically sealed integrated circuit lead-on package configuration
A hermetically sealed ceramic integrated circuit package and method for achieving same, the package including an internal lead frame attached to an integrated circuit die in a lead-on-chip...
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5805427 |
Ball grid array electronic package standoff design
A surface mount package to encapsulate one or more semiconductor devices has a standoff that maintains the thickness of solder columns bonding the package to an external circuit. The standoff...
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5792984 |
Molded aluminum nitride packages
An aluminum nitride housing is molded which includes open holes that pass through the walls. A lead frame is formed by machining or chemically milling individual leads and details therein to form...
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5793104 |
Apparatus for forming electrical connections between a semiconductor die and a semiconductor package
A semiconductor device package containing a semiconductor die uses a platform mounted on an active face of the die. The platform electrically connects to at least one bond pad on the die. A package...
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5789810 |
Semiconductor cap
A method for manufacturing a cap for use in a semiconductor package is disclosed. The semiconductor package includes a semiconductor chip and a substrate. The chip is mounted with the substrate at...
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5789811 |
Surface mount peripheral leaded and ball grid array package
A surface mounted integrated circuit die package includes a group of peripheral leads extending laterally outwardly from the perimeter of the package and also includes an array of solder balls on...
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5789809 |
Thermally enhanced micro-ball grid array package
An integrated circuit package includes a die and an electrically conductive cap attached to the top surface of the die. The die has a top surface, a bottom surface, an edge surface, a plurality of...
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5783426 |
Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same
The semiconductor device disclosed has a cap in which, at an undersurface periphery portion, a plurality of looped projections are formed for intercepting a continuous bubble path that may be...
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5781415 |
Semiconductor package and mounting method
A semiconductor package is described which is constructed from a rectangular tape film, a wiring pattern formed on the tape film constituted by wiring composed of a conductive material, a...
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5773879 |
Cu/Mo/Cu clad mounting for high frequency devices
The semiconductor package and manufacturing method thereof whereby the inexpensive package of high thermal conductivity is obtained by applying a Cu/Mo/Cu clad material for a base plate which...
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5770816 |
Planar, hermetic metal matrix housing
A hermetically sealed housing for plural GaAs chips includes a body made from Al/SiC. The body defines a peripheral seal ring support surface, an electrical connector insert support surface and an...
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5763946 |
Semiconductor device with bent electrode terminal
A container has an upper opening, a plurality of semiconductor elements and electrode terminals connected to the semiconductor elements. A cover member closing the opening has insertion holes...
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5760336 |
Burn and explosion-resistant circuit package for a varistor chip
A circuit package for a varistor chip includes a housing made of an electrical insulating and burn-resistant composition. The housing includes a surrounding wall with upright front and rear wall...
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5757072 |
Structure for protecting air bridges on semiconductor chips from damage
A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a...
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5750926 |
Hermetically sealed electrical feedthrough for use with implantable electronic devices
A thin hermetically sealed electrical feedthrough suitable for implantation within living tissue permits electrical connection between electronic circuits sealed within an hermetically sealed case...
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5744863 |
Chip carrier modules with heat sinks attached by flexible-epoxy
An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or...
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5742007 |
Electronic device package and method for forming the same
An electronic device package (10) is resistant to rupture at high temperatures. The electronic device package (10) includes a cap (14) having side-walls (18) coupled to a support structure (11) via...
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5739584 |
Multiple pin die package
A modular multi-pin package for an integrated circuit die is formed of simple standardized parts and a readily redesigned, integrated circuit specific circuit substrate possessing a design pattern...
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5734201 |
Low profile semiconductor device with like-sized chip and mounting substrate
A low profile semiconductor device (24) is manufactured by mounting a semiconductor die (26) onto a substrate (28) using an interposer (30). The interposer couples an active surface (32) of the die...
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5731542 |
Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal...
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5723904 |
Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board
A package semiconductor device comprises an insulating substrate having an upper surface formed with a plurality of connection pads and an under surface formed with a plurality of external...
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5723905 |
Semiconductor package with low strain seal
A semi-conductor packaging structure and a method to reduce the seal strain of the package are disclosed. The structure comprises a cap, substrate, seal and the cap and substrate have a...
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5710459 |
Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability
This invention is discloses a packaged integrated circuit (IC) which includes an IC chip supported and securely attached to an adapter board. The package also includes a chip cap for covering and...
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5706579 |
Method of assembling integrated circuit package
An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a...
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5703397 |
Semiconductor package having an aluminum nitride substrate
A semiconductor ceramic multilayer package comprising an aluminum nitride substrate having a semiconductor element mounted on one surface thereof and a wiring pattern electrically connected to the...
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5656864 |
Semiconductor device having upper and lower package bodies and manufacturing method thereof
A semiconductor device in which molding resin is not adhered on test pads of leads extending from a junction of an upper package half-body and a lower package half-body. The semiconductor device...
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5650593 |
Thermally enhanced chip carrier package
A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a...
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5641713 |
Process for forming a room temperature seal between a base cavity and a lid using an organic sealant and a metal seal ring
A process for manufacturing hermetically cold weld sealed package and method for sealing where a metal seal member 28 is placed along the edge of a base 36, an organic sealant 26 is placed along...
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5635672 |
Package for electronic element
The hermetically sealed package for an electronic device of the present invention comprises a body containing an electronic device therein and a covering member, such as a cap or a lid, for...
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5616956 |
Circuit substrate including insulating layer of aluminum nitride and electrically conductive layer of conductive component, aluminum nitride and other components, and semiconductor device containing same
Disclosed is a circuit substrate and a semiconductor device to which the circuit substrate is applied. The circuit substrate has an insulating layer and an electrically conductive layer. The...
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5610431 |
Covers for micromechanical sensors and other semiconductor devices
A cover for a micromechanical device through which input/output connections to the device are made. The cover includes at least two doped semiconductor standoffs supporting an insulative layer. One...
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5606200 |
Resin sealed semiconductor device with improved structural integrity
A resin sealed semiconductor device includes a metallic base plate and a covering case adhered to a peripheral section of the metallic base plate. Semiconductor elements are loaded on the metallic...
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